Findchips: Parametric Search Results for cy7c1062g30-10bgxi


Select Parts		Part Number

		CY7C1062G30-10BGXIT Cypress Semiconductor
		CY7C1062G30-10BGXI Cypress Semiconductor
		CY7C1062G30-10BGXI Infineon Technologies AG
		CY7C1062G30-10BGXIT Infineon Technologies AG

				Most Relevant					Technical										Compliance		Operating Conditions					Physical										Dimensions			Other
Composite Price	Pbfree Code	Rohs Code	Part Life Cycle Code	Memory Density	Memory Width	Organization	Supply Voltage-Nom (Vsup)	Access Time-Max	Memory IC Type	Number of Functions	Number of Words Code	Number of Words	Operating Mode	Parallel/Serial	Supply Voltage-Max (Vsup)	Supply Voltage-Min (Vsup)	Technology	Temperature Grade	JESD-30 Code	JESD-609 Code	Moisture Sensitivity Level	Operating Temperature-Max	Operating Temperature-Min	Peak Reflow Temperature (Cel)	Time@Peak Reflow Temperature-Max (s)	Number of Terminals	Package Body Material	Package Code	Package Shape	Package Style	Surface Mount	Terminal Finish	Terminal Form	Terminal Pitch	Terminal Position	Seated Height-Max	Length	Width	Ihs Manufacturer	Package Description	Reach Compliance Code	ECCN Code	HTS Code	Samacsys Manufacturer

$37.8378

Yes

Transferred

16.7772 Mbit

512KX32

3 V

10 ns

STANDARD SRAM

512000

524.288 k

ASYNCHRONOUS

PARALLEL

3.6 V

2.2 V

CMOS

INDUSTRIAL

R-PBGA-B119

85 °C

-40 °C

260

119

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

YES

TIN SILVER COPPER

BALL

1.27 mm

BOTTOM

2.4 mm

22 mm

14 mm

CYPRESS SEMICONDUCTOR CORP

BGA-119

compliant

3A991.B.2.A

8542.32.00.41

$43.2607

Yes

Transferred

16.7772 Mbit

512KX32

3 V

10 ns

STANDARD SRAM

512000

524.288 k

ASYNCHRONOUS

PARALLEL

3.6 V

2.2 V

CMOS

INDUSTRIAL

R-PBGA-B119

85 °C

-40 °C

260

119

PLASTIC/EPOXY

HBGA

RECTANGULAR

GRID ARRAY, HEAT SINK/SLUG

YES

TIN SILVER COPPER

BALL

1.27 mm

BOTTOM

2.4 mm

22 mm

14 mm

CYPRESS SEMICONDUCTOR CORP

14 X 22 MM, 2.40 MM HEIGHT, LEAD FREE, PLASTIC, BGA-119

compliant

3A991.B.2.A

8542.32.00.41

$48.0157

Yes

Active

16.7772 Mbit

512KX32

3 V

10 ns

STANDARD SRAM

512000

524.288 k

ASYNCHRONOUS

PARALLEL

3.6 V

2.2 V

CMOS

INDUSTRIAL

R-PBGA-B119

85 °C

-40 °C

260

NOT SPECIFIED

119

PLASTIC/EPOXY

HBGA

RECTANGULAR

GRID ARRAY, HEAT SINK/SLUG

YES

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

1.27 mm

BOTTOM

2.4 mm

22 mm

14 mm

INFINEON TECHNOLOGIES AG

14 X 22 MM, 2.40 MM HEIGHT, LEAD FREE, PLASTIC, BGA-119

compliant

Infineon

Check for Price

Yes

Active

16.7772 Mbit

512KX32

3 V

10 ns

STANDARD SRAM

512000

524.288 k

ASYNCHRONOUS

PARALLEL

3.6 V

2.2 V

CMOS

INDUSTRIAL

R-PBGA-B119

85 °C

-40 °C

NOT SPECIFIED

119

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

YES

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

1.27 mm

BOTTOM

2.4 mm

22 mm

14 mm

INFINEON TECHNOLOGIES AG

BGA-119

compliant

Infineon

Compare

CY7C1062G30-10BGXIT

Cypress Semiconductor

$37.8378

Yes

Transferred

16.7772 Mbit

512KX32

3 V

10 ns

STANDARD SRAM

512000

524.288 k

ASYNCHRONOUS

PARALLEL

3.6 V

2.2 V

CMOS

INDUSTRIAL

R-PBGA-B119

85 °C

-40 °C

260

119

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

YES

TIN SILVER COPPER

BALL

1.27 mm

BOTTOM

2.4 mm

22 mm

14 mm

CYPRESS SEMICONDUCTOR CORP

BGA-119

compliant

3A991.B.2.A

8542.32.00.41

CY7C1062G30-10BGXI

Cypress Semiconductor

$43.2607

Yes

Transferred

16.7772 Mbit

512KX32

3 V

10 ns

STANDARD SRAM

512000

524.288 k

ASYNCHRONOUS

PARALLEL

3.6 V

2.2 V

CMOS

INDUSTRIAL

R-PBGA-B119

85 °C

-40 °C

260

119

PLASTIC/EPOXY

HBGA

RECTANGULAR

GRID ARRAY, HEAT SINK/SLUG

YES

TIN SILVER COPPER

BALL

1.27 mm

BOTTOM

2.4 mm

22 mm

14 mm

CYPRESS SEMICONDUCTOR CORP

14 X 22 MM, 2.40 MM HEIGHT, LEAD FREE, PLASTIC, BGA-119

compliant

3A991.B.2.A

8542.32.00.41

CY7C1062G30-10BGXI

Infineon Technologies AG

$48.0157

Yes

Active

16.7772 Mbit

512KX32

3 V

10 ns

STANDARD SRAM

512000

524.288 k

ASYNCHRONOUS

PARALLEL

3.6 V

2.2 V

CMOS

INDUSTRIAL

R-PBGA-B119

85 °C

-40 °C

260

NOT SPECIFIED

119

PLASTIC/EPOXY

HBGA

RECTANGULAR

GRID ARRAY, HEAT SINK/SLUG

YES

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

1.27 mm

BOTTOM

2.4 mm

22 mm

14 mm

INFINEON TECHNOLOGIES AG

14 X 22 MM, 2.40 MM HEIGHT, LEAD FREE, PLASTIC, BGA-119

compliant

Infineon

CY7C1062G30-10BGXIT

Infineon Technologies AG

Check for Price

Yes

Active

16.7772 Mbit

512KX32

3 V

10 ns

STANDARD SRAM

512000

524.288 k

ASYNCHRONOUS

PARALLEL

3.6 V

2.2 V

CMOS

INDUSTRIAL

R-PBGA-B119

85 °C

-40 °C

NOT SPECIFIED

119

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

YES

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

1.27 mm

BOTTOM

2.4 mm

22 mm

14 mm

INFINEON TECHNOLOGIES AG

BGA-119

compliant

Infineon

Parametric results for: cy7c1062g30-10bgxi under SRAMs