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CY7C1513KV18-333BZC
Cypress Semiconductor
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Check for Price | No | Obsolete | 75.4975 Mbit | 18 | 4MX18 | 1.8 V | 450 ps | 333 MHz | QDR SRAM | PIPELINED ARCHITECTURE | SEPARATE | 1 | 4000000 | 4.1943 M | SYNCHRONOUS | 3-STATE | PARALLEL | 1.7 V | 620 µA | 1.9 V | 1.7 V | CMOS | COMMERCIAL | R-PBGA-B165 | Not Qualified | 3 | 70 °C | 165 | PLASTIC/EPOXY | LBGA | BGA165,11X15,40 | RECTANGULAR | GRID ARRAY, LOW PROFILE | YES | BALL | 1 mm | BOTTOM | 1.4 mm | 15 mm | 13 mm | CYPRESS SEMICONDUCTOR CORP | BGA | 13 X 15 MM, 1.40 MM HEIGHT, MO-216, FBGA-165 | 165 | not_compliant | 3A991.B.2.A | 8542.32.00.41 | ||||||||
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CY7C1513KV18-250BZXI
Infineon Technologies AG
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Check for Price | Yes | Obsolete | 75.4975 Mbit | 18 | 4MX18 | 1.8 V | 450 ps | 250 MHz | QDR SRAM | PIPELINED ARCHITECTURE | SEPARATE | 1 | 4000000 | 4.1943 M | SYNCHRONOUS | 3-STATE | PARALLEL | 1.7 V | 500 µA | 1.9 V | 1.7 V | CMOS | INDUSTRIAL | R-PBGA-B165 | Not Qualified | e1 | 3 | 85 °C | -40 °C | 260 | 30 | 165 | PLASTIC/EPOXY | LBGA | BGA165,11X15,40 | RECTANGULAR | GRID ARRAY, LOW PROFILE | YES | Tin/Silver/Copper (Sn/Ag/Cu) | BALL | 1 mm | BOTTOM | 1.4 mm | 15 mm | 13 mm | INFINEON TECHNOLOGIES AG | 13 X 15 MM, 1.40 MM HEIGHT, LEAD FREE, MO-216, FBGA-165 | compliant | |||||||
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CY7C1513KV18-250BZI
Infineon Technologies AG
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Check for Price | No | Obsolete | 75.4975 Mbit | 18 | 4MX18 | 1.8 V | 450 ps | 250 MHz | QDR SRAM | PIPELINED ARCHITECTURE | SEPARATE | 1 | 4000000 | 4.1943 M | SYNCHRONOUS | 3-STATE | PARALLEL | 1.7 V | 500 µA | 1.9 V | 1.7 V | CMOS | INDUSTRIAL | R-PBGA-B165 | Not Qualified | e0 | 3 | 85 °C | -40 °C | 220 | 20 | 165 | PLASTIC/EPOXY | LBGA | BGA165,11X15,40 | RECTANGULAR | GRID ARRAY, LOW PROFILE | YES | Tin/Lead (Sn/Pb) | BALL | 1 mm | BOTTOM | 1.4 mm | 15 mm | 13 mm | INFINEON TECHNOLOGIES AG | 13 X 15 MM, 1.40 MM HEIGHT, MO-216, FBGA-165 | compliant | Infineon | ||||||
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CY7C1513KV18-300BZC
Cypress Semiconductor
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Check for Price | No | Transferred | 75.4975 Mbit | 18 | 4MX18 | 1.8 V | 450 ps | 300 MHz | QDR SRAM | PIPELINED ARCHITECTURE | SEPARATE | 1 | 4000000 | 4.1943 M | SYNCHRONOUS | 3-STATE | PARALLEL | 1.7 V | 570 µA | 1.9 V | 1.7 V | CMOS | COMMERCIAL | R-PBGA-B165 | Not Qualified | e0 | 3 | 70 °C | 220 | 20 | 165 | PLASTIC/EPOXY | LBGA | BGA165,11X15,40 | RECTANGULAR | GRID ARRAY, LOW PROFILE | YES | Tin/Lead (Sn/Pb) | BALL | 1 mm | BOTTOM | 1.4 mm | 15 mm | 13 mm | CYPRESS SEMICONDUCTOR CORP | BGA | 13 X 15 MM, 1.40 MM HEIGHT, MO-216, FBGA-165 | 165 | compliant | 3A991.B.2.A | 8542.32.00.41 | ||||
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CY7C1513KV18-200BZXC
Cypress Semiconductor
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Check for Price | Yes | Obsolete | 75.4975 Mbit | 18 | 4MX18 | 1.8 V | 450 ps | 200 MHz | QDR SRAM | PIPELINED ARCHITECTURE | SEPARATE | 1 | 4000000 | 4.1943 M | ASYNCHRONOUS | 3-STATE | PARALLEL | 1.7 V | 440 µA | 1.9 V | 1.7 V | CMOS | COMMERCIAL | R-PBGA-B165 | Not Qualified | e1 | 3 | 70 °C | 260 | 20 | 165 | PLASTIC/EPOXY | LBGA | BGA165,11X15,40 | RECTANGULAR | GRID ARRAY, LOW PROFILE | YES | TIN SILVER COPPER | BALL | 1 mm | BOTTOM | 1.4 mm | 15 mm | 13 mm | CYPRESS SEMICONDUCTOR CORP | BGA | 13 X 15 MM, 1.40 MM HEIGHT, LEAD FREE, MO-216, FBGA-165 | 165 | compliant | 3A991.B.2.A | 8542.32.00.41 | ||||
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CY7C1513KV18-300BZC
Infineon Technologies AG
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Check for Price | No | End Of Life | 75.4975 Mbit | 18 | 4MX18 | 1.8 V | 450 ps | 300 MHz | QDR SRAM | PIPELINED ARCHITECTURE | SEPARATE | 1 | 4000000 | 4.1943 M | SYNCHRONOUS | 3-STATE | PARALLEL | 1.7 V | 570 µA | 1.9 V | 1.7 V | CMOS | COMMERCIAL | R-PBGA-B165 | Not Qualified | e0 | 3 | 70 °C | 220 | 20 | 165 | PLASTIC/EPOXY | LBGA | BGA165,11X15,40 | RECTANGULAR | GRID ARRAY, LOW PROFILE | YES | Tin/Lead (Sn/Pb) | BALL | 1 mm | BOTTOM | 1.4 mm | 15 mm | 13 mm | INFINEON TECHNOLOGIES AG | 13 X 15 MM, 1.40 MM HEIGHT, MO-216, FBGA-165 | compliant | ||||||||
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CY7C1513KV18-333BZXC
Infineon Technologies AG
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Check for Price | Yes | End Of Life | 75.4975 Mbit | 18 | 4MX18 | 1.8 V | 450 ps | 333 MHz | QDR SRAM | PIPELINED ARCHITECTURE | SEPARATE | 1 | 4000000 | 4.1943 M | SYNCHRONOUS | 3-STATE | PARALLEL | 1.7 V | 620 µA | 1.9 V | 1.7 V | CMOS | COMMERCIAL | R-PBGA-B165 | Not Qualified | e1 | 3 | 70 °C | 260 | 20 | 165 | PLASTIC/EPOXY | LBGA | BGA165,11X15,40 | RECTANGULAR | GRID ARRAY, LOW PROFILE | YES | Tin/Silver/Copper (Sn/Ag/Cu) | BALL | 1 mm | BOTTOM | 1.4 mm | 15 mm | 13 mm | INFINEON TECHNOLOGIES AG | 13 X 15 MM, 1.40 MM HEIGHT, LEAD FREE, MO-216, FBGA-165 | compliant | ||||||||
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CY7C1513KV18-300BZXC
Infineon Technologies AG
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Check for Price | Yes | End Of Life | 75.4975 Mbit | 18 | 4MX18 | 1.8 V | 450 ps | 300 MHz | QDR SRAM | PIPELINED ARCHITECTURE | SEPARATE | 1 | 4000000 | 4.1943 M | SYNCHRONOUS | 3-STATE | PARALLEL | 1.7 V | 570 µA | 1.9 V | 1.7 V | CMOS | COMMERCIAL | R-PBGA-B165 | Not Qualified | e1 | 3 | 70 °C | 260 | 20 | 165 | PLASTIC/EPOXY | LBGA | BGA165,11X15,40 | RECTANGULAR | GRID ARRAY, LOW PROFILE | YES | Tin/Silver/Copper (Sn/Ag/Cu) | BALL | 1 mm | BOTTOM | 1.4 mm | 15 mm | 13 mm | INFINEON TECHNOLOGIES AG | 13 X 15 MM, 1.40 MM HEIGHT, MO-216, FBGA-165 | compliant | ||||||||
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CY7C1513KV18-300BZXC
Cypress Semiconductor
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Check for Price | Yes | Transferred | 75.4975 Mbit | 18 | 4MX18 | 1.8 V | 450 ps | 300 MHz | QDR SRAM | PIPELINED ARCHITECTURE | SEPARATE | 1 | 4000000 | 4.1943 M | SYNCHRONOUS | 3-STATE | PARALLEL | 1.7 V | 570 µA | 1.9 V | 1.7 V | CMOS | COMMERCIAL | R-PBGA-B165 | Not Qualified | e1 | 3 | 70 °C | 260 | 20 | 165 | PLASTIC/EPOXY | LBGA | BGA165,11X15,40 | RECTANGULAR | GRID ARRAY, LOW PROFILE | YES | Tin/Silver/Copper (Sn/Ag/Cu) | BALL | 1 mm | BOTTOM | 1.4 mm | 15 mm | 13 mm | CYPRESS SEMICONDUCTOR CORP | BGA | 13 X 15 MM, 1.40 MM HEIGHT, MO-216, FBGA-165 | 165 | compliant | 3A991.B.2.A | 8542.32.00.41 | ||||
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CY7C1513KV18-200BZC
Cypress Semiconductor
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Check for Price | No | Obsolete | 75.4975 Mbit | 18 | 4MX18 | 1.8 V | 450 ps | 200 MHz | QDR SRAM | PIPELINED ARCHITECTURE | SEPARATE | 1 | 4000000 | 4.1943 M | ASYNCHRONOUS | 3-STATE | PARALLEL | 1.7 V | 440 µA | 1.9 V | 1.7 V | CMOS | COMMERCIAL | R-PBGA-B165 | Not Qualified | e0 | 70 °C | NOT SPECIFIED | NOT SPECIFIED | 165 | PLASTIC/EPOXY | LBGA | BGA165,11X15,40 | RECTANGULAR | GRID ARRAY, LOW PROFILE | YES | Tin/Lead (Sn/Pb) | BALL | 1 mm | BOTTOM | 1.4 mm | 15 mm | 13 mm | CYPRESS SEMICONDUCTOR CORP | BGA | 13 X 15 MM, 1.40 MM HEIGHT, MO-216, FBGA-165 | 165 | compliant | 3A991.B.2.A | 8542.32.00.41 |