Parametric results for: dac108s085 under Digital to Analog Converters
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DAC108S085CIMTX/NOPB
Texas Instruments
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$3.7014 | Yes | Yes | Active | 3 V | 5.5 V | 0.1953 % | 10 | 2.5 MHz | YES | D/A CONVERTER | BINARY | SERIAL | 1 | 6 µs | 6 µs | 855 µA | CMOS | AUTOMOTIVE | R-PDSO-G16 | Not Qualified | e3 | 1 | 125 °C | -40 °C | 260 | 30 | 16 | PLASTIC/EPOXY | TSSOP | TSSOP16,.25 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | MATTE TIN | GULL WING | 650 µm | DUAL | 4.4 mm | 1.2 mm | 5 mm | TEXAS INSTRUMENTS INC | TSSOP | TSSOP-16 | 16 | compliant | 8542.39.00.01 | Texas Instruments | |||
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DAC108S085CISQX/NOPB
Texas Instruments
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$3.7014 | Yes | Yes | Active | 3 V | 5.5 V | 0.1953 % | 10 | 2.5 MHz | YES | D/A CONVERTER | BINARY | SERIAL | 1 | 6 µs | 6 µs | 855 µA | CMOS | AUTOMOTIVE | S-XQCC-N16 | Not Qualified | e3 | 1 | 125 °C | -40 °C | 260 | 30 | 16 | UNSPECIFIED | HVQCCN | LCC20,.16SQ,20 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | MATTE TIN | NO LEAD | 500 µm | QUAD | 4 mm | 800 µm | 4 mm | TEXAS INSTRUMENTS INC | QFN | WQFN-16 | 16 | compliant | 8542.39.00.01 | Texas Instruments | |||
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DAC108S085CISQ/NOPB
Texas Instruments
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$3.7014 | Yes | Yes | Active | 3 V | 5.5 V | 0.1953 % | 10 | 2.5 MHz | YES | D/A CONVERTER | BINARY | SERIAL | 1 | 6 µs | 6 µs | 855 µA | CMOS | AUTOMOTIVE | S-XQCC-N16 | Not Qualified | e3 | 1 | 125 °C | -40 °C | 260 | 30 | 16 | UNSPECIFIED | HVQCCN | LCC20,.16SQ,20 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | MATTE TIN | NO LEAD | 500 µm | QUAD | 4 mm | 800 µm | 4 mm | TEXAS INSTRUMENTS INC | QFN | WQFN-16 | 16 | compliant | 8542.39.00.01 | Texas Instruments | EAR99 | ||
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DAC108S085CIMT/NOPB
Texas Instruments
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$6.5214 | Yes | Yes | Active | 3 V | 5.5 V | 0.1953 % | 10 | 2.5 MHz | YES | D/A CONVERTER | BINARY | SERIAL | 1 | 6 µs | 6 µs | 855 µA | CMOS | AUTOMOTIVE | R-PDSO-G16 | Not Qualified | e3 | 1 | 125 °C | -40 °C | 260 | 30 | 16 | PLASTIC/EPOXY | TSSOP | TSSOP16,.25 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | MATTE TIN | GULL WING | 650 µm | DUAL | 4.4 mm | 1.2 mm | 5 mm | TEXAS INSTRUMENTS INC | TSSOP | TSSOP-16 | 16 | compliant | 8542.39.00.01 | Texas Instruments | |||
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DAC108S085CIMT
National Semiconductor Corporation
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Check for Price | No | Transferred | 3 V | 5.5 V | 0.1953 % | 10 | YES | D/A CONVERTER | BINARY | SERIAL | 1 | 6 µs | 4.5 µs | CMOS | AUTOMOTIVE | R-PDSO-G16 | Not Qualified | e0 | 1 | 125 °C | -40 °C | 260 | 40 | 16 | PLASTIC/EPOXY | TSSOP | TSSOP16,.25 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | Tin/Lead (Sn85Pb15) | GULL WING | 650 µm | DUAL | 4.4 mm | 1.1 mm | 5 mm | NATIONAL SEMICONDUCTOR CORP | TSSOP-16 | not_compliant | 8542.39.00.01 | EAR99 | ||||||||
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DAC108S085CIMTX
Texas Instruments
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Check for Price | No | No | Obsolete | 3 V | 5.5 V | 0.1953 % | 10 | YES | D/A CONVERTER | BINARY | SERIAL | 1 | 6 µs | 4.5 µs | CMOS | AUTOMOTIVE | R-PDSO-G16 | Not Qualified | e0 | 1 | 125 °C | -40 °C | 260 | 16 | PLASTIC/EPOXY | TSSOP | TSSOP16,.25 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | TIN LEAD | GULL WING | 650 µm | DUAL | 4.4 mm | 1.1 mm | 5 mm | TEXAS INSTRUMENTS INC | TSSOP | TSSOP, TSSOP16,.25 | 16 | not_compliant | 8542.39.00.01 | Texas Instruments | ||||||
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DAC108S085CISQ
National Semiconductor Corporation
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Check for Price | No | Transferred | 3 V | 5.5 V | 0.1953 % | 10 | YES | D/A CONVERTER | BINARY | SERIAL | 1 | 6 µs | 4.5 µs | CMOS | AUTOMOTIVE | S-PQCC-N16 | Not Qualified | e0 | 1 | 125 °C | -40 °C | 260 | 40 | 16 | PLASTIC/EPOXY | HVQCCN | LCC20,.16SQ,20 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | Tin/Lead (Sn/Pb) | NO LEAD | 500 µm | QUAD | 4 mm | 800 µm | 4 mm | NATIONAL SEMICONDUCTOR CORP | LLP-16 | not_compliant | 8542.39.00.01 | EAR99 | ||||||||
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DAC108S085CISQX
Texas Instruments
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Check for Price | No | No | Obsolete | 3 V | 5.5 V | 0.1953 % | 10 | YES | D/A CONVERTER | BINARY | SERIAL | 1 | 6 µs | 4.5 µs | CMOS | AUTOMOTIVE | S-XQCC-N16 | Not Qualified | e0 | 1 | 125 °C | -40 °C | 260 | 16 | UNSPECIFIED | HVQCCN | LCC20,.16SQ,20 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | TIN LEAD | NO LEAD | 500 µm | QUAD | 4 mm | 800 µm | 4 mm | TEXAS INSTRUMENTS INC | QFN | HVQCCN, LCC20,.16SQ,20 | 16 | not_compliant | 8542.39.00.01 | |||||||
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DAC108S085CIMTX
National Semiconductor Corporation
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Check for Price | No | Transferred | 3 V | 5.5 V | 0.1953 % | 10 | YES | D/A CONVERTER | BINARY | SERIAL | 1 | 6 µs | 4.5 µs | CMOS | AUTOMOTIVE | R-PDSO-G16 | Not Qualified | e0 | 1 | 125 °C | -40 °C | 260 | 40 | 16 | PLASTIC/EPOXY | TSSOP | TSSOP16,.25 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | Tin/Lead (Sn85Pb15) | GULL WING | 650 µm | DUAL | 4.4 mm | 1.1 mm | 5 mm | NATIONAL SEMICONDUCTOR CORP | TSSOP-16 | not_compliant | 8542.39.00.01 | EAR99 | ||||||||
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DAC108S085CISQX/NOPB
National Semiconductor Corporation
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Check for Price | Yes | Transferred | 0.195 % | 10 | YES | D/A CONVERTER | BINARY | 8 | 6 µs | CMOS | AUTOMOTIVE | S-PQCC-N20 | Not Qualified | e3 | 1 | 125 °C | -40 °C | 260 | 40 | 20 | PLASTIC/EPOXY | QCCN | LCC20,.16SQ,20 | SQUARE | CHIP CARRIER | MATTE TIN | NO LEAD | 500 µm | QUAD | NATIONAL SEMICONDUCTOR CORP | unknown |