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EDI88257LPA25CB
Mercury Systems Inc
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Check for Price | No | Contact Manufacturer | 2.0972 Mbit | 8 | 256KX8 | 5 V | 25 ns | STANDARD SRAM | 1 | 256000 | 262.144 k | ASYNCHRONOUS | PARALLEL | 5.5 V | 4.5 V | CMOS | MILITARY | R-CDIP-T32 | Not Qualified | 125 °C | -55 °C | NOT SPECIFIED | MIL-STD-883 | NOT SPECIFIED | 32 | CERAMIC, METAL-SEALED COFIRED | DIP | RECTANGULAR | IN-LINE | NO | THROUGH-HOLE | 2.54 mm | DUAL | 3.937 mm | 40.64 mm | 15.24 mm | MERCURY SYSTEMS INC | 0.600 INCH, SIDE BRAZED, CERAMIC, DIP-32 | compliant | 3A001.A.2.C | 8542.32.00.41 | |||||||||||||
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EDI88257LPA25CB
Electronic Designs Inc
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Check for Price | No | Transferred | 2.0972 Mbit | 8 | 256KX8 | 5 V | 25 ns | STANDARD SRAM | COMMON | 1 | 256000 | 262.144 k | ASYNCHRONOUS | 3-STATE | PARALLEL | 2 mA | 2 V | 225 µA | 5.5 V | 4.5 V | CMOS | MILITARY | R-CDIP-T32 | Not Qualified | e0 | 125 °C | -55 °C | 38535Q/M;38534H;883B | 32 | CERAMIC, METAL-SEALED COFIRED | DIP | DIP32,.6 | RECTANGULAR | IN-LINE | NO | Tin/Lead (Sn/Pb) | THROUGH-HOLE | 2.54 mm | DUAL | ELECTRONIC DESIGNS INC | unknown | 3A001.A.2.C | 8542.32.00.41 | |||||||||||
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EDI88257LPA25CB
White Microelectronics
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Check for Price | Obsolete | 2.0972 Mbit | 8 | 256KX8 | 5 V | 25 ns | STANDARD SRAM | 1 | 256000 | 262.144 k | ASYNCHRONOUS | PARALLEL | 5.5 V | 4.5 V | CMOS | MILITARY | R-CDIP-T32 | Not Qualified | 125 °C | -55 °C | MIL-STD-883 | 32 | CERAMIC, METAL-SEALED COFIRED | DIP | RECTANGULAR | IN-LINE | NO | THROUGH-HOLE | DUAL | WHITE MICROELECTRONICS | 0.600 INCH, SIDE BRAZED, CERAMIC, DIP-32 | unknown | 3A001.A.2.C | 8542.32.00.41 | ||||||||||||||||||||
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EDI88257LPA25CB
White Electronic Designs Corp
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Check for Price | No | Transferred | 2.0972 Mbit | 8 | 256KX8 | 5 V | 25 ns | STANDARD SRAM | COMMON | 1 | 256000 | 262.144 k | ASYNCHRONOUS | 3-STATE | PARALLEL | 2 mA | 2 V | 225 µA | 5.5 V | 4.5 V | CMOS | MILITARY | R-CDIP-T32 | Not Qualified | 125 °C | -55 °C | NOT SPECIFIED | MIL-STD-883 | NOT SPECIFIED | 32 | CERAMIC, METAL-SEALED COFIRED | DIP | DIP32,.6 | RECTANGULAR | IN-LINE | NO | THROUGH-HOLE | 2.54 mm | DUAL | 3.937 mm | 40.64 mm | 15.24 mm | WHITE ELECTRONIC DESIGNS CORP | 0.600 INCH, SIDE BRAZED, CERAMIC, DIP-32 | unknown | 3A001.A.2.C | 8542.32.00.41 | |||||||
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EDI88257LPA25CB
Microsemi Corporation
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Check for Price | No | No | Transferred | 2.0972 Mbit | 8 | 256KX8 | 5 V | 25 ns | STANDARD SRAM | COMMON | 1 | 256000 | 262.144 k | ASYNCHRONOUS | 3-STATE | PARALLEL | 2 mA | 2 V | 225 µA | 5.5 V | 4.5 V | CMOS | MILITARY | R-CDIP-T32 | Not Qualified | 125 °C | -55 °C | NOT SPECIFIED | MIL-STD-883 | NOT SPECIFIED | 32 | CERAMIC, METAL-SEALED COFIRED | DIP | DIP32,.6 | RECTANGULAR | IN-LINE | NO | THROUGH-HOLE | 2.54 mm | DUAL | 3.937 mm | 40.64 mm | 15.24 mm | MICROSEMI CORP | 0.600 INCH, SIDE BRAZED, CERAMIC, DIP-32 | unknown | 3A001.A.2.C | 8542.32.00.41 | DIP | 32 |