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FSA550BUCX
onsemi
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$0.6754 | Yes | End Of Life | YES | 800 mΩ | 120 ns | 4PST | NC | 4 | 1 | 90 dB | SEPARATE OUTPUT | 3 V | 1.6 V | INDUSTRIAL | R-PBGA-B12 | Not Qualified | e1 | 1 | 85 °C | -40 °C | 260 | 30 | 12 | PLASTIC/EPOXY | VFBGA | BGA12,3X4,16 | RECTANGULAR | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | Tin/Silver/Copper (Sn/Ag/Cu) | BALL | 400 µm | BOTTOM | 1.56 mm | 625 µm | 1.16 mm | ONSEMI | WLCSP-12 | 567QG | compliant | 8542.39.00.01 | onsemi | ||||||
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FSA550BUCX
Fairchild Semiconductor Corporation
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Check for Price | Yes | Yes | Transferred | YES | 800 mΩ | 4PST | 4 | 1 | 90 dB | 3 V | 1.6 V | INDUSTRIAL | R-PBGA-B12 | e1 | 1 | 85 °C | -40 °C | 260 | 30 | 12 | PLASTIC/EPOXY | VFBGA | RECTANGULAR | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | TIN SILVER COPPER | BALL | 400 µm | BOTTOM | 1.56 mm | 625 µm | 1.16 mm | FAIRCHILD SEMICONDUCTOR CORP | WLCSP-12 | 12BALL WLCSP, 3X4 ARRAY, 0.4MM PITCH, 250UM BALL | compliant | 8542.39.00.01 | CSP | 12 | EAR99 |