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FT245RQ-REEL
FTDI Chip
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$3.0900 | Yes | End Of Life | YES | MICROPROCESSOR CIRCUIT | CMOS | 5.25 V | 3.3 V | INDUSTRIAL | S-XQCC-N32 | Not Qualified | 3 | 85 °C | -40 °C | 32 | UNSPECIFIED | HVQCCN | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | NO LEAD | 500 µm | QUAD | 1 mm | 5 mm | 5 mm | FUTURE TECHNOLOGY DEVICES INTERNATIONAL LTD | QFN | ROHS COMPLIANT, QFN-32 | 32 | compliant | EAR99 | 8542.31.00.01 | FTDI Chip | ||||||||||||||
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FT245RQ-TRAY
FTDI Chip
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$3.2500 | Yes | Yes | End Of Life | YES | MICROPROCESSOR CIRCUIT | CMOS | 5.25 V | 3.3 V | INDUSTRIAL | S-XQCC-N32 | Not Qualified | 3 | 85 °C | -40 °C | 260 | 40 | 32 | UNSPECIFIED | HVQCCN | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | NO LEAD | 500 µm | QUAD | 1 mm | 5 mm | 5 mm | FUTURE TECHNOLOGY DEVICES INTERNATIONAL LTD | QFN | HVQCCN, | 32 | compliant | EAR99 | 8542.31.00.01 | FTDI Chip | |||||||||||
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FT245RL-TUBE
FTDI Chip
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$3.2991 | Yes | End Of Life | YES | MICROPROCESSOR CIRCUIT | CMOS | 5.25 V | 3.3 V | INDUSTRIAL | R-PDSO-G28 | Not Qualified | 85 °C | -40 °C | 28 | PLASTIC/EPOXY | SSOP | RECTANGULAR | SMALL OUTLINE, SHRINK PITCH | GULL WING | 650 µm | DUAL | 2 mm | 5.3 mm | 10.2 mm | FUTURE TECHNOLOGY DEVICES INTERNATIONAL LTD | SSOP | SSOP, | 28 | compliant | 8542.31.00.01 | FTDI Chip | ||||||||||||||||
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FT245RL-REEL
FTDI Chip
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$3.3745 | Yes | End Of Life | YES | MICROPROCESSOR CIRCUIT | CMOS | 5.25 V | 3.3 V | INDUSTRIAL | R-PDSO-G28 | Not Qualified | 3 | 85 °C | -40 °C | 260 | 40 | 28 | PLASTIC/EPOXY | SSOP | RECTANGULAR | SMALL OUTLINE, SHRINK PITCH | GULL WING | 650 µm | DUAL | 2 mm | 5.3 mm | 10.2 mm | FUTURE TECHNOLOGY DEVICES INTERNATIONAL LTD | SSOP | ROHS COMPLIANT, SSOP-28 | 28 | compliant | 8542.31.00.01 | FTDI Chip | |||||||||||||
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FT245RNL-TUBE
FTDI Chip
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$3.9301 | Yes | Active | 8 | 60 MBps | 12.02 MHz | YES | BUS CONTROLLER, UNIVERSAL SERIAL BUS | CMOS | USB | 5.25 V | 3.3 V | R-PDSO-G28 | 85 °C | -40 °C | 28 | PLASTIC/EPOXY | SSOP | SSOP28,.3 | RECTANGULAR | SMALL OUTLINE, SHRINK PITCH | GULL WING | 650 µm | DUAL | 2 mm | 5.3 mm | 10.2 mm | FUTURE TECHNOLOGY DEVICES INTERNATIONAL LTD | compliant | FTDI Chip | |||||||||||||||||
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FT245BL-TRAY
FTDI Chip
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$3.9609 | Yes | Yes | End Of Life | 8 | 1 MBps | 6 MHz | YES | 5 V | BUS CONTROLLER, UNIVERSAL SERIAL BUS | CMOS | AND ALSO DATA RATE TRANSFERE AT 300KILOBYTE/SECOND-VCP DRIVERS | USB | 5.25 V | 4.35 V | COMMERCIAL | S-PQFP-G32 | e3 | 3 | 70 °C | 260 | 30 | 32 | PLASTIC/EPOXY | LQFP | SQUARE | FLATPACK, LOW PROFILE | MATTE TIN | GULL WING | 800 µm | QUAD | 1.6 mm | 7 mm | 7 mm | FUTURE TECHNOLOGY DEVICES INTERNATIONAL LTD | LQFP-32 | compliant | FTDI Chip | |||||||||
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FT245RNQ-TRAY
FTDI Chip
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$4.0477 | Yes | Active | 8 | 60 MBps | 12.02 MHz | YES | BUS CONTROLLER, UNIVERSAL SERIAL BUS | CMOS | USB | 5.25 V | 3.3 V | S-XQCC-N32 | 85 °C | -40 °C | 32 | UNSPECIFIED | HVQCCN | LCC32,.2SQ,20 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | NO LEAD | 500 µm | QUAD | 900 µm | 5 mm | 5 mm | FUTURE TECHNOLOGY DEVICES INTERNATIONAL LTD | compliant | FTDI Chip | |||||||||||||||||
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FT245BL
FTDI Chip
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$4.1131 | Yes | Yes | Obsolete | YES | 5 V | MICROPROCESSOR CIRCUIT | CMOS | 5.25 V | 4.35 V | COMMERCIAL | S-PQFP-G32 | Not Qualified | e3 | 3 | 70 °C | 260 | 30 | 32 | PLASTIC/EPOXY | LQFP | SQUARE | FLATPACK, LOW PROFILE | MATTE TIN | GULL WING | 800 µm | QUAD | 1.6 mm | 7 mm | 7 mm | FUTURE TECHNOLOGY DEVICES INTERNATIONAL LTD | QFP | LQFP, | 32 | compliant | EAR99 | 8542.31.00.01 | FTDI Chip | |||||||||
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FT245RNQ-REEL
FTDI Chip
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$4.5856 | Yes | Active | 8 | 60 MBps | 12.02 MHz | YES | BUS CONTROLLER, UNIVERSAL SERIAL BUS | CMOS | USB | 5.25 V | 3.3 V | S-XQCC-N32 | 85 °C | -40 °C | 32 | UNSPECIFIED | HVQCCN | LCC32,.2SQ,20 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | NO LEAD | 500 µm | QUAD | 900 µm | 5 mm | 5 mm | FUTURE TECHNOLOGY DEVICES INTERNATIONAL LTD | compliant | FTDI Chip | |||||||||||||||||
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FT245BL-REEL
FTDI Chip
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$4.6913 | Yes | Obsolete | YES | 5 V | MICROPROCESSOR CIRCUIT | CMOS | 5.25 V | 4.35 V | COMMERCIAL | S-PQFP-G32 | e3 | 3 | 70 °C | 260 | 30 | 32 | PLASTIC/EPOXY | LQFP | SQUARE | FLATPACK, LOW PROFILE | MATTE TIN | GULL WING | 800 µm | QUAD | 1.6 mm | 7 mm | 7 mm | FUTURE TECHNOLOGY DEVICES INTERNATIONAL LTD | LQFP, | compliant | EAR99 | 8542.31.00.01 | FTDI Chip |