Findchips: Parametric Search Results for gs8170d18b

Parametric results for: gs8170d18b under SRAMs

Select parts from the table below to compare.

Compare


Select Parts		Part Number

		GS8170D18B-333T GSI Technology
		GS8170D18B-300IT GSI Technology
		GS8170D18B-275T GSI Technology
		GS8170D18B-275I GSI Technology
		GS8170D18B-333 GSI Technology
		GS8170D18B-250T GSI Technology
		GS8170D18B-333IT GSI Technology
		GS8170D18B-300T GSI Technology
		GS8170D18B-250 GSI Technology
		GS8170D18B-333I GSI Technology

			Most Relevant					Technical														Compliance			Operating Conditions				Physical											Dimensions			Other
Composite Price	Rohs Code	Part Life Cycle Code	Memory Density	Memory Width	Organization	Supply Voltage-Nom (Vsup)	Access Time-Max	Memory IC Type	Additional Feature	I/O Type	Number of Functions	Number of Words Code	Number of Words	Operating Mode	Output Characteristics	Parallel/Serial	Standby Voltage-Min	Supply Voltage-Max (Vsup)	Supply Voltage-Min (Vsup)	Technology	Temperature Grade	JESD-30 Code	Qualification Status	JESD-609 Code	Moisture Sensitivity Level	Operating Temperature-Max	Operating Temperature-Min	Peak Reflow Temperature (Cel)	Number of Terminals	Package Body Material	Package Code	Package Equivalence Code	Package Shape	Package Style	Surface Mount	Terminal Finish	Terminal Form	Terminal Pitch	Terminal Position	Seated Height-Max	Length	Width	Ihs Manufacturer	Part Package Code	Package Description	Pin Count	Reach Compliance Code	ECCN Code	HTS Code

Check for Price

Obsolete

18.8744 Mbit

1MX18

1.8 V

1.6 ns

STANDARD SRAM

PIPELINED ARCHITECTURE

COMMON

1000000

1.0486 M

SYNCHRONOUS

3-STATE

PARALLEL

1.7 V

1.95 V

1.7 V

CMOS

COMMERCIAL

R-PBGA-B209

Not Qualified

70 °C

220

209

PLASTIC/EPOXY

LBGA

BGA209,11X19,40

RECTANGULAR

GRID ARRAY, LOW PROFILE

YES

TIN LEAD

BALL

1 mm

BOTTOM

1.7 mm

22 mm

14 mm

GSI TECHNOLOGY

BGA

LBGA, BGA209,11X19,40

209

compliant

3A991.B.2.A

8542.32.00.41

Check for Price

Obsolete

18.8744 Mbit

1MX18

1.8 V

1.8 ns

STANDARD SRAM

PIPELINED ARCHITECTURE

COMMON

1000000

1.0486 M

SYNCHRONOUS

3-STATE

PARALLEL

1.7 V

1.95 V

1.7 V

CMOS

INDUSTRIAL

R-PBGA-B209

Not Qualified

85 °C

-40 °C

220

209

PLASTIC/EPOXY

LBGA

BGA209,11X19,40

RECTANGULAR

GRID ARRAY, LOW PROFILE

YES

TIN LEAD

BALL

1 mm

BOTTOM

1.7 mm

22 mm

14 mm

GSI TECHNOLOGY

BGA

LBGA, BGA209,11X19,40

209

compliant

3A991.B.2.A

8542.32.00.41

Check for Price

Obsolete

18.8744 Mbit

1MX18

1.8 V

1.9 ns

DDR SRAM

COMMON

1000000

1.0486 M

SYNCHRONOUS

3-STATE

PARALLEL

1.7 V

1.95 V

1.7 V

CMOS

COMMERCIAL

R-PBGA-B209

Not Qualified

70 °C

220

209

PLASTIC/EPOXY

LBGA

BGA209,11X19,40

RECTANGULAR

GRID ARRAY, LOW PROFILE

YES

TIN LEAD

BALL

1 mm

BOTTOM

1.7 mm

22 mm

14 mm

GSI TECHNOLOGY

LBGA, BGA209,11X19,40

compliant

3A991.B.2.A

8542.32.00.41

Check for Price

Obsolete

18.8744 Mbit

1MX18

1.8 V

1.9 ns

DDR SRAM

COMMON

1000000

1.0486 M

SYNCHRONOUS

3-STATE

PARALLEL

1.7 V

1.95 V

1.7 V

CMOS

INDUSTRIAL

R-PBGA-B209

Not Qualified

85 °C

-40 °C

220

209

PLASTIC/EPOXY

LBGA

BGA209,11X19,40

RECTANGULAR

GRID ARRAY, LOW PROFILE

YES

TIN LEAD

BALL

1 mm

BOTTOM

1.7 mm

22 mm

14 mm

GSI TECHNOLOGY

LBGA, BGA209,11X19,40

compliant

3A991.B.2.A

8542.32.00.41

Check for Price

Obsolete

18.8744 Mbit

1MX18

1.8 V

1.6 ns

STANDARD SRAM

PIPELINED ARCHITECTURE

COMMON

1000000

1.0486 M

SYNCHRONOUS

3-STATE

PARALLEL

1.7 V

1.95 V

1.7 V

CMOS

COMMERCIAL

R-PBGA-B209

Not Qualified

70 °C

220

209

PLASTIC/EPOXY

LBGA

BGA209,11X19,40

RECTANGULAR

GRID ARRAY, LOW PROFILE

YES

TIN LEAD

BALL

1 mm

BOTTOM

1.7 mm

22 mm

14 mm

GSI TECHNOLOGY

BGA

LBGA, BGA209,11X19,40

209

compliant

3A991.B.2.A

8542.32.00.41

Check for Price

Obsolete

18.8744 Mbit

1MX18

1.8 V

2.1 ns

STANDARD SRAM

PIPELINED ARCHITECTURE

COMMON

1000000

1.0486 M

SYNCHRONOUS

3-STATE

PARALLEL

1.7 V

1.95 V

1.7 V

CMOS

COMMERCIAL

R-PBGA-B209

Not Qualified

70 °C

220

209

PLASTIC/EPOXY

LBGA

BGA209,11X19,40

RECTANGULAR

GRID ARRAY, LOW PROFILE

YES

TIN LEAD

BALL

1 mm

BOTTOM

1.7 mm

22 mm

14 mm

GSI TECHNOLOGY

BGA

LBGA, BGA209,11X19,40

209

compliant

3A991.B.2.A

8542.32.00.41

Check for Price

Obsolete

18.8744 Mbit

1MX18

1.8 V

1.6 ns

STANDARD SRAM

PIPELINED ARCHITECTURE

COMMON

1000000

1.0486 M

SYNCHRONOUS

3-STATE

PARALLEL

1.7 V

1.95 V

1.7 V

CMOS

INDUSTRIAL

R-PBGA-B209

Not Qualified

85 °C

-40 °C

220

209

PLASTIC/EPOXY

LBGA

BGA209,11X19,40

RECTANGULAR

GRID ARRAY, LOW PROFILE

YES

TIN LEAD

BALL

1 mm

BOTTOM

1.7 mm

22 mm

14 mm

GSI TECHNOLOGY

BGA

LBGA, BGA209,11X19,40

209

compliant

3A991.B.2.A

8542.32.00.41

Check for Price

Obsolete

18.8744 Mbit

1MX18

1.8 V

1.8 ns

STANDARD SRAM

PIPELINED ARCHITECTURE

COMMON

1000000

1.0486 M

SYNCHRONOUS

3-STATE

PARALLEL

1.7 V

1.95 V

1.7 V

CMOS

COMMERCIAL

R-PBGA-B209

Not Qualified

70 °C

220

209

PLASTIC/EPOXY

LBGA

BGA209,11X19,40

RECTANGULAR

GRID ARRAY, LOW PROFILE

YES

TIN LEAD

BALL

1 mm

BOTTOM

1.7 mm

22 mm

14 mm

GSI TECHNOLOGY

BGA

LBGA, BGA209,11X19,40

209

compliant

3A991.B.2.A

8542.32.00.41

Check for Price

Obsolete

18.8744 Mbit

1MX18

1.8 V

2.1 ns

STANDARD SRAM

PIPELINED ARCHITECTURE

COMMON

1000000

1.0486 M

SYNCHRONOUS

3-STATE

PARALLEL

1.7 V

1.95 V

1.7 V

CMOS

COMMERCIAL

R-PBGA-B209

Not Qualified

70 °C

220

209

PLASTIC/EPOXY

LBGA

BGA209,11X19,40

RECTANGULAR

GRID ARRAY, LOW PROFILE

YES

TIN LEAD

BALL

1 mm

BOTTOM

1.7 mm

22 mm

14 mm

GSI TECHNOLOGY

BGA

LBGA, BGA209,11X19,40

209

compliant

3A991.B.2.A

8542.32.00.41

Check for Price

Obsolete

18.8744 Mbit

1MX18

1.8 V

1.6 ns

STANDARD SRAM

PIPELINED ARCHITECTURE

COMMON

1000000

1.0486 M

SYNCHRONOUS

3-STATE

PARALLEL

1.7 V

1.95 V

1.7 V

CMOS

INDUSTRIAL

R-PBGA-B209

Not Qualified

85 °C

-40 °C

220

209

PLASTIC/EPOXY

LBGA

BGA209,11X19,40

RECTANGULAR

GRID ARRAY, LOW PROFILE

YES

TIN LEAD

BALL

1 mm

BOTTOM

1.7 mm

22 mm

14 mm

GSI TECHNOLOGY

BGA

LBGA, BGA209,11X19,40

209

compliant

3A991.B.2.A

8542.32.00.41

1 2 Next

Compare

GS8170D18B-333T

GSI Technology

Check for Price

Obsolete

18.8744 Mbit

1MX18

1.8 V

1.6 ns

STANDARD SRAM

PIPELINED ARCHITECTURE

COMMON

1000000

1.0486 M

SYNCHRONOUS

3-STATE

PARALLEL

1.7 V

1.95 V

1.7 V

CMOS

COMMERCIAL

R-PBGA-B209

Not Qualified

70 °C

220

209

PLASTIC/EPOXY

LBGA

BGA209,11X19,40

RECTANGULAR

GRID ARRAY, LOW PROFILE

YES

TIN LEAD

BALL

1 mm

BOTTOM

1.7 mm

22 mm

14 mm

GSI TECHNOLOGY

BGA

LBGA, BGA209,11X19,40

209

compliant

3A991.B.2.A

8542.32.00.41

GS8170D18B-300IT

GSI Technology

Check for Price

Obsolete

18.8744 Mbit

1MX18

1.8 V

1.8 ns

STANDARD SRAM

PIPELINED ARCHITECTURE

COMMON

1000000

1.0486 M

SYNCHRONOUS

3-STATE

PARALLEL

1.7 V

1.95 V

1.7 V

CMOS

INDUSTRIAL

R-PBGA-B209

Not Qualified

85 °C

-40 °C

220

209

PLASTIC/EPOXY

LBGA

BGA209,11X19,40

RECTANGULAR

GRID ARRAY, LOW PROFILE

YES

TIN LEAD

BALL

1 mm

BOTTOM

1.7 mm

22 mm

14 mm

GSI TECHNOLOGY

BGA

LBGA, BGA209,11X19,40

209

compliant

3A991.B.2.A

8542.32.00.41

GS8170D18B-275T

GSI Technology

Check for Price

Obsolete

18.8744 Mbit

1MX18

1.8 V

1.9 ns

DDR SRAM

COMMON

1000000

1.0486 M

SYNCHRONOUS

3-STATE

PARALLEL

1.7 V

1.95 V

1.7 V

CMOS

COMMERCIAL

R-PBGA-B209

Not Qualified

70 °C

220

209

PLASTIC/EPOXY

LBGA

BGA209,11X19,40

RECTANGULAR

GRID ARRAY, LOW PROFILE

YES

TIN LEAD

BALL

1 mm

BOTTOM

1.7 mm

22 mm

14 mm

GSI TECHNOLOGY

LBGA, BGA209,11X19,40

compliant

3A991.B.2.A

8542.32.00.41

GS8170D18B-275I

GSI Technology

Check for Price

Obsolete

18.8744 Mbit

1MX18

1.8 V

1.9 ns

DDR SRAM

COMMON

1000000

1.0486 M

SYNCHRONOUS

3-STATE

PARALLEL

1.7 V

1.95 V

1.7 V

CMOS

INDUSTRIAL

R-PBGA-B209

Not Qualified

85 °C

-40 °C

220

209

PLASTIC/EPOXY

LBGA

BGA209,11X19,40

RECTANGULAR

GRID ARRAY, LOW PROFILE

YES

TIN LEAD

BALL

1 mm

BOTTOM

1.7 mm

22 mm

14 mm

GSI TECHNOLOGY

LBGA, BGA209,11X19,40

compliant

3A991.B.2.A

8542.32.00.41

GS8170D18B-333

GSI Technology

Check for Price

Obsolete

18.8744 Mbit

1MX18

1.8 V

1.6 ns

STANDARD SRAM

PIPELINED ARCHITECTURE

COMMON

1000000

1.0486 M

SYNCHRONOUS

3-STATE

PARALLEL

1.7 V

1.95 V

1.7 V

CMOS

COMMERCIAL

R-PBGA-B209

Not Qualified

70 °C

220

209

PLASTIC/EPOXY

LBGA

BGA209,11X19,40

RECTANGULAR

GRID ARRAY, LOW PROFILE

YES

TIN LEAD

BALL

1 mm

BOTTOM

1.7 mm

22 mm

14 mm

GSI TECHNOLOGY

BGA

LBGA, BGA209,11X19,40

209

compliant

3A991.B.2.A

8542.32.00.41

GS8170D18B-250T

GSI Technology

Check for Price

Obsolete

18.8744 Mbit

1MX18

1.8 V

2.1 ns

STANDARD SRAM

PIPELINED ARCHITECTURE

COMMON

1000000

1.0486 M

SYNCHRONOUS

3-STATE

PARALLEL

1.7 V

1.95 V

1.7 V

CMOS

COMMERCIAL

R-PBGA-B209

Not Qualified

70 °C

220

209

PLASTIC/EPOXY

LBGA

BGA209,11X19,40

RECTANGULAR

GRID ARRAY, LOW PROFILE

YES

TIN LEAD

BALL

1 mm

BOTTOM

1.7 mm

22 mm

14 mm

GSI TECHNOLOGY

BGA

LBGA, BGA209,11X19,40

209

compliant

3A991.B.2.A

8542.32.00.41

GS8170D18B-333IT

GSI Technology

Check for Price

Obsolete

18.8744 Mbit

1MX18

1.8 V

1.6 ns

STANDARD SRAM

PIPELINED ARCHITECTURE

COMMON

1000000

1.0486 M

SYNCHRONOUS

3-STATE

PARALLEL

1.7 V

1.95 V

1.7 V

CMOS

INDUSTRIAL

R-PBGA-B209

Not Qualified

85 °C

-40 °C

220

209

PLASTIC/EPOXY

LBGA

BGA209,11X19,40

RECTANGULAR

GRID ARRAY, LOW PROFILE

YES

TIN LEAD

BALL

1 mm

BOTTOM

1.7 mm

22 mm

14 mm

GSI TECHNOLOGY

BGA

LBGA, BGA209,11X19,40

209

compliant

3A991.B.2.A

8542.32.00.41

GS8170D18B-300T

GSI Technology

Check for Price

Obsolete

18.8744 Mbit

1MX18

1.8 V

1.8 ns

STANDARD SRAM

PIPELINED ARCHITECTURE

COMMON

1000000

1.0486 M

SYNCHRONOUS

3-STATE

PARALLEL

1.7 V

1.95 V

1.7 V

CMOS

COMMERCIAL

R-PBGA-B209

Not Qualified

70 °C

220

209

PLASTIC/EPOXY

LBGA

BGA209,11X19,40

RECTANGULAR

GRID ARRAY, LOW PROFILE

YES

TIN LEAD

BALL

1 mm

BOTTOM

1.7 mm

22 mm

14 mm

GSI TECHNOLOGY

BGA

LBGA, BGA209,11X19,40

209

compliant

3A991.B.2.A

8542.32.00.41

GS8170D18B-250

GSI Technology

Check for Price

Obsolete

18.8744 Mbit

1MX18

1.8 V

2.1 ns

STANDARD SRAM

PIPELINED ARCHITECTURE

COMMON

1000000

1.0486 M

SYNCHRONOUS

3-STATE

PARALLEL

1.7 V

1.95 V

1.7 V

CMOS

COMMERCIAL

R-PBGA-B209

Not Qualified

70 °C

220

209

PLASTIC/EPOXY

LBGA

BGA209,11X19,40

RECTANGULAR

GRID ARRAY, LOW PROFILE

YES

TIN LEAD

BALL

1 mm

BOTTOM

1.7 mm

22 mm

14 mm

GSI TECHNOLOGY

BGA

LBGA, BGA209,11X19,40

209

compliant

3A991.B.2.A

8542.32.00.41

GS8170D18B-333I

GSI Technology

Check for Price

Obsolete

18.8744 Mbit

1MX18

1.8 V

1.6 ns

STANDARD SRAM

PIPELINED ARCHITECTURE

COMMON

1000000

1.0486 M

SYNCHRONOUS

3-STATE

PARALLEL

1.7 V

1.95 V

1.7 V

CMOS

INDUSTRIAL

R-PBGA-B209

Not Qualified

85 °C

-40 °C

220

209

PLASTIC/EPOXY

LBGA

BGA209,11X19,40

RECTANGULAR

GRID ARRAY, LOW PROFILE

YES

TIN LEAD

BALL

1 mm

BOTTOM

1.7 mm

22 mm

14 mm

GSI TECHNOLOGY

BGA

LBGA, BGA209,11X19,40

209

compliant

3A991.B.2.A

8542.32.00.41

1 2 Next