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HAL300SO-E
TDK Corporation
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Check for Price | No | Obsolete | YES | 220 Ω | 2.2 mT | 0.18-0.25V | 2.2 mT | -2.2 mT | PLASTIC | MAGNETIC FIELD SENSOR,HALL EFFECT | ANALOG VOLTAGE | REVERSE VOLTAGE PROTECTION | 6.8 mA | 20 mA | 24 V | 4.5 V | e0 | 150 °C | -40 °C | SURFACE MOUNT | RECTANGULAR | Tin/Lead (Sn/Pb) | SOLDER | 2.6 mm | 1.53 mm | 4.55 mm | TDK CORP | compliant | |||||||||||||
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HAL300S-A
TDK Corporation
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Check for Price | No | Obsolete | YES | 1.7 mT | -1.7 mT | BIPOLAR(LATCHED) | 7.5 mA | INVERTING | OPEN-DRAIN | CMOS | e0 | SURFACE MOUNT | 3 | PLASTIC/EPOXY | TO-243 | Tin/Lead (Sn/Pb) | TDK CORP | compliant | |||||||||||||||||||||||
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HAL300S
TDK Corporation
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Check for Price | Obsolete | TDK CORP | compliant | , | 8542.39.00.01 | ||||||||||||||||||||||||||||||||||||
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HAL300SO-C
TDK Micronas GmbH
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Check for Price | No | Transferred | YES | 220 Ω | 2.2 mT | 0.18-0.25V | 2.2 mT | -2.2 mT | PLASTIC | MAGNETIC FIELD SENSOR,HALL EFFECT | ANALOG VOLTAGE | REVERSE VOLTAGE PROTECTION | BIPOLAR(LATCHED) | 6.8 mA | 20 mA | INVERTING | OPEN-DRAIN | CMOS | e0 | SURFACE MOUNT | 3 | PLASTIC/EPOXY | TO-243 | RECTANGULAR | Tin/Lead (Sn/Pb) | SOLDER | 2.6 mm | 1.53 mm | 4.55 mm | MICRONAS SEMICONDUCTOR HOLDING AG | compliant | TO-243 | |||||||||
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HAL300SO-A
TDK Corporation
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Check for Price | No | Obsolete | YES | 220 Ω | 2.2 mT | 0.18-0.25V | 2.2 mT | -2.2 mT | PLASTIC | MAGNETIC FIELD SENSOR,HALL EFFECT | ANALOG VOLTAGE | REVERSE VOLTAGE PROTECTION | 6.8 mA | 20 mA | 24 V | 4.5 V | e0 | 150 °C | -40 °C | SURFACE MOUNT | RECTANGULAR | Tin/Lead (Sn/Pb) | SOLDER | 2.6 mm | 1.53 mm | 4.55 mm | TDK CORP | compliant | |||||||||||||
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HAL300UA-K
TDK Micronas GmbH
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Check for Price | Yes | Yes | Transferred | NO | 2.2 mT | 24V | 2.2 mT | -2.2 mT | PLASTIC | MAGNETIC FIELD SENSOR,HALL EFFECT | ANALOG VOLTAGE | REVERSE VOLTAGE PROTECTION | 6.8 mA | 20 mA | e3 | THROUGH HOLE MOUNT | RECTANGULAR | Matte Tin (Sn) | SOLDER | 1.5 mm | 3.05 mm | 4.06 mm | MICRONAS SEMICONDUCTOR HOLDING AG | compliant | 1995-06-14 | ||||||||||||||||
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HAL300UA-C
TDK Micronas GmbH
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Check for Price | Yes | Yes | Transferred | NO | 220 Ω | 2.2 mT | 0.18-0.25V | 2.2 mT | -2.2 mT | PLASTIC | MAGNETIC FIELD SENSOR,HALL EFFECT | ANALOG VOLTAGE | REVERSE VOLTAGE PROTECTION | BIPOLAR(LATCHED) | 6.8 mA | 20 mA | INVERTING | OPEN-DRAIN | CMOS | e3 | THROUGH HOLE MOUNT | 3 | PLASTIC/EPOXY | SIP3,.03,50 | RECTANGULAR | Matte Tin (Sn) | SOLDER | 1.5 mm | 3.05 mm | 4.06 mm | MICRONAS SEMICONDUCTOR HOLDING AG | compliant | SIP3,.03,50 | ||||||||
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HAL300S-C
TDK Corporation
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Check for Price | No | Obsolete | YES | 1.7 mT | -1.7 mT | BIPOLAR(LATCHED) | 7.5 mA | INVERTING | OPEN-DRAIN | CMOS | e0 | SURFACE MOUNT | 3 | PLASTIC/EPOXY | TO-243 | Tin/Lead (Sn/Pb) | TDK CORP | compliant | |||||||||||||||||||||||
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HAL300UA-A
TDK Micronas GmbH
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Check for Price | Yes | Yes | Transferred | NO | 2.2 mT | 24V | 2.2 mT | -2.2 mT | PLASTIC | MAGNETIC FIELD SENSOR,HALL EFFECT | ANALOG VOLTAGE | REVERSE VOLTAGE PROTECTION | BIPOLAR(LATCHED) | 6.8 mA | 20 mA | INVERTING | OPEN-DRAIN | CMOS | e3 | THROUGH HOLE MOUNT | 3 | PLASTIC/EPOXY | SIP3,.03,50 | RECTANGULAR | Matte Tin (Sn) | SOLDER | 1.5 mm | 3.05 mm | 4.06 mm | MICRONAS SEMICONDUCTOR HOLDING AG | compliant | SIP3,.03,50 | 1995-06-14 | ||||||||
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HAL300SO-A
TDK Micronas GmbH
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Check for Price | No | Transferred | YES | 220 Ω | 2.2 mT | 0.18-0.25V | 2.2 mT | -2.2 mT | PLASTIC | MAGNETIC FIELD SENSOR,HALL EFFECT | ANALOG VOLTAGE | REVERSE VOLTAGE PROTECTION | BIPOLAR(LATCHED) | 6.8 mA | 20 mA | INVERTING | OPEN-DRAIN | CMOS | e0 | SURFACE MOUNT | 3 | PLASTIC/EPOXY | TO-243 | RECTANGULAR | Tin/Lead (Sn/Pb) | SOLDER | 2.6 mm | 1.53 mm | 4.55 mm | MICRONAS SEMICONDUCTOR HOLDING AG | compliant | TO-243 |