Parametric results for: hal300 under Magnetic Field Sensors

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Manufacturer Part Number: hal300
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HAL300SO-E
TDK Corporation
Check for Price No Obsolete YES 220 Ω 2.2 mT 0.18-0.25V 2.2 mT -2.2 mT PLASTIC MAGNETIC FIELD SENSOR,HALL EFFECT ANALOG VOLTAGE REVERSE VOLTAGE PROTECTION 6.8 mA 20 mA 24 V 4.5 V e0 150 °C -40 °C SURFACE MOUNT RECTANGULAR Tin/Lead (Sn/Pb) SOLDER 2.6 mm 1.53 mm 4.55 mm TDK CORP compliant
HAL300S-A
TDK Corporation
Check for Price No Obsolete YES 1.7 mT -1.7 mT BIPOLAR(LATCHED) 7.5 mA INVERTING OPEN-DRAIN CMOS e0 SURFACE MOUNT 3 PLASTIC/EPOXY TO-243 Tin/Lead (Sn/Pb) TDK CORP compliant
HAL300S
TDK Corporation
Check for Price Obsolete TDK CORP compliant , 8542.39.00.01
HAL300SO-C
TDK Micronas GmbH
Check for Price No Transferred YES 220 Ω 2.2 mT 0.18-0.25V 2.2 mT -2.2 mT PLASTIC MAGNETIC FIELD SENSOR,HALL EFFECT ANALOG VOLTAGE REVERSE VOLTAGE PROTECTION BIPOLAR(LATCHED) 6.8 mA 20 mA INVERTING OPEN-DRAIN CMOS e0 SURFACE MOUNT 3 PLASTIC/EPOXY TO-243 RECTANGULAR Tin/Lead (Sn/Pb) SOLDER 2.6 mm 1.53 mm 4.55 mm MICRONAS SEMICONDUCTOR HOLDING AG compliant TO-243
HAL300SO-A
TDK Corporation
Check for Price No Obsolete YES 220 Ω 2.2 mT 0.18-0.25V 2.2 mT -2.2 mT PLASTIC MAGNETIC FIELD SENSOR,HALL EFFECT ANALOG VOLTAGE REVERSE VOLTAGE PROTECTION 6.8 mA 20 mA 24 V 4.5 V e0 150 °C -40 °C SURFACE MOUNT RECTANGULAR Tin/Lead (Sn/Pb) SOLDER 2.6 mm 1.53 mm 4.55 mm TDK CORP compliant
HAL300UA-K
TDK Micronas GmbH
Check for Price Yes Yes Transferred NO 2.2 mT 24V 2.2 mT -2.2 mT PLASTIC MAGNETIC FIELD SENSOR,HALL EFFECT ANALOG VOLTAGE REVERSE VOLTAGE PROTECTION 6.8 mA 20 mA e3 THROUGH HOLE MOUNT RECTANGULAR Matte Tin (Sn) SOLDER 1.5 mm 3.05 mm 4.06 mm MICRONAS SEMICONDUCTOR HOLDING AG compliant 1995-06-14
HAL300UA-C
TDK Micronas GmbH
Check for Price Yes Yes Transferred NO 220 Ω 2.2 mT 0.18-0.25V 2.2 mT -2.2 mT PLASTIC MAGNETIC FIELD SENSOR,HALL EFFECT ANALOG VOLTAGE REVERSE VOLTAGE PROTECTION BIPOLAR(LATCHED) 6.8 mA 20 mA INVERTING OPEN-DRAIN CMOS e3 THROUGH HOLE MOUNT 3 PLASTIC/EPOXY SIP3,.03,50 RECTANGULAR Matte Tin (Sn) SOLDER 1.5 mm 3.05 mm 4.06 mm MICRONAS SEMICONDUCTOR HOLDING AG compliant SIP3,.03,50
HAL300S-C
TDK Corporation
Check for Price No Obsolete YES 1.7 mT -1.7 mT BIPOLAR(LATCHED) 7.5 mA INVERTING OPEN-DRAIN CMOS e0 SURFACE MOUNT 3 PLASTIC/EPOXY TO-243 Tin/Lead (Sn/Pb) TDK CORP compliant
HAL300UA-A
TDK Micronas GmbH
Check for Price Yes Yes Transferred NO 2.2 mT 24V 2.2 mT -2.2 mT PLASTIC MAGNETIC FIELD SENSOR,HALL EFFECT ANALOG VOLTAGE REVERSE VOLTAGE PROTECTION BIPOLAR(LATCHED) 6.8 mA 20 mA INVERTING OPEN-DRAIN CMOS e3 THROUGH HOLE MOUNT 3 PLASTIC/EPOXY SIP3,.03,50 RECTANGULAR Matte Tin (Sn) SOLDER 1.5 mm 3.05 mm 4.06 mm MICRONAS SEMICONDUCTOR HOLDING AG compliant SIP3,.03,50 1995-06-14
HAL300SO-A
TDK Micronas GmbH
Check for Price No Transferred YES 220 Ω 2.2 mT 0.18-0.25V 2.2 mT -2.2 mT PLASTIC MAGNETIC FIELD SENSOR,HALL EFFECT ANALOG VOLTAGE REVERSE VOLTAGE PROTECTION BIPOLAR(LATCHED) 6.8 mA 20 mA INVERTING OPEN-DRAIN CMOS e0 SURFACE MOUNT 3 PLASTIC/EPOXY TO-243 RECTANGULAR Tin/Lead (Sn/Pb) SOLDER 2.6 mm 1.53 mm 4.55 mm MICRONAS SEMICONDUCTOR HOLDING AG compliant TO-243