Findchips: Parametric Search Results for hn27c256

Parametric results for: hn27c256 under OTP ROMs

Select parts from the table below to compare.

Compare


Select Parts		Part Number

		HN27C256AP-15 Hitachi Ltd
		HN27C256HP-10 Hitachi Ltd
		HN27C256AP-12 Hitachi Ltd
		HN27C256HG-80 Hitachi Ltd
		HN27C256G-20 Hitachi Ltd
		HN27C256FP-30T Hitachi Ltd
		HN27C256HG-70 Renesas Electronics Corporation
		HN27C256HFP-10T Renesas Electronics Corporation
		HN27C256G-30 Hitachi Ltd
		HN27C256HFP-85T Hitachi Ltd

			Most Relevant					Technical															Compliance			Operating Conditions	Physical											Dimensions			Other
Composite Price	Rohs Code	Part Life Cycle Code	Memory Density	Memory Width	Organization	Supply Voltage-Nom (Vsup)	Access Time-Max	Memory IC Type	I/O Type	Number of Functions	Number of Words Code	Number of Words	Operating Mode	Output Characteristics	Parallel/Serial	Programming Voltage	Standby Current-Max	Supply Current-Max	Supply Voltage-Max (Vsup)	Supply Voltage-Min (Vsup)	Technology	Temperature Grade	JESD-30 Code	Qualification Status	JESD-609 Code	Operating Temperature-Max	Number of Terminals	Package Body Material	Package Code	Package Equivalence Code	Package Shape	Package Style	Surface Mount	Terminal Finish	Terminal Form	Terminal Pitch	Terminal Position	Seated Height-Max	Length	Width	Ihs Manufacturer	Part Package Code	Package Description	Pin Count	Reach Compliance Code	ECCN Code	HTS Code

Check for Price

Transferred

262.144 kbit

32KX8

5 V

150 ns

OTP ROM

COMMON

32000

32.768 k

ASYNCHRONOUS

3-STATE

PARALLEL

12.5 V

1 mA

30 µA

5.5 V

4.5 V

CMOS

COMMERCIAL

R-PDIP-T28

Not Qualified

70 °C

PLASTIC/EPOXY

DIP

DIP28,.6

RECTANGULAR

IN-LINE

Tin/Lead (Sn/Pb)

THROUGH-HOLE

2.54 mm

DUAL

5.7 mm

35.6 mm

15.24 mm

HITACHI LTD

DIP

DIP, DIP28,.6

unknown

EAR99

8542.32.00.71

Check for Price

Transferred

262.144 kbit

32KX8

5 V

100 ns

OTP ROM

COMMON

32000

32.768 k

ASYNCHRONOUS

3-STATE

PARALLEL

12.5 V

15 mA

40 µA

5.5 V

4.5 V

CMOS

COMMERCIAL

R-PDIP-T28

Not Qualified

70 °C

PLASTIC/EPOXY

DIP

DIP28,.6

RECTANGULAR

IN-LINE

Tin/Lead (Sn/Pb)

THROUGH-HOLE

2.54 mm

DUAL

5.7 mm

35.6 mm

15.24 mm

HITACHI LTD

DIP

DIP, DIP28,.6

unknown

EAR99

8542.32.00.71

Check for Price

Transferred

262.144 kbit

32KX8

5 V

120 ns

OTP ROM

COMMON

32000

32.768 k

ASYNCHRONOUS

3-STATE

PARALLEL

12.5 V

1 mA

30 µA

5.5 V

4.5 V

CMOS

COMMERCIAL

R-PDIP-T28

Not Qualified

70 °C

PLASTIC/EPOXY

DIP

DIP28,.6

RECTANGULAR

IN-LINE

Tin/Lead (Sn/Pb)

THROUGH-HOLE

2.54 mm

DUAL

5.7 mm

35.6 mm

15.24 mm

HITACHI LTD

DIP

DIP, DIP28,.6

unknown

EAR99

8542.32.00.71

Check for Price

Obsolete

262.144 kbit

32KX8

5 V

80 ns

UVPROM

COMMON

32000

32.768 k

ASYNCHRONOUS

3-STATE

PARALLEL

12.5 V

15 mA

50 µA

CMOS

COMMERCIAL

R-XDIP-T28

Not Qualified

70 °C

CERAMIC

DIP

DIP28,.6

RECTANGULAR

IN-LINE

Tin/Lead (Sn/Pb)

THROUGH-HOLE

2.54 mm

DUAL

HITACHI LTD

DIP, DIP28,.6

unknown

EAR99

8542.32.00.61

Check for Price

Transferred

262.144 kbit

32KX8

5 V

200 ns

UVPROM

COMMON

32000

32.768 k

ASYNCHRONOUS

3-STATE

PARALLEL

12.5 V

20 µA

30 µA

5.25 V

4.75 V

CMOS

COMMERCIAL

R-GDIP-T28

Not Qualified

70 °C

CERAMIC, GLASS-SEALED

WDIP

DIP28,.6

RECTANGULAR

IN-LINE, WINDOW

Tin/Lead (Sn/Pb)

THROUGH-HOLE

2.54 mm

DUAL

5.89 mm

36.83 mm

15.24 mm

HITACHI LTD

DIP

WDIP, DIP28,.6

unknown

EAR99

8542.32.00.61

Check for Price

Transferred

262.144 kbit

32KX8

5 V

300 ns

OTP ROM

COMMON

32000

32.768 k

ASYNCHRONOUS

3-STATE

PARALLEL

12.5 V

20 µA

21 µA

5.25 V

4.75 V

CMOS

COMMERCIAL

R-PDSO-G28

Not Qualified

70 °C

PLASTIC/EPOXY

SOP

SOP28,.5

RECTANGULAR

SMALL OUTLINE

YES

Tin/Lead (Sn/Pb)

GULL WING

1.27 mm

DUAL

3 mm

18.3 mm

8.4 mm

HITACHI LTD

SOIC

SOP, SOP28,.5

unknown

EAR99

8542.32.00.71

Check for Price

Obsolete

262.144 kbit

32KX8

5 V

70 ns

UVPROM

32000

32.768 k

ASYNCHRONOUS

PARALLEL

30 µA

5.5 V

4.5 V

CMOS

COMMERCIAL

R-GDIP-T28

Not Qualified

70 °C

CERAMIC, GLASS-SEALED

WDIP

RECTANGULAR

IN-LINE, WINDOW

THROUGH-HOLE

2.54 mm

DUAL

5.89 mm

36.83 mm

15.24 mm

RENESAS TECHNOLOGY CORP

DIP

0.600 INCH, CERDIP-28

unknown

EAR99

8542.32.00.61

Check for Price

Obsolete

262.144 kbit

32KX8

5 V

100 ns

OTP ROM

32000

32.768 k

ASYNCHRONOUS

PARALLEL

5.5 V

4.5 V

CMOS

COMMERCIAL

R-PDSO-G28

Not Qualified

70 °C

PLASTIC/EPOXY

SOP

RECTANGULAR

SMALL OUTLINE

YES

GULL WING

1.27 mm

DUAL

3 mm

18 mm

8.4 mm

RENESAS TECHNOLOGY CORP

SOIC

PLASTIC, SOP-28

unknown

EAR99

8542.32.00.71

Check for Price

Transferred

262.144 kbit

32KX8

5 V

300 ns

UVPROM

COMMON

32000

32.768 k

ASYNCHRONOUS

3-STATE

PARALLEL

12.5 V

20 µA

21 µA

5.25 V

4.75 V

CMOS

COMMERCIAL

R-GDIP-T28

Not Qualified

70 °C

CERAMIC, GLASS-SEALED

WDIP

DIP28,.6

RECTANGULAR

IN-LINE, WINDOW

Tin/Lead (Sn/Pb)

THROUGH-HOLE

2.54 mm

DUAL

5.89 mm

36.83 mm

15.24 mm

HITACHI LTD

DIP

WDIP, DIP28,.6

unknown

EAR99

8542.32.00.61

Check for Price

Transferred

262.144 kbit

32KX8

5 V

85 ns

OTP ROM

COMMON

32000

32.768 k

ASYNCHRONOUS

3-STATE

PARALLEL

12.5 V

15 mA

40 µA

5.5 V

4.5 V

CMOS

COMMERCIAL

R-PDSO-G28

Not Qualified

70 °C

PLASTIC/EPOXY

SOP

SOP28,.5

RECTANGULAR

SMALL OUTLINE

YES

Tin/Lead (Sn/Pb)

GULL WING

1.27 mm

DUAL

3 mm

18 mm

8.4 mm

HITACHI LTD

SOIC

SOP, SOP28,.5

unknown

EAR99

8542.32.00.71

1 2 3 4 Next

Compare

HN27C256AP-15

Hitachi Ltd

Check for Price

Transferred

262.144 kbit

32KX8

5 V

150 ns

OTP ROM

COMMON

32000

32.768 k

ASYNCHRONOUS

3-STATE

PARALLEL

12.5 V

1 mA

30 µA

5.5 V

4.5 V

CMOS

COMMERCIAL

R-PDIP-T28

Not Qualified

70 °C

PLASTIC/EPOXY

DIP

DIP28,.6

RECTANGULAR

IN-LINE

Tin/Lead (Sn/Pb)

THROUGH-HOLE

2.54 mm

DUAL

5.7 mm

35.6 mm

15.24 mm

HITACHI LTD

DIP

DIP, DIP28,.6

unknown

EAR99

8542.32.00.71

HN27C256HP-10

Hitachi Ltd

Check for Price

Transferred

262.144 kbit

32KX8

5 V

100 ns

OTP ROM

COMMON

32000

32.768 k

ASYNCHRONOUS

3-STATE

PARALLEL

12.5 V

15 mA

40 µA

5.5 V

4.5 V

CMOS

COMMERCIAL

R-PDIP-T28

Not Qualified

70 °C

PLASTIC/EPOXY

DIP

DIP28,.6

RECTANGULAR

IN-LINE

Tin/Lead (Sn/Pb)

THROUGH-HOLE

2.54 mm

DUAL

5.7 mm

35.6 mm

15.24 mm

HITACHI LTD

DIP

DIP, DIP28,.6

unknown

EAR99

8542.32.00.71

HN27C256AP-12

Hitachi Ltd

Check for Price

Transferred

262.144 kbit

32KX8

5 V

120 ns

OTP ROM

COMMON

32000

32.768 k

ASYNCHRONOUS

3-STATE

PARALLEL

12.5 V

1 mA

30 µA

5.5 V

4.5 V

CMOS

COMMERCIAL

R-PDIP-T28

Not Qualified

70 °C

PLASTIC/EPOXY

DIP

DIP28,.6

RECTANGULAR

IN-LINE

Tin/Lead (Sn/Pb)

THROUGH-HOLE

2.54 mm

DUAL

5.7 mm

35.6 mm

15.24 mm

HITACHI LTD

DIP

DIP, DIP28,.6

unknown

EAR99

8542.32.00.71

HN27C256HG-80

Hitachi Ltd

Check for Price

Obsolete

262.144 kbit

32KX8

5 V

80 ns

UVPROM

COMMON

32000

32.768 k

ASYNCHRONOUS

3-STATE

PARALLEL

12.5 V

15 mA

50 µA

CMOS

COMMERCIAL

R-XDIP-T28

Not Qualified

70 °C

CERAMIC

DIP

DIP28,.6

RECTANGULAR

IN-LINE

Tin/Lead (Sn/Pb)

THROUGH-HOLE

2.54 mm

DUAL

HITACHI LTD

DIP, DIP28,.6

unknown

EAR99

8542.32.00.61

HN27C256G-20

Hitachi Ltd

Check for Price

Transferred

262.144 kbit

32KX8

5 V

200 ns

UVPROM

COMMON

32000

32.768 k

ASYNCHRONOUS

3-STATE

PARALLEL

12.5 V

20 µA

30 µA

5.25 V

4.75 V

CMOS

COMMERCIAL

R-GDIP-T28

Not Qualified

70 °C

CERAMIC, GLASS-SEALED

WDIP

DIP28,.6

RECTANGULAR

IN-LINE, WINDOW

Tin/Lead (Sn/Pb)

THROUGH-HOLE

2.54 mm

DUAL

5.89 mm

36.83 mm

15.24 mm

HITACHI LTD

DIP

WDIP, DIP28,.6

unknown

EAR99

8542.32.00.61

HN27C256FP-30T

Hitachi Ltd

Check for Price

Transferred

262.144 kbit

32KX8

5 V

300 ns

OTP ROM

COMMON

32000

32.768 k

ASYNCHRONOUS

3-STATE

PARALLEL

12.5 V

20 µA

21 µA

5.25 V

4.75 V

CMOS

COMMERCIAL

R-PDSO-G28

Not Qualified

70 °C

PLASTIC/EPOXY

SOP

SOP28,.5

RECTANGULAR

SMALL OUTLINE

YES

Tin/Lead (Sn/Pb)

GULL WING

1.27 mm

DUAL

3 mm

18.3 mm

8.4 mm

HITACHI LTD

SOIC

SOP, SOP28,.5

unknown

EAR99

8542.32.00.71

HN27C256HG-70

Renesas Electronics Corporation

Check for Price

Obsolete

262.144 kbit

32KX8

5 V

70 ns

UVPROM

32000

32.768 k

ASYNCHRONOUS

PARALLEL

30 µA

5.5 V

4.5 V

CMOS

COMMERCIAL

R-GDIP-T28

Not Qualified

70 °C

CERAMIC, GLASS-SEALED

WDIP

RECTANGULAR

IN-LINE, WINDOW

THROUGH-HOLE

2.54 mm

DUAL

5.89 mm

36.83 mm

15.24 mm

RENESAS TECHNOLOGY CORP

DIP

0.600 INCH, CERDIP-28

unknown

EAR99

8542.32.00.61

HN27C256HFP-10T

Renesas Electronics Corporation

Check for Price

Obsolete

262.144 kbit

32KX8

5 V

100 ns

OTP ROM

32000

32.768 k

ASYNCHRONOUS

PARALLEL

5.5 V

4.5 V

CMOS

COMMERCIAL

R-PDSO-G28

Not Qualified

70 °C

PLASTIC/EPOXY

SOP

RECTANGULAR

SMALL OUTLINE

YES

GULL WING

1.27 mm

DUAL

3 mm

18 mm

8.4 mm

RENESAS TECHNOLOGY CORP

SOIC

PLASTIC, SOP-28

unknown

EAR99

8542.32.00.71

HN27C256G-30

Hitachi Ltd

Check for Price

Transferred

262.144 kbit

32KX8

5 V

300 ns

UVPROM

COMMON

32000

32.768 k

ASYNCHRONOUS

3-STATE

PARALLEL

12.5 V

20 µA

21 µA

5.25 V

4.75 V

CMOS

COMMERCIAL

R-GDIP-T28

Not Qualified

70 °C

CERAMIC, GLASS-SEALED

WDIP

DIP28,.6

RECTANGULAR

IN-LINE, WINDOW

Tin/Lead (Sn/Pb)

THROUGH-HOLE

2.54 mm

DUAL

5.89 mm

36.83 mm

15.24 mm

HITACHI LTD

DIP

WDIP, DIP28,.6

unknown

EAR99

8542.32.00.61

HN27C256HFP-85T

Hitachi Ltd

Check for Price

Transferred

262.144 kbit

32KX8

5 V

85 ns

OTP ROM

COMMON

32000

32.768 k

ASYNCHRONOUS

3-STATE

PARALLEL

12.5 V

15 mA

40 µA

5.5 V

4.5 V

CMOS

COMMERCIAL

R-PDSO-G28

Not Qualified

70 °C

PLASTIC/EPOXY

SOP

SOP28,.5

RECTANGULAR

SMALL OUTLINE

YES

Tin/Lead (Sn/Pb)

GULL WING

1.27 mm

DUAL

3 mm

18 mm

8.4 mm

HITACHI LTD

SOIC

SOP, SOP28,.5

unknown

EAR99

8542.32.00.71

1 2 3 4 Next