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IDT7007S25JG8
Integrated Device Technology Inc
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Check for Price | Yes | Yes | Obsolete | 262.144 kbit | 8 | 32KX8 | 5 V | 25 ns | MULTI-PORT SRAM | COMMON | 2 | 32000 | 32.768 k | ASYNCHRONOUS | 3-STATE | PARALLEL | 15 mA | 4.5 V | 305 µA | 5.5 V | 4.5 V | CMOS | COMMERCIAL | S-PPGA-P68 | Not Qualified | e3 | 1 | 70 °C | 260 | 30 | 68 | PLASTIC/EPOXY | PGA | PGA68,11X11 | SQUARE | GRID ARRAY | NO | Matte Tin (Sn) - annealed | PIN/PEG | 2.54 mm | PERPENDICULAR | INTEGRATED DEVICE TECHNOLOGY INC | unknown | EAR99 | 8542.32.00.41 | |||||||||||||
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IDT7007S25GGI8
Integrated Device Technology Inc
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Check for Price | Yes | Yes | Obsolete | 262.144 kbit | 8 | 32KX8 | 5 V | 25 ns | MULTI-PORT SRAM | COMMON | 2 | 32000 | 32.768 k | ASYNCHRONOUS | 3-STATE | PARALLEL | 30 mA | 4.5 V | 345 µA | 5.5 V | 4.5 V | CMOS | INDUSTRIAL | S-XPGA-P68 | Not Qualified | e3 | 85 °C | -40 °C | 68 | CERAMIC | PGA | PGA68,11X11 | SQUARE | GRID ARRAY | NO | MATTE TIN | PIN/PEG | 2.54 mm | PERPENDICULAR | INTEGRATED DEVICE TECHNOLOGY INC | compliant | EAR99 | 8542.32.00.41 | |||||||||||||||
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IDT7007S25PFGI8
Integrated Device Technology Inc
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Check for Price | Yes | Yes | Obsolete | 262.144 kbit | 8 | 32KX8 | 5 V | 25 ns | MULTI-PORT SRAM | COMMON | 2 | 32000 | 32.768 k | ASYNCHRONOUS | 3-STATE | PARALLEL | 30 mA | 4.5 V | 345 µA | 5.5 V | 4.5 V | CMOS | INDUSTRIAL | S-PQFP-G80 | Not Qualified | e3 | 3 | 85 °C | -40 °C | 260 | 30 | 80 | PLASTIC/EPOXY | QFP | QFP80,.64SQ | SQUARE | FLATPACK | YES | Matte Tin (Sn) - annealed | GULL WING | 635 µm | QUAD | INTEGRATED DEVICE TECHNOLOGY INC | unknown | EAR99 | 8542.32.00.41 | ||||||||||||
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IDT7007S25JG
Integrated Device Technology Inc
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Check for Price | Yes | Yes | Transferred | 262.144 kbit | 8 | 32KX8 | 5 V | 25 ns | MULTI-PORT SRAM | COMMON | 1 | 2 | 32000 | 32.768 k | ASYNCHRONOUS | 3-STATE | PARALLEL | 15 mA | 4.5 V | 305 µA | 5.5 V | 4.5 V | CMOS | COMMERCIAL | S-PQCC-J68 | Not Qualified | e3 | 1 | 70 °C | 260 | 30 | 68 | PLASTIC/EPOXY | QCCJ | PGA68,11X11 | SQUARE | CHIP CARRIER | YES | Matte Tin (Sn) - annealed | J BEND | 1.27 mm | QUAD | 4.572 mm | 24.2062 mm | 24.2062 mm | INTEGRATED DEVICE TECHNOLOGY INC | compliant | EAR99 | 8542.32.00.41 | LCC | QCCJ, PGA68,11X11 | 68 | ||||||
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IDT7007S25PF9
Integrated Device Technology Inc
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Check for Price | No | No | Obsolete | 262.144 kbit | 8 | 32KX8 | 5 V | 25 ns | MULTI-PORT SRAM | INTERRUPT FLAG; SEMAPHORE; AUTOMATIC POWER-DOWN | 1 | 2 | 32000 | 32.768 k | ASYNCHRONOUS | 3-STATE | YES | PARALLEL | 5.5 V | 4.5 V | CMOS | COMMERCIAL | S-PQFP-G80 | Not Qualified | e0 | 3 | 70 °C | NOT SPECIFIED | NOT SPECIFIED | 80 | PLASTIC/EPOXY | LQFP | SQUARE | FLATPACK, LOW PROFILE | YES | Tin/Lead (Sn/Pb) | GULL WING | 650 µm | QUAD | 1.6 mm | 14 mm | 14 mm | INTEGRATED DEVICE TECHNOLOGY INC | compliant | EAR99 | 8542.32.00.41 | QFP | 14 X 14 MM, 1.40 MM HEIGHT, TQFP-80 | 80 | |||||||||
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IDT7007S25GI8
Integrated Device Technology Inc
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Check for Price | No | No | Obsolete | 262.144 kbit | 8 | 32KX8 | 5 V | 25 ns | MULTI-PORT SRAM | COMMON | 2 | 32000 | 32.768 k | ASYNCHRONOUS | 3-STATE | PARALLEL | 30 mA | 4.5 V | 345 µA | 5.5 V | 4.5 V | CMOS | INDUSTRIAL | S-XPGA-P68 | Not Qualified | e0 | 85 °C | -40 °C | 68 | CERAMIC | PGA | PGA68,11X11 | SQUARE | GRID ARRAY | NO | TIN LEAD | PIN/PEG | 2.54 mm | PERPENDICULAR | INTEGRATED DEVICE TECHNOLOGY INC | not_compliant | EAR99 | 8542.32.00.41 | |||||||||||||||
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IDT7007S25PFG
Integrated Device Technology Inc
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Check for Price | Yes | Yes | Transferred | 262.144 kbit | 8 | 32KX8 | 5 V | 25 ns | MULTI-PORT SRAM | COMMON | 1 | 2 | 32000 | 32.768 k | ASYNCHRONOUS | 3-STATE | PARALLEL | 15 mA | 4.5 V | 305 µA | 5.5 V | 4.5 V | CMOS | COMMERCIAL | S-PQFP-G80 | Not Qualified | e3 | 3 | 70 °C | 260 | 30 | 80 | PLASTIC/EPOXY | LQFP | QFP80,.64SQ | SQUARE | FLATPACK, LOW PROFILE | YES | Matte Tin (Sn) - annealed | GULL WING | 650 µm | QUAD | 1.6 mm | 14 mm | 14 mm | INTEGRATED DEVICE TECHNOLOGY INC | compliant | EAR99 | 8542.32.00.41 | QFP | LQFP, QFP80,.64SQ | 80 | ||||||
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IDT7007S25J8
Integrated Device Technology Inc
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Check for Price | No | No | Obsolete | 262.144 kbit | 8 | 32KX8 | 5 V | 25 ns | MULTI-PORT SRAM | INTERRUPT FLAG; SEMAPHORE; AUTOMATIC POWER-DOWN | COMMON | 1 | 2 | 32000 | 32.768 k | ASYNCHRONOUS | 3-STATE | YES | PARALLEL | 15 mA | 4.5 V | 305 µA | 5.5 V | 4.5 V | CMOS | COMMERCIAL | S-PQCC-J68 | Not Qualified | e0 | 1 | 70 °C | 225 | 20 | 68 | PLASTIC/EPOXY | QCCJ | LDCC68,1.0SQ | SQUARE | CHIP CARRIER | YES | TIN LEAD | J BEND | 1.27 mm | QUAD | 4.57 mm | 24.2062 mm | 24.2062 mm | INTEGRATED DEVICE TECHNOLOGY INC | not_compliant | EAR99 | 8542.32.00.41 | LCC | 0.950 X 0.950 INCH, 0.170 INCH HEIGHT, PLASTIC, LCC-68 | 68 | ||||
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IDT7007S25PFB
Integrated Device Technology Inc
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Check for Price | No | No | Obsolete | 262.144 kbit | 8 | 32KX8 | 5 V | 25 ns | MULTI-PORT SRAM | COMMON | 1 | 2 | 32000 | 32.768 k | ASYNCHRONOUS | 3-STATE | PARALLEL | 30 mA | 4.5 V | 345 µA | 5.5 V | 4.5 V | CMOS | MILITARY | S-PQFP-G80 | Not Qualified | e0 | 3 | 125 °C | -55 °C | 240 | MIL-PRF-38535 | 20 | 80 | PLASTIC/EPOXY | LQFP | QFP80,.64SQ | SQUARE | FLATPACK, LOW PROFILE | YES | Tin/Lead (Sn85Pb15) | GULL WING | 650 µm | QUAD | 1.6 mm | 14 mm | 14 mm | INTEGRATED DEVICE TECHNOLOGY INC | not_compliant | 3A001.A.2.C | 8542.32.00.41 | QFP | LQFP, QFP80,.64SQ | 80 | ||||
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IDT7007S25
Integrated Device Technology Inc
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Check for Price | Transferred | 262.144 kbit | 8 | 32KX8 | 5 V | 25 ns | DUAL-PORT SRAM | 1 | 32000 | 32.768 k | ASYNCHRONOUS | PARALLEL | 5.5 V | 4.5 V | CMOS | COMMERCIAL | S-CPGA-P68 | Not Qualified | e0 | 70 °C | 68 | CERAMIC, METAL-SEALED COFIRED | PGA | SQUARE | GRID ARRAY | NO | TIN LEAD | PIN/PEG | 2.54 mm | PERPENDICULAR | 5.207 mm | 29.464 mm | 29.464 mm | INTEGRATED DEVICE TECHNOLOGY INC | compliant | EAR99 | 8542.32.00.41 | PGA | 1.800 X 1.800 INCH, 0.160 INCH HEIGHT, PGA-68 | 68 |