Findchips: Parametric Search Results for idt7025.

Parametric results for: idt7025. under SRAMs

Select parts from the table below to compare.

Compare


Select Parts		Part Number

		IDT7025L55JGI Integrated Device Technology Inc
		IDT7025S30JG Integrated Device Technology Inc
		IDT7025S55J Integrated Device Technology Inc
		IDT7025L35J Integrated Device Technology Inc
		IDT7025S55JGI Integrated Device Technology Inc
		IDT7025S30PGG Integrated Device Technology Inc
		IDT7025L15PF9 Integrated Device Technology Inc
		IDT7025L20PF9 Integrated Device Technology Inc
		IDT7025S55PFGI Integrated Device Technology Inc
		IDT7025L55GI Integrated Device Technology Inc

				Most Relevant					Technical																		Compliance			Operating Conditions					Physical											Dimensions			Other
Composite Price	Pbfree Code	Rohs Code	Part Life Cycle Code	Memory Density	Memory Width	Organization	Supply Voltage-Nom (Vsup)	Access Time-Max	Memory IC Type	Additional Feature	I/O Type	Number of Functions	Number of Ports	Number of Words Code	Number of Words	Operating Mode	Output Characteristics	Output Enable	Parallel/Serial	Standby Current-Max	Standby Voltage-Min	Supply Current-Max	Supply Voltage-Max (Vsup)	Supply Voltage-Min (Vsup)	Technology	Temperature Grade	JESD-30 Code	Qualification Status	JESD-609 Code	Moisture Sensitivity Level	Operating Temperature-Max	Operating Temperature-Min	Peak Reflow Temperature (Cel)	Time@Peak Reflow Temperature-Max (s)	Number of Terminals	Package Body Material	Package Code	Package Equivalence Code	Package Shape	Package Style	Surface Mount	Terminal Finish	Terminal Form	Terminal Pitch	Terminal Position	Seated Height-Max	Length	Width	Ihs Manufacturer	Part Package Code	Package Description	Pin Count	Reach Compliance Code	ECCN Code	HTS Code

Check for Price

Yes

Transferred

131.072 kbit

8KX16

5 V

55 ns

MULTI-PORT SRAM

CONFIGURABLE AS 8K X 16

8000

8.192 k

ASYNCHRONOUS

PARALLEL

5.5 V

4.5 V

CMOS

INDUSTRIAL

S-PQCC-J84

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

QCCJ

SQUARE

CHIP CARRIER

YES

MATTE TIN

J BEND

1.27 mm

QUAD

4.57 mm

29.3116 mm

INTEGRATED DEVICE TECHNOLOGY INC

LCC

QCCJ,

compliant

EAR99

8542.32.00.41

Check for Price

Yes

Obsolete

131.072 kbit

8KX16

5 V

30 ns

MULTI-PORT SRAM

INTERRUPT FLAG; AUTOMATIC POWER-DOWN; SEMAPHORE

8000

8.192 k

ASYNCHRONOUS

3-STATE

YES

PARALLEL

5.5 V

4.5 V

CMOS

COMMERCIAL

S-PQCC-J84

Not Qualified

70 °C

PLASTIC/EPOXY

QCCJ

SQUARE

CHIP CARRIER

YES

MATTE TIN

J BEND

1.27 mm

QUAD

4.57 mm

29.3116 mm

INTEGRATED DEVICE TECHNOLOGY INC

LCC

PLASTIC, LCC-84

compliant

EAR99

8542.32.00.41

Check for Price

Obsolete

131.072 kbit

8KX16

5 V

55 ns

MULTI-PORT SRAM

INTERRUPT FLAG; AUTOMATIC POWER-DOWN; SEMAPHORE

COMMON

8000

8.192 k

ASYNCHRONOUS

3-STATE

YES

PARALLEL

15 mA

4.5 V

250 µA

5.5 V

4.5 V

CMOS

COMMERCIAL

S-PQCC-J84

Not Qualified

70 °C

225

PLASTIC/EPOXY

QCCJ

LDCC84,1.2SQ

SQUARE

CHIP CARRIER

YES

TIN LEAD

J BEND

1.27 mm

QUAD

4.57 mm

29.3116 mm

INTEGRATED DEVICE TECHNOLOGY INC

LCC

PLASTIC, LCC-84

not_compliant

EAR99

8542.32.00.41

Check for Price

Obsolete

131.072 kbit

8KX16

5 V

35 ns

MULTI-PORT SRAM

INTERRUPT FLAG; AUTOMATIC POWER-DOWN; SEMAPHORE; BATTERY BACKUP

COMMON

8000

8.192 k

ASYNCHRONOUS

3-STATE

YES

PARALLEL

1.5 mA

2 V

210 µA

5.5 V

4.5 V

CMOS

COMMERCIAL

S-PQCC-J84

Not Qualified

70 °C

225

PLASTIC/EPOXY

QCCJ

LDCC84,1.2SQ

SQUARE

CHIP CARRIER

YES

Tin/Lead (Sn85Pb15)

J BEND

1.27 mm

QUAD

4.57 mm

29.3116 mm

INTEGRATED DEVICE TECHNOLOGY INC

LCC

PLASTIC, LCC-84

not_compliant

EAR99

8542.32.00.41

Check for Price

Yes

Transferred

131.072 kbit

8KX16

5 V

55 ns

MULTI-PORT SRAM

BATTERY BACK UP

8000

8.192 k

ASYNCHRONOUS

PARALLEL

5.5 V

4.5 V

CMOS

INDUSTRIAL

S-PQCC-J84

Not Qualified

85 °C

-40 °C

260

PLASTIC/EPOXY

QCCJ

SQUARE

CHIP CARRIER

YES

TIN

J BEND

1.27 mm

QUAD

4.57 mm

29.3116 mm

INTEGRATED DEVICE TECHNOLOGY INC

LCC

QCCJ,

compliant

EAR99

8542.32.00.41

Check for Price

Yes

Obsolete

131.072 kbit

8KX16

5 V

30 ns

MULTI-PORT SRAM

INTERRUPT FLAG; AUTOMATIC POWER-DOWN; SEMAPHORE

8000

8.192 k

ASYNCHRONOUS

3-STATE

YES

PARALLEL

5.5 V

4.5 V

CMOS

COMMERCIAL

S-PPGA-P84

Not Qualified

70 °C

PLASTIC/EPOXY

PGA

SQUARE

GRID ARRAY

MATTE TIN

PIN/PEG

2.54 mm

PERPENDICULAR

5.842 mm

29.464 mm

INTEGRATED DEVICE TECHNOLOGY INC

PGA

PLASTIC, PGA-84

compliant

EAR99

8542.32.00.41

Check for Price

Obsolete

131.072 kbit

8KX16

5 V

15 ns

MULTI-PORT SRAM

INTERRUPT FLAG; AUTOMATIC POWER-DOWN; SEMAPHORE; BATTERY BACKUP

8000

8.192 k

ASYNCHRONOUS

3-STATE

YES

PARALLEL

2 V

5.5 V

4.5 V

CMOS

COMMERCIAL

S-PQFP-G100

Not Qualified

70 °C

NOT SPECIFIED

100

PLASTIC/EPOXY

LFQFP

SQUARE

FLATPACK, LOW PROFILE, FINE PITCH

YES

Tin/Lead (Sn/Pb)

GULL WING

500 µm

QUAD

1.6 mm

14 mm

INTEGRATED DEVICE TECHNOLOGY INC

QFP

TQFP-100

100

compliant

EAR99

8542.32.00.41

Check for Price

Obsolete

131.072 kbit

8KX16

5 V

20 ns

MULTI-PORT SRAM

INTERRUPT FLAG; AUTOMATIC POWER-DOWN; SEMAPHORE; BATTERY BACKUP

8000

8.192 k

ASYNCHRONOUS

3-STATE

YES

PARALLEL

2 V

5.5 V

4.5 V

CMOS

COMMERCIAL

S-PQFP-G100

Not Qualified

70 °C

NOT SPECIFIED

100

PLASTIC/EPOXY

LFQFP

SQUARE

FLATPACK, LOW PROFILE, FINE PITCH

YES

Tin/Lead (Sn/Pb)

GULL WING

500 µm

QUAD

1.6 mm

14 mm

INTEGRATED DEVICE TECHNOLOGY INC

QFP

TQFP-100

100

compliant

EAR99

8542.32.00.41

Check for Price

Yes

Transferred

131.072 kbit

8KX16

5 V

55 ns

MULTI-PORT SRAM

8000

8.192 k

ASYNCHRONOUS

PARALLEL

5.5 V

4.5 V

CMOS

INDUSTRIAL

S-PQFP-G100

Not Qualified

85 °C

-40 °C

NOT SPECIFIED

100

PLASTIC/EPOXY

LFQFP

SQUARE

FLATPACK, LOW PROFILE, FINE PITCH

YES

Matte Tin (Sn)

GULL WING

500 µm

QUAD

1.6 mm

14 mm

INTEGRATED DEVICE TECHNOLOGY INC

QFP

LFQFP,

100

compliant

EAR99

8542.32.00.41

Check for Price

Yes

Transferred

131.072 kbit

8KX16

5 V

55 ns

MULTI-PORT SRAM

8000

8.192 k

ASYNCHRONOUS

PARALLEL

5.5 V

4.5 V

CMOS

INDUSTRIAL

S-CPGA-P84

Not Qualified

85 °C

-40 °C

CERAMIC, METAL-SEALED COFIRED

PGA

SQUARE

GRID ARRAY

MATTE TIN

PIN/PEG

2.54 mm

PERPENDICULAR

5.207 mm

30.6705 mm

INTEGRATED DEVICE TECHNOLOGY INC

PGA

PGA,

not_compliant

EAR99

8542.32.00.41

1 2 3 4 5 Next

Compare

IDT7025L55JGI

Integrated Device Technology Inc

Check for Price

Yes

Transferred

131.072 kbit

8KX16

5 V

55 ns

MULTI-PORT SRAM

CONFIGURABLE AS 8K X 16

8000

8.192 k

ASYNCHRONOUS

PARALLEL

5.5 V

4.5 V

CMOS

INDUSTRIAL

S-PQCC-J84

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

QCCJ

SQUARE

CHIP CARRIER

YES

MATTE TIN

J BEND

1.27 mm

QUAD

4.57 mm

29.3116 mm

INTEGRATED DEVICE TECHNOLOGY INC

LCC

QCCJ,

compliant

EAR99

8542.32.00.41

IDT7025S30JG

Integrated Device Technology Inc

Check for Price

Yes

Obsolete

131.072 kbit

8KX16

5 V

30 ns

MULTI-PORT SRAM

INTERRUPT FLAG; AUTOMATIC POWER-DOWN; SEMAPHORE

8000

8.192 k

ASYNCHRONOUS

3-STATE

YES

PARALLEL

5.5 V

4.5 V

CMOS

COMMERCIAL

S-PQCC-J84

Not Qualified

70 °C

PLASTIC/EPOXY

QCCJ

SQUARE

CHIP CARRIER

YES

MATTE TIN

J BEND

1.27 mm

QUAD

4.57 mm

29.3116 mm

INTEGRATED DEVICE TECHNOLOGY INC

LCC

PLASTIC, LCC-84

compliant

EAR99

8542.32.00.41

IDT7025S55J

Integrated Device Technology Inc

Check for Price

Obsolete

131.072 kbit

8KX16

5 V

55 ns

MULTI-PORT SRAM

INTERRUPT FLAG; AUTOMATIC POWER-DOWN; SEMAPHORE

COMMON

8000

8.192 k

ASYNCHRONOUS

3-STATE

YES

PARALLEL

15 mA

4.5 V

250 µA

5.5 V

4.5 V

CMOS

COMMERCIAL

S-PQCC-J84

Not Qualified

70 °C

225

PLASTIC/EPOXY

QCCJ

LDCC84,1.2SQ

SQUARE

CHIP CARRIER

YES

TIN LEAD

J BEND

1.27 mm

QUAD

4.57 mm

29.3116 mm

INTEGRATED DEVICE TECHNOLOGY INC

LCC

PLASTIC, LCC-84

not_compliant

EAR99

8542.32.00.41

IDT7025L35J

Integrated Device Technology Inc

Check for Price

Obsolete

131.072 kbit

8KX16

5 V

35 ns

MULTI-PORT SRAM

INTERRUPT FLAG; AUTOMATIC POWER-DOWN; SEMAPHORE; BATTERY BACKUP

COMMON

8000

8.192 k

ASYNCHRONOUS

3-STATE

YES

PARALLEL

1.5 mA

2 V

210 µA

5.5 V

4.5 V

CMOS

COMMERCIAL

S-PQCC-J84

Not Qualified

70 °C

225

PLASTIC/EPOXY

QCCJ

LDCC84,1.2SQ

SQUARE

CHIP CARRIER

YES

Tin/Lead (Sn85Pb15)

J BEND

1.27 mm

QUAD

4.57 mm

29.3116 mm

INTEGRATED DEVICE TECHNOLOGY INC

LCC

PLASTIC, LCC-84

not_compliant

EAR99

8542.32.00.41

IDT7025S55JGI

Integrated Device Technology Inc

Check for Price

Yes

Transferred

131.072 kbit

8KX16

5 V

55 ns

MULTI-PORT SRAM

BATTERY BACK UP

8000

8.192 k

ASYNCHRONOUS

PARALLEL

5.5 V

4.5 V

CMOS

INDUSTRIAL

S-PQCC-J84

Not Qualified

85 °C

-40 °C

260

PLASTIC/EPOXY

QCCJ

SQUARE

CHIP CARRIER

YES

TIN

J BEND

1.27 mm

QUAD

4.57 mm

29.3116 mm

INTEGRATED DEVICE TECHNOLOGY INC

LCC

QCCJ,

compliant

EAR99

8542.32.00.41

IDT7025S30PGG

Integrated Device Technology Inc

Check for Price

Yes

Obsolete

131.072 kbit

8KX16

5 V

30 ns

MULTI-PORT SRAM

INTERRUPT FLAG; AUTOMATIC POWER-DOWN; SEMAPHORE

8000

8.192 k

ASYNCHRONOUS

3-STATE

YES

PARALLEL

5.5 V

4.5 V

CMOS

COMMERCIAL

S-PPGA-P84

Not Qualified

70 °C

PLASTIC/EPOXY

PGA

SQUARE

GRID ARRAY

MATTE TIN

PIN/PEG

2.54 mm

PERPENDICULAR

5.842 mm

29.464 mm

INTEGRATED DEVICE TECHNOLOGY INC

PGA

PLASTIC, PGA-84

compliant

EAR99

8542.32.00.41

IDT7025L15PF9

Integrated Device Technology Inc

Check for Price

Obsolete

131.072 kbit

8KX16

5 V

15 ns

MULTI-PORT SRAM

INTERRUPT FLAG; AUTOMATIC POWER-DOWN; SEMAPHORE; BATTERY BACKUP

8000

8.192 k

ASYNCHRONOUS

3-STATE

YES

PARALLEL

2 V

5.5 V

4.5 V

CMOS

COMMERCIAL

S-PQFP-G100

Not Qualified

70 °C

NOT SPECIFIED

100

PLASTIC/EPOXY

LFQFP

SQUARE

FLATPACK, LOW PROFILE, FINE PITCH

YES

Tin/Lead (Sn/Pb)

GULL WING

500 µm

QUAD

1.6 mm

14 mm

INTEGRATED DEVICE TECHNOLOGY INC

QFP

TQFP-100

100

compliant

EAR99

8542.32.00.41

IDT7025L20PF9

Integrated Device Technology Inc

Check for Price

Obsolete

131.072 kbit

8KX16

5 V

20 ns

MULTI-PORT SRAM

INTERRUPT FLAG; AUTOMATIC POWER-DOWN; SEMAPHORE; BATTERY BACKUP

8000

8.192 k

ASYNCHRONOUS

3-STATE

YES

PARALLEL

2 V

5.5 V

4.5 V

CMOS

COMMERCIAL

S-PQFP-G100

Not Qualified

70 °C

NOT SPECIFIED

100

PLASTIC/EPOXY

LFQFP

SQUARE

FLATPACK, LOW PROFILE, FINE PITCH

YES

Tin/Lead (Sn/Pb)

GULL WING

500 µm

QUAD

1.6 mm

14 mm

INTEGRATED DEVICE TECHNOLOGY INC

QFP

TQFP-100

100

compliant

EAR99

8542.32.00.41

IDT7025S55PFGI

Integrated Device Technology Inc

Check for Price

Yes

Transferred

131.072 kbit

8KX16

5 V

55 ns

MULTI-PORT SRAM

8000

8.192 k

ASYNCHRONOUS

PARALLEL

5.5 V

4.5 V

CMOS

INDUSTRIAL

S-PQFP-G100

Not Qualified

85 °C

-40 °C

NOT SPECIFIED

100

PLASTIC/EPOXY

LFQFP

SQUARE

FLATPACK, LOW PROFILE, FINE PITCH

YES

Matte Tin (Sn)

GULL WING

500 µm

QUAD

1.6 mm

14 mm

INTEGRATED DEVICE TECHNOLOGY INC

QFP

LFQFP,

100

compliant

EAR99

8542.32.00.41

IDT7025L55GI

Integrated Device Technology Inc

Check for Price

Yes

Transferred

131.072 kbit

8KX16

5 V

55 ns

MULTI-PORT SRAM

8000

8.192 k

ASYNCHRONOUS

PARALLEL

5.5 V

4.5 V

CMOS

INDUSTRIAL

S-CPGA-P84

Not Qualified

85 °C

-40 °C

CERAMIC, METAL-SEALED COFIRED

PGA

SQUARE

GRID ARRAY

MATTE TIN

PIN/PEG

2.54 mm

PERPENDICULAR

5.207 mm

30.6705 mm

INTEGRATED DEVICE TECHNOLOGY INC

PGA

PGA,

not_compliant

EAR99

8542.32.00.41

1 2 3 4 5 Next