Findchips: Parametric Search Results for idt71v3557s80bq


Select Parts		Part Number

		IDT71V3557S80BQG Integrated Device Technology Inc
		IDT71V3557S80BQI Integrated Device Technology Inc
		IDT71V3557S80BQGI Integrated Device Technology Inc
		IDT71V3557S80BQ Integrated Device Technology Inc

				Most Relevant						Technical																Compliance			Operating Conditions					Physical											Dimensions			Other
Composite Price	Pbfree Code	Rohs Code	Part Life Cycle Code	Memory Density	Memory Width	Organization	Supply Voltage-Nom (Vsup)	Access Time-Max	Clock Frequency-Max (fCLK)	Memory IC Type	Additional Feature	I/O Type	Number of Functions	Number of Words Code	Number of Words	Operating Mode	Output Characteristics	Parallel/Serial	Standby Current-Max	Standby Voltage-Min	Supply Current-Max	Supply Voltage-Max (Vsup)	Supply Voltage-Min (Vsup)	Technology	Temperature Grade	JESD-30 Code	Qualification Status	JESD-609 Code	Moisture Sensitivity Level	Operating Temperature-Max	Operating Temperature-Min	Peak Reflow Temperature (Cel)	Time@Peak Reflow Temperature-Max (s)	Number of Terminals	Package Body Material	Package Code	Package Equivalence Code	Package Shape	Package Style	Surface Mount	Terminal Finish	Terminal Form	Terminal Pitch	Terminal Position	Seated Height-Max	Length	Width	Ihs Manufacturer	Part Package Code	Package Description	Pin Count	Reach Compliance Code	ECCN Code	HTS Code

Check for Price

Yes

Transferred

4.7186 Mbit

128KX36

3.3 V

8 ns

95 MHz

CACHE SRAM

FLOW-THROUGH ARCHITECTURE

COMMON

128000

131.072 k

SYNCHRONOUS

3-STATE

PARALLEL

40 mA

3.14 V

250 µA

3.465 V

3.135 V

CMOS

COMMERCIAL

R-PBGA-B165

Not Qualified

70 °C

260

165

PLASTIC/EPOXY

TBGA

BGA165,11X15,40

RECTANGULAR

GRID ARRAY, THIN PROFILE

YES

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

1 mm

BOTTOM

1.2 mm

15 mm

13 mm

INTEGRATED DEVICE TECHNOLOGY INC

BGA

TBGA, BGA165,11X15,40

165

compliant

3A991.B.2.A

8542.32.00.41

Check for Price

Obsolete

4.7186 Mbit

128KX36

3.3 V

8 ns

95 MHz

ZBT SRAM

FLOW-THROUGH ARCHITECTURE

COMMON

128000

131.072 k

SYNCHRONOUS

3-STATE

PARALLEL

45 mA

3.14 V

260 µA

3.465 V

3.135 V

CMOS

INDUSTRIAL

R-PBGA-B165

Not Qualified

85 °C

-40 °C

225

165

PLASTIC/EPOXY

TBGA

BGA165,11X15,40

RECTANGULAR

GRID ARRAY, THIN PROFILE

YES

TIN LEAD

BALL

1 mm

BOTTOM

1.2 mm

15 mm

13 mm

INTEGRATED DEVICE TECHNOLOGY INC

BGA

13 X 15 MM, FBGA-165

165

not_compliant

3A991.B.2.A

8542.32.00.41

Check for Price

Yes

Transferred

4.7186 Mbit

128KX36

3.3 V

8 ns

95 MHz

CACHE SRAM

FLOW-THROUGH ARCHITECTURE

COMMON

128000

131.072 k

SYNCHRONOUS

3-STATE

PARALLEL

45 mA

3.14 V

260 µA

3.465 V

3.135 V

CMOS

INDUSTRIAL

R-PBGA-B165

Not Qualified

85 °C

-40 °C

260

165

PLASTIC/EPOXY

TBGA

BGA165,11X15,40

RECTANGULAR

GRID ARRAY, THIN PROFILE

YES

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

1 mm

BOTTOM

1.2 mm

15 mm

13 mm

INTEGRATED DEVICE TECHNOLOGY INC

BGA

TBGA, BGA165,11X15,40

165

compliant

3A991.B.2.A

8542.32.00.41

Check for Price

Obsolete

4.7186 Mbit

128KX36

3.3 V

8 ns

95 MHz

ZBT SRAM

FLOW-THROUGH ARCHITECTURE

COMMON

128000

131.072 k

SYNCHRONOUS

3-STATE

PARALLEL

40 mA

3.14 V

250 µA

3.465 V

3.135 V

CMOS

COMMERCIAL

R-PBGA-B165

Not Qualified

70 °C

225

165

PLASTIC/EPOXY

TBGA

BGA165,11X15,40

RECTANGULAR

GRID ARRAY, THIN PROFILE

YES

TIN LEAD

BALL

1 mm

BOTTOM

1.2 mm

15 mm

13 mm

INTEGRATED DEVICE TECHNOLOGY INC

BGA

13 X 15 MM, FBGA-165

165

not_compliant

3A991.B.2.A

8542.32.00.41

Compare

IDT71V3557S80BQG

Integrated Device Technology Inc

Check for Price

Yes

Transferred

4.7186 Mbit

128KX36

3.3 V

8 ns

95 MHz

CACHE SRAM

FLOW-THROUGH ARCHITECTURE

COMMON

128000

131.072 k

SYNCHRONOUS

3-STATE

PARALLEL

40 mA

3.14 V

250 µA

3.465 V

3.135 V

CMOS

COMMERCIAL

R-PBGA-B165

Not Qualified

70 °C

260

165

PLASTIC/EPOXY

TBGA

BGA165,11X15,40

RECTANGULAR

GRID ARRAY, THIN PROFILE

YES

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

1 mm

BOTTOM

1.2 mm

15 mm

13 mm

INTEGRATED DEVICE TECHNOLOGY INC

BGA

TBGA, BGA165,11X15,40

165

compliant

3A991.B.2.A

8542.32.00.41

IDT71V3557S80BQI

Integrated Device Technology Inc

Check for Price

Obsolete

4.7186 Mbit

128KX36

3.3 V

8 ns

95 MHz

ZBT SRAM

FLOW-THROUGH ARCHITECTURE

COMMON

128000

131.072 k

SYNCHRONOUS

3-STATE

PARALLEL

45 mA

3.14 V

260 µA

3.465 V

3.135 V

CMOS

INDUSTRIAL

R-PBGA-B165

Not Qualified

85 °C

-40 °C

225

165

PLASTIC/EPOXY

TBGA

BGA165,11X15,40

RECTANGULAR

GRID ARRAY, THIN PROFILE

YES

TIN LEAD

BALL

1 mm

BOTTOM

1.2 mm

15 mm

13 mm

INTEGRATED DEVICE TECHNOLOGY INC

BGA

13 X 15 MM, FBGA-165

165

not_compliant

3A991.B.2.A

8542.32.00.41

IDT71V3557S80BQGI

Integrated Device Technology Inc

Check for Price

Yes

Transferred

4.7186 Mbit

128KX36

3.3 V

8 ns

95 MHz

CACHE SRAM

FLOW-THROUGH ARCHITECTURE

COMMON

128000

131.072 k

SYNCHRONOUS

3-STATE

PARALLEL

45 mA

3.14 V

260 µA

3.465 V

3.135 V

CMOS

INDUSTRIAL

R-PBGA-B165

Not Qualified

85 °C

-40 °C

260

165

PLASTIC/EPOXY

TBGA

BGA165,11X15,40

RECTANGULAR

GRID ARRAY, THIN PROFILE

YES

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

1 mm

BOTTOM

1.2 mm

15 mm

13 mm

INTEGRATED DEVICE TECHNOLOGY INC

BGA

TBGA, BGA165,11X15,40

165

compliant

3A991.B.2.A

8542.32.00.41

IDT71V3557S80BQ

Integrated Device Technology Inc

Check for Price

Obsolete

4.7186 Mbit

128KX36

3.3 V

8 ns

95 MHz

ZBT SRAM

FLOW-THROUGH ARCHITECTURE

COMMON

128000

131.072 k

SYNCHRONOUS

3-STATE

PARALLEL

40 mA

3.14 V

250 µA

3.465 V

3.135 V

CMOS

COMMERCIAL

R-PBGA-B165

Not Qualified

70 °C

225

165

PLASTIC/EPOXY

TBGA

BGA165,11X15,40

RECTANGULAR

GRID ARRAY, THIN PROFILE

YES

TIN LEAD

BALL

1 mm

BOTTOM

1.2 mm

15 mm

13 mm

INTEGRATED DEVICE TECHNOLOGY INC

BGA

13 X 15 MM, FBGA-165

165

not_compliant

3A991.B.2.A

8542.32.00.41

Parametric results for: idt71v3557s80bq under SRAMs