Findchips: Parametric Search Results for idt71v35761s183pf


Select Parts		Part Number

		IDT71V35761S183PF9 Integrated Device Technology Inc
		IDT71V35761S183PF Integrated Device Technology Inc
		IDT71V35761S183PFG Integrated Device Technology Inc
		IDT71V35761S183PF8 Integrated Device Technology Inc
		IDT71V35761S183PFGI Integrated Device Technology Inc
		IDT71V35761S183PFI8 Integrated Device Technology Inc
		IDT71V35761S183PFI Integrated Device Technology Inc
		IDT71V35761S183PFI9 Integrated Device Technology Inc
		IDT71V35761S183PFG8 Integrated Device Technology Inc

				Most Relevant						Technical																Compliance			Operating Conditions					Physical											Dimensions			Other
Composite Price	Pbfree Code	Rohs Code	Part Life Cycle Code	Memory Density	Memory Width	Organization	Supply Voltage-Nom (Vsup)	Access Time-Max	Clock Frequency-Max (fCLK)	Memory IC Type	Additional Feature	I/O Type	Number of Functions	Number of Words Code	Number of Words	Operating Mode	Output Characteristics	Parallel/Serial	Standby Current-Max	Standby Voltage-Min	Supply Current-Max	Supply Voltage-Max (Vsup)	Supply Voltage-Min (Vsup)	Technology	Temperature Grade	JESD-30 Code	Qualification Status	JESD-609 Code	Moisture Sensitivity Level	Operating Temperature-Max	Operating Temperature-Min	Peak Reflow Temperature (Cel)	Time@Peak Reflow Temperature-Max (s)	Number of Terminals	Package Body Material	Package Code	Package Equivalence Code	Package Shape	Package Style	Surface Mount	Terminal Finish	Terminal Form	Terminal Pitch	Terminal Position	Seated Height-Max	Length	Width	Ihs Manufacturer	Part Package Code	Package Description	Pin Count	Reach Compliance Code	ECCN Code	HTS Code	Date Of Intro

Check for Price

Obsolete

4.7186 Mbit

128KX36

3.3 V

3.3 ns

CACHE SRAM

PIPELINED ARCHITECTURE

128000

131.072 k

SYNCHRONOUS

PARALLEL

3.465 V

3.135 V

CMOS

COMMERCIAL

R-PQFP-G100

Not Qualified

70 °C

NOT SPECIFIED

100

PLASTIC/EPOXY

LQFP

RECTANGULAR

FLATPACK, LOW PROFILE

YES

Tin/Lead (Sn/Pb)

GULL WING

650 µm

QUAD

1.6 mm

20 mm

14 mm

INTEGRATED DEVICE TECHNOLOGY INC

QFP

LQFP,

100

compliant

3A991.B.2.A

8542.32.00.41

Check for Price

Obsolete

4.7186 Mbit

128KX36

3.3 V

3.3 ns

183 MHz

CACHE SRAM

PIPELINED ARCHITECTURE

COMMON

128000

131.072 k

SYNCHRONOUS

3-STATE

PARALLEL

30 mA

3.14 V

340 µA

3.465 V

3.135 V

CMOS

COMMERCIAL

R-PQFP-G100

Not Qualified

70 °C

225

100

PLASTIC/EPOXY

LQFP

QFP100,.63X.87

RECTANGULAR

FLATPACK, LOW PROFILE

YES

Tin/Lead (Sn85Pb15)

GULL WING

650 µm

QUAD

1.6 mm

20 mm

14 mm

INTEGRATED DEVICE TECHNOLOGY INC

QFP

14 X 20 MM, PLASTIC, TQFP-100

100

not_compliant

3A991.B.2.A

8542.32.00.41

Check for Price

Yes

Transferred

4.7186 Mbit

128KX36

3.3 V

3.3 ns

CACHE SRAM

PIPELINED ARCHITECTURE

128000

131.072 k

SYNCHRONOUS

PARALLEL

3.465 V

3.135 V

CMOS

COMMERCIAL

R-PQFP-G100

Not Qualified

70 °C

NOT SPECIFIED

100

PLASTIC/EPOXY

LQFP

RECTANGULAR

FLATPACK, LOW PROFILE

YES

Matte Tin (Sn)

GULL WING

650 µm

QUAD

1.6 mm

20 mm

14 mm

INTEGRATED DEVICE TECHNOLOGY INC

QFP

LQFP,

100

compliant

3A991.B.2.A

8542.32.00.41

Check for Price

Obsolete

4.7186 Mbit

128KX36

3.3 V

3.3 ns

183 MHz

CACHE SRAM

PIPELINED ARCHITECTURE

COMMON

128000

131.072 k

SYNCHRONOUS

3-STATE

PARALLEL

30 mA

3.14 V

340 µA

3.465 V

3.135 V

CMOS

COMMERCIAL

R-PQFP-G100

Not Qualified

70 °C

225

100

PLASTIC/EPOXY

LQFP

QFP100,.63X.87

RECTANGULAR

FLATPACK, LOW PROFILE

YES

Tin/Lead (Sn85Pb15)

GULL WING

650 µm

QUAD

1.6 mm

20 mm

14 mm

INTEGRATED DEVICE TECHNOLOGY INC

QFP

14 X 20 MM, PLASTIC, TQFP-100

100

not_compliant

3A991.B.2.A

8542.32.00.41

Check for Price

Yes

Transferred

4.7186 Mbit

128KX36

3.3 V

3.3 ns

CACHE SRAM

PIPELINED ARCHITECTURE

128000

131.072 k

SYNCHRONOUS

PARALLEL

3.465 V

3.135 V

CMOS

INDUSTRIAL

R-PQFP-G100

Not Qualified

85 °C

-40 °C

NOT SPECIFIED

100

PLASTIC/EPOXY

LQFP

RECTANGULAR

FLATPACK, LOW PROFILE

YES

Matte Tin (Sn)

GULL WING

650 µm

QUAD

1.6 mm

20 mm

14 mm

INTEGRATED DEVICE TECHNOLOGY INC

QFP

LQFP,

100

compliant

3A991.B.2.A

8542.32.00.41

1999-12-31

Check for Price

Obsolete

4.7186 Mbit

128KX36

3.3 V

3.3 ns

183 MHz

CACHE SRAM

PIPELINED ARCHITECTURE

COMMON

128000

131.072 k

SYNCHRONOUS

3-STATE

PARALLEL

35 mA

3.14 V

350 µA

3.465 V

3.135 V

CMOS

INDUSTRIAL

R-PQFP-G100

Not Qualified

85 °C

-40 °C

225

100

PLASTIC/EPOXY

LQFP

QFP100,.63X.87

RECTANGULAR

FLATPACK, LOW PROFILE

YES

Tin/Lead (Sn85Pb15)

GULL WING

650 µm

QUAD

1.6 mm

20 mm

14 mm

INTEGRATED DEVICE TECHNOLOGY INC

QFP

14 X 20 MM, PLASTIC, TQFP-100

100

not_compliant

3A991.B.2.A

8542.32.00.41

Check for Price

Obsolete

4.7186 Mbit

128KX36

3.3 V

3.3 ns

183 MHz

CACHE SRAM

PIPELINED ARCHITECTURE

COMMON

128000

131.072 k

SYNCHRONOUS

3-STATE

PARALLEL

35 mA

3.14 V

350 µA

3.465 V

3.135 V

CMOS

INDUSTRIAL

R-PQFP-G100

Not Qualified

85 °C

-40 °C

225

100

PLASTIC/EPOXY

LQFP

QFP100,.63X.87

RECTANGULAR

FLATPACK, LOW PROFILE

YES

Tin/Lead (Sn85Pb15)

GULL WING

650 µm

QUAD

1.6 mm

20 mm

14 mm

INTEGRATED DEVICE TECHNOLOGY INC

QFP

14 X 20 MM, PLASTIC, TQFP-100

100

not_compliant

3A991.B.2.A

8542.32.00.41

Check for Price

Obsolete

4.7186 Mbit

128KX36

3.3 V

3.3 ns

CACHE SRAM

PIPELINED ARCHITECTURE

128000

131.072 k

SYNCHRONOUS

PARALLEL

3.465 V

3.135 V

CMOS

INDUSTRIAL

R-PQFP-G100

Not Qualified

85 °C

-40 °C

NOT SPECIFIED

100

PLASTIC/EPOXY

LQFP

RECTANGULAR

FLATPACK, LOW PROFILE

YES

Tin/Lead (Sn/Pb)

GULL WING

650 µm

QUAD

1.6 mm

20 mm

14 mm

INTEGRATED DEVICE TECHNOLOGY INC

QFP

LQFP,

100

compliant

3A991.B.2.A

8542.32.00.41

Check for Price

Yes

Transferred

4.7186 Mbit

128KX36

3.3 V

3.3 ns

CACHE SRAM

PIPELINED ARCHITECTURE

128000

131.072 k

SYNCHRONOUS

PARALLEL

3.465 V

3.135 V

CMOS

COMMERCIAL

R-PQFP-G100

Not Qualified

70 °C

NOT SPECIFIED

100

PLASTIC/EPOXY

LQFP

RECTANGULAR

FLATPACK, LOW PROFILE

YES

Matte Tin (Sn)

GULL WING

650 µm

QUAD

1.6 mm

20 mm

14 mm

INTEGRATED DEVICE TECHNOLOGY INC

QFP

LQFP,

100

compliant

3A991.B.2.A

8542.32.00.41

Compare

IDT71V35761S183PF9

Integrated Device Technology Inc

Check for Price

Obsolete

4.7186 Mbit

128KX36

3.3 V

3.3 ns

CACHE SRAM

PIPELINED ARCHITECTURE

128000

131.072 k

SYNCHRONOUS

PARALLEL

3.465 V

3.135 V

CMOS

COMMERCIAL

R-PQFP-G100

Not Qualified

70 °C

NOT SPECIFIED

100

PLASTIC/EPOXY

LQFP

RECTANGULAR

FLATPACK, LOW PROFILE

YES

Tin/Lead (Sn/Pb)

GULL WING

650 µm

QUAD

1.6 mm

20 mm

14 mm

INTEGRATED DEVICE TECHNOLOGY INC

QFP

LQFP,

100

compliant

3A991.B.2.A

8542.32.00.41

IDT71V35761S183PF

Integrated Device Technology Inc

Check for Price

Obsolete

4.7186 Mbit

128KX36

3.3 V

3.3 ns

183 MHz

CACHE SRAM

PIPELINED ARCHITECTURE

COMMON

128000

131.072 k

SYNCHRONOUS

3-STATE

PARALLEL

30 mA

3.14 V

340 µA

3.465 V

3.135 V

CMOS

COMMERCIAL

R-PQFP-G100

Not Qualified

70 °C

225

100

PLASTIC/EPOXY

LQFP

QFP100,.63X.87

RECTANGULAR

FLATPACK, LOW PROFILE

YES

Tin/Lead (Sn85Pb15)

GULL WING

650 µm

QUAD

1.6 mm

20 mm

14 mm

INTEGRATED DEVICE TECHNOLOGY INC

QFP

14 X 20 MM, PLASTIC, TQFP-100

100

not_compliant

3A991.B.2.A

8542.32.00.41

IDT71V35761S183PFG

Integrated Device Technology Inc

Check for Price

Yes

Transferred

4.7186 Mbit

128KX36

3.3 V

3.3 ns

CACHE SRAM

PIPELINED ARCHITECTURE

128000

131.072 k

SYNCHRONOUS

PARALLEL

3.465 V

3.135 V

CMOS

COMMERCIAL

R-PQFP-G100

Not Qualified

70 °C

NOT SPECIFIED

100

PLASTIC/EPOXY

LQFP

RECTANGULAR

FLATPACK, LOW PROFILE

YES

Matte Tin (Sn)

GULL WING

650 µm

QUAD

1.6 mm

20 mm

14 mm

INTEGRATED DEVICE TECHNOLOGY INC

QFP

LQFP,

100

compliant

3A991.B.2.A

8542.32.00.41

IDT71V35761S183PF8

Integrated Device Technology Inc

Check for Price

Obsolete

4.7186 Mbit

128KX36

3.3 V

3.3 ns

183 MHz

CACHE SRAM

PIPELINED ARCHITECTURE

COMMON

128000

131.072 k

SYNCHRONOUS

3-STATE

PARALLEL

30 mA

3.14 V

340 µA

3.465 V

3.135 V

CMOS

COMMERCIAL

R-PQFP-G100

Not Qualified

70 °C

225

100

PLASTIC/EPOXY

LQFP

QFP100,.63X.87

RECTANGULAR

FLATPACK, LOW PROFILE

YES

Tin/Lead (Sn85Pb15)

GULL WING

650 µm

QUAD

1.6 mm

20 mm

14 mm

INTEGRATED DEVICE TECHNOLOGY INC

QFP

14 X 20 MM, PLASTIC, TQFP-100

100

not_compliant

3A991.B.2.A

8542.32.00.41

IDT71V35761S183PFGI

Integrated Device Technology Inc

Check for Price

Yes

Transferred

4.7186 Mbit

128KX36

3.3 V

3.3 ns

CACHE SRAM

PIPELINED ARCHITECTURE

128000

131.072 k

SYNCHRONOUS

PARALLEL

3.465 V

3.135 V

CMOS

INDUSTRIAL

R-PQFP-G100

Not Qualified

85 °C

-40 °C

NOT SPECIFIED

100

PLASTIC/EPOXY

LQFP

RECTANGULAR

FLATPACK, LOW PROFILE

YES

Matte Tin (Sn)

GULL WING

650 µm

QUAD

1.6 mm

20 mm

14 mm

INTEGRATED DEVICE TECHNOLOGY INC

QFP

LQFP,

100

compliant

3A991.B.2.A

8542.32.00.41

1999-12-31

IDT71V35761S183PFI8

Integrated Device Technology Inc

Check for Price

Obsolete

4.7186 Mbit

128KX36

3.3 V

3.3 ns

183 MHz

CACHE SRAM

PIPELINED ARCHITECTURE

COMMON

128000

131.072 k

SYNCHRONOUS

3-STATE

PARALLEL

35 mA

3.14 V

350 µA

3.465 V

3.135 V

CMOS

INDUSTRIAL

R-PQFP-G100

Not Qualified

85 °C

-40 °C

225

100

PLASTIC/EPOXY

LQFP

QFP100,.63X.87

RECTANGULAR

FLATPACK, LOW PROFILE

YES

Tin/Lead (Sn85Pb15)

GULL WING

650 µm

QUAD

1.6 mm

20 mm

14 mm

INTEGRATED DEVICE TECHNOLOGY INC

QFP

14 X 20 MM, PLASTIC, TQFP-100

100

not_compliant

3A991.B.2.A

8542.32.00.41

IDT71V35761S183PFI

Integrated Device Technology Inc

Check for Price

Obsolete

4.7186 Mbit

128KX36

3.3 V

3.3 ns

183 MHz

CACHE SRAM

PIPELINED ARCHITECTURE

COMMON

128000

131.072 k

SYNCHRONOUS

3-STATE

PARALLEL

35 mA

3.14 V

350 µA

3.465 V

3.135 V

CMOS

INDUSTRIAL

R-PQFP-G100

Not Qualified

85 °C

-40 °C

225

100

PLASTIC/EPOXY

LQFP

QFP100,.63X.87

RECTANGULAR

FLATPACK, LOW PROFILE

YES

Tin/Lead (Sn85Pb15)

GULL WING

650 µm

QUAD

1.6 mm

20 mm

14 mm

INTEGRATED DEVICE TECHNOLOGY INC

QFP

14 X 20 MM, PLASTIC, TQFP-100

100

not_compliant

3A991.B.2.A

8542.32.00.41

IDT71V35761S183PFI9

Integrated Device Technology Inc

Check for Price

Obsolete

4.7186 Mbit

128KX36

3.3 V

3.3 ns

CACHE SRAM

PIPELINED ARCHITECTURE

128000

131.072 k

SYNCHRONOUS

PARALLEL

3.465 V

3.135 V

CMOS

INDUSTRIAL

R-PQFP-G100

Not Qualified

85 °C

-40 °C

NOT SPECIFIED

100

PLASTIC/EPOXY

LQFP

RECTANGULAR

FLATPACK, LOW PROFILE

YES

Tin/Lead (Sn/Pb)

GULL WING

650 µm

QUAD

1.6 mm

20 mm

14 mm

INTEGRATED DEVICE TECHNOLOGY INC

QFP

LQFP,

100

compliant

3A991.B.2.A

8542.32.00.41

IDT71V35761S183PFG8

Integrated Device Technology Inc

Check for Price

Yes

Transferred

4.7186 Mbit

128KX36

3.3 V

3.3 ns

CACHE SRAM

PIPELINED ARCHITECTURE

128000

131.072 k

SYNCHRONOUS

PARALLEL

3.465 V

3.135 V

CMOS

COMMERCIAL

R-PQFP-G100

Not Qualified

70 °C

NOT SPECIFIED

100

PLASTIC/EPOXY

LQFP

RECTANGULAR

FLATPACK, LOW PROFILE

YES

Matte Tin (Sn)

GULL WING

650 µm

QUAD

1.6 mm

20 mm

14 mm

INTEGRATED DEVICE TECHNOLOGY INC

QFP

LQFP,

100

compliant

3A991.B.2.A

8542.32.00.41

Parametric results for: idt71v35761s183pf under SRAMs