Findchips: Parametric Search Results for idt71v65703s

Parametric results for: idt71v65703s under SRAMs

Select parts from the table below to compare.

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Select Parts		Part Number

		IDT71V65703S85PFGI8 Integrated Device Technology Inc
		IDT71V65703S75BG Integrated Device Technology Inc
		IDT71V65703S80BQGI Integrated Device Technology Inc
		IDT71V65703S75BG8 Integrated Device Technology Inc
		IDT71V65703S85BGI8 Integrated Device Technology Inc
		IDT71V65703S85BGGI Integrated Device Technology Inc
		IDT71V65703S80BG Integrated Device Technology Inc
		IDT71V65703S85BQGI Integrated Device Technology Inc
		IDT71V65703S75PF Integrated Device Technology Inc
		IDT71V65703S75PFG8 Integrated Device Technology Inc

				Most Relevant						Technical																Compliance			Operating Conditions					Physical											Dimensions			Other
Composite Price	Pbfree Code	Rohs Code	Part Life Cycle Code	Memory Density	Memory Width	Organization	Supply Voltage-Nom (Vsup)	Access Time-Max	Clock Frequency-Max (fCLK)	Memory IC Type	Additional Feature	I/O Type	Number of Functions	Number of Words Code	Number of Words	Operating Mode	Output Characteristics	Parallel/Serial	Standby Current-Max	Standby Voltage-Min	Supply Current-Max	Supply Voltage-Max (Vsup)	Supply Voltage-Min (Vsup)	Technology	Temperature Grade	JESD-30 Code	Qualification Status	JESD-609 Code	Moisture Sensitivity Level	Operating Temperature-Max	Operating Temperature-Min	Peak Reflow Temperature (Cel)	Time@Peak Reflow Temperature-Max (s)	Number of Terminals	Package Body Material	Package Code	Package Equivalence Code	Package Shape	Package Style	Surface Mount	Terminal Finish	Terminal Form	Terminal Pitch	Terminal Position	Seated Height-Max	Length	Width	Ihs Manufacturer	Part Package Code	Package Description	Pin Count	Reach Compliance Code	ECCN Code	HTS Code	Date Of Intro

Check for Price

Yes

Transferred

9.4372 Mbit

256KX36

3.3 V

8.5 ns

ZBT SRAM

FLOW-THROUGH ARCHITECTURE

256000

262.144 k

SYNCHRONOUS

PARALLEL

3.465 V

3.135 V

CMOS

INDUSTRIAL

R-PQFP-G100

Not Qualified

85 °C

-40 °C

NOT SPECIFIED

100

PLASTIC/EPOXY

LQFP

RECTANGULAR

FLATPACK, LOW PROFILE

YES

Matte Tin (Sn)

GULL WING

650 µm

QUAD

1.6 mm

20 mm

14 mm

INTEGRATED DEVICE TECHNOLOGY INC

QFP

LQFP,

100

compliant

3A991.B.2.A

8542.32.00.41

Check for Price

Transferred

9.4372 Mbit

256KX36

3.3 V

7.5 ns

100 MHz

ZBT SRAM

FLOW-THROUGH ARCHITECTURE

COMMON

256000

262.144 k

SYNCHRONOUS

3-STATE

PARALLEL

40 mA

3.14 V

275 µA

3.465 V

3.135 V

CMOS

COMMERCIAL

R-PBGA-B119

Not Qualified

70 °C

225

119

PLASTIC/EPOXY

BGA

BGA119,7X17,50

RECTANGULAR

GRID ARRAY

YES

Tin/Lead (Sn63Pb37)

BALL

1.27 mm

BOTTOM

2.36 mm

22 mm

14 mm

INTEGRATED DEVICE TECHNOLOGY INC

BGA

BGA, BGA119,7X17,50

119

not_compliant

3A991.B.2.A

8542.32.00.41

1999-12-31

Check for Price

Yes

Transferred

9.4372 Mbit

256KX36

3.3 V

8 ns

ZBT SRAM

FLOW-THROUGH ARCHITECTURE

256000

262.144 k

SYNCHRONOUS

PARALLEL

3.465 V

3.135 V

CMOS

INDUSTRIAL

R-PBGA-B165

Not Qualified

85 °C

-40 °C

165

PLASTIC/EPOXY

TBGA

RECTANGULAR

GRID ARRAY, THIN PROFILE

YES

TIN SILVER COPPER

BALL

1 mm

BOTTOM

1.2 mm

15 mm

13 mm

INTEGRATED DEVICE TECHNOLOGY INC

BGA

TBGA,

165

compliant

3A991.B.2.A

8542.32.00.41

Check for Price

Transferred

9.4372 Mbit

256KX36

3.3 V

7.5 ns

100 MHz

ZBT SRAM

FLOW-THROUGH ARCHITECTURE

COMMON

256000

262.144 k

SYNCHRONOUS

3-STATE

PARALLEL

40 mA

3.14 V

275 µA

3.465 V

3.135 V

CMOS

COMMERCIAL

R-PBGA-B119

Not Qualified

70 °C

225

119

PLASTIC/EPOXY

BGA

BGA119,7X17,50

RECTANGULAR

GRID ARRAY

YES

Tin/Lead (Sn63Pb37)

BALL

1.27 mm

BOTTOM

2.36 mm

22 mm

14 mm

INTEGRATED DEVICE TECHNOLOGY INC

BGA

BGA, BGA119,7X17,50

119

not_compliant

3A991.B.2.A

8542.32.00.41

1999-12-31

Check for Price

Transferred

9.4372 Mbit

256KX36

3.3 V

8.5 ns

90 MHz

ZBT SRAM

FLOW-THROUGH ARCHITECTURE

COMMON

256000

262.144 k

SYNCHRONOUS

3-STATE

PARALLEL

60 mA

3.14 V

60 µA

3.465 V

3.135 V

CMOS

INDUSTRIAL

R-PBGA-B119

Not Qualified

85 °C

-40 °C

225

119

PLASTIC/EPOXY

BGA

BGA119,7X17,50

RECTANGULAR

GRID ARRAY

YES

Tin/Lead (Sn63Pb37)

BALL

1.27 mm

BOTTOM

2.36 mm

22 mm

14 mm

INTEGRATED DEVICE TECHNOLOGY INC

BGA

BGA, BGA119,7X17,50

119

not_compliant

3A991.B.2.A

8542.32.00.41

Check for Price

Yes

Transferred

9.4372 Mbit

256KX36

3.3 V

8.5 ns

ZBT SRAM

FLOW-THROUGH ARCHITECTURE

256000

262.144 k

SYNCHRONOUS

PARALLEL

3.465 V

3.135 V

CMOS

INDUSTRIAL

R-PBGA-B119

Not Qualified

85 °C

-40 °C

119

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

YES

TIN SILVER COPPER

BALL

1.27 mm

BOTTOM

2.36 mm

22 mm

14 mm

INTEGRATED DEVICE TECHNOLOGY INC

BGA

BGA,

119

compliant

3A991.B.2.A

8542.32.00.41

Check for Price

Transferred

9.4372 Mbit

256KX36

3.3 V

8 ns

95 MHz

ZBT SRAM

FLOW-THROUGH ARCHITECTURE

COMMON

256000

262.144 k

SYNCHRONOUS

3-STATE

PARALLEL

40 mA

3.14 V

250 µA

3.465 V

3.135 V

CMOS

COMMERCIAL

R-PBGA-B119

Not Qualified

70 °C

225

119

PLASTIC/EPOXY

BGA

BGA119,7X17,50

RECTANGULAR

GRID ARRAY

YES

Tin/Lead (Sn63Pb37)

BALL

1.27 mm

BOTTOM

2.36 mm

22 mm

14 mm

INTEGRATED DEVICE TECHNOLOGY INC

BGA

BGA, BGA119,7X17,50

119

not_compliant

3A991.B.2.A

8542.32.00.41

1999-12-31

Check for Price

Yes

Transferred

9.4372 Mbit

256KX36

3.3 V

8.5 ns

ZBT SRAM

FLOW-THROUGH ARCHITECTURE

256000

262.144 k

SYNCHRONOUS

PARALLEL

3.465 V

3.135 V

CMOS

INDUSTRIAL

R-PBGA-B165

Not Qualified

85 °C

-40 °C

165

PLASTIC/EPOXY

TBGA

RECTANGULAR

GRID ARRAY, THIN PROFILE

YES

TIN SILVER COPPER

BALL

1 mm

BOTTOM

1.2 mm

15 mm

13 mm

INTEGRATED DEVICE TECHNOLOGY INC

BGA

TBGA,

165

compliant

3A991.B.2.A

8542.32.00.41

Check for Price

Obsolete

9.4372 Mbit

256KX36

3.3 V

7.5 ns

100 MHz

ZBT SRAM

FLOW-THROUGH ARCHITECTURE

COMMON

256000

262.144 k

SYNCHRONOUS

3-STATE

PARALLEL

40 mA

3.14 V

275 µA

3.465 V

3.135 V

CMOS

COMMERCIAL

R-PQFP-G100

Not Qualified

70 °C

225

100

PLASTIC/EPOXY

LQFP

QFP100,.63X.87

RECTANGULAR

FLATPACK, LOW PROFILE

YES

Tin/Lead (Sn85Pb15)

GULL WING

650 µm

QUAD

1.6 mm

20 mm

14 mm

INTEGRATED DEVICE TECHNOLOGY INC

QFP

14 X 20 MM, 1.40 MM HEIGHT, MO-136DJ, PLASTIC, TQFP-100

100

not_compliant

3A991.B.2.A

8542.32.00.41

Check for Price

Yes

Transferred

9.4372 Mbit

256KX36

3.3 V

7.5 ns

ZBT SRAM

FLOW-THROUGH ARCHITECTURE

256000

262.144 k

SYNCHRONOUS

PARALLEL

3.465 V

3.135 V

CMOS

COMMERCIAL

R-PQFP-G100

Not Qualified

70 °C

NOT SPECIFIED

100

PLASTIC/EPOXY

LQFP

RECTANGULAR

FLATPACK, LOW PROFILE

YES

Matte Tin (Sn)

GULL WING

650 µm

QUAD

1.6 mm

20 mm

14 mm

INTEGRATED DEVICE TECHNOLOGY INC

QFP

LQFP,

100

compliant

3A991.B.2.A

8542.32.00.41

1 2 3 4 5 Next

Compare

IDT71V65703S85PFGI8

Integrated Device Technology Inc

Check for Price

Yes

Transferred

9.4372 Mbit

256KX36

3.3 V

8.5 ns

ZBT SRAM

FLOW-THROUGH ARCHITECTURE

256000

262.144 k

SYNCHRONOUS

PARALLEL

3.465 V

3.135 V

CMOS

INDUSTRIAL

R-PQFP-G100

Not Qualified

85 °C

-40 °C

NOT SPECIFIED

100

PLASTIC/EPOXY

LQFP

RECTANGULAR

FLATPACK, LOW PROFILE

YES

Matte Tin (Sn)

GULL WING

650 µm

QUAD

1.6 mm

20 mm

14 mm

INTEGRATED DEVICE TECHNOLOGY INC

QFP

LQFP,

100

compliant

3A991.B.2.A

8542.32.00.41

IDT71V65703S75BG

Integrated Device Technology Inc

Check for Price

Transferred

9.4372 Mbit

256KX36

3.3 V

7.5 ns

100 MHz

ZBT SRAM

FLOW-THROUGH ARCHITECTURE

COMMON

256000

262.144 k

SYNCHRONOUS

3-STATE

PARALLEL

40 mA

3.14 V

275 µA

3.465 V

3.135 V

CMOS

COMMERCIAL

R-PBGA-B119

Not Qualified

70 °C

225

119

PLASTIC/EPOXY

BGA

BGA119,7X17,50

RECTANGULAR

GRID ARRAY

YES

Tin/Lead (Sn63Pb37)

BALL

1.27 mm

BOTTOM

2.36 mm

22 mm

14 mm

INTEGRATED DEVICE TECHNOLOGY INC

BGA

BGA, BGA119,7X17,50

119

not_compliant

3A991.B.2.A

8542.32.00.41

1999-12-31

IDT71V65703S80BQGI

Integrated Device Technology Inc

Check for Price

Yes

Transferred

9.4372 Mbit

256KX36

3.3 V

8 ns

ZBT SRAM

FLOW-THROUGH ARCHITECTURE

256000

262.144 k

SYNCHRONOUS

PARALLEL

3.465 V

3.135 V

CMOS

INDUSTRIAL

R-PBGA-B165

Not Qualified

85 °C

-40 °C

165

PLASTIC/EPOXY

TBGA

RECTANGULAR

GRID ARRAY, THIN PROFILE

YES

TIN SILVER COPPER

BALL

1 mm

BOTTOM

1.2 mm

15 mm

13 mm

INTEGRATED DEVICE TECHNOLOGY INC

BGA

TBGA,

165

compliant

3A991.B.2.A

8542.32.00.41

IDT71V65703S75BG8

Integrated Device Technology Inc

Check for Price

Transferred

9.4372 Mbit

256KX36

3.3 V

7.5 ns

100 MHz

ZBT SRAM

FLOW-THROUGH ARCHITECTURE

COMMON

256000

262.144 k

SYNCHRONOUS

3-STATE

PARALLEL

40 mA

3.14 V

275 µA

3.465 V

3.135 V

CMOS

COMMERCIAL

R-PBGA-B119

Not Qualified

70 °C

225

119

PLASTIC/EPOXY

BGA

BGA119,7X17,50

RECTANGULAR

GRID ARRAY

YES

Tin/Lead (Sn63Pb37)

BALL

1.27 mm

BOTTOM

2.36 mm

22 mm

14 mm

INTEGRATED DEVICE TECHNOLOGY INC

BGA

BGA, BGA119,7X17,50

119

not_compliant

3A991.B.2.A

8542.32.00.41

1999-12-31

IDT71V65703S85BGI8

Integrated Device Technology Inc

Check for Price

Transferred

9.4372 Mbit

256KX36

3.3 V

8.5 ns

90 MHz

ZBT SRAM

FLOW-THROUGH ARCHITECTURE

COMMON

256000

262.144 k

SYNCHRONOUS

3-STATE

PARALLEL

60 mA

3.14 V

60 µA

3.465 V

3.135 V

CMOS

INDUSTRIAL

R-PBGA-B119

Not Qualified

85 °C

-40 °C

225

119

PLASTIC/EPOXY

BGA

BGA119,7X17,50

RECTANGULAR

GRID ARRAY

YES

Tin/Lead (Sn63Pb37)

BALL

1.27 mm

BOTTOM

2.36 mm

22 mm

14 mm

INTEGRATED DEVICE TECHNOLOGY INC

BGA

BGA, BGA119,7X17,50

119

not_compliant

3A991.B.2.A

8542.32.00.41

IDT71V65703S85BGGI

Integrated Device Technology Inc

Check for Price

Yes

Transferred

9.4372 Mbit

256KX36

3.3 V

8.5 ns

ZBT SRAM

FLOW-THROUGH ARCHITECTURE

256000

262.144 k

SYNCHRONOUS

PARALLEL

3.465 V

3.135 V

CMOS

INDUSTRIAL

R-PBGA-B119

Not Qualified

85 °C

-40 °C

119

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

YES

TIN SILVER COPPER

BALL

1.27 mm

BOTTOM

2.36 mm

22 mm

14 mm

INTEGRATED DEVICE TECHNOLOGY INC

BGA

BGA,

119

compliant

3A991.B.2.A

8542.32.00.41

IDT71V65703S80BG

Integrated Device Technology Inc

Check for Price

Transferred

9.4372 Mbit

256KX36

3.3 V

8 ns

95 MHz

ZBT SRAM

FLOW-THROUGH ARCHITECTURE

COMMON

256000

262.144 k

SYNCHRONOUS

3-STATE

PARALLEL

40 mA

3.14 V

250 µA

3.465 V

3.135 V

CMOS

COMMERCIAL

R-PBGA-B119

Not Qualified

70 °C

225

119

PLASTIC/EPOXY

BGA

BGA119,7X17,50

RECTANGULAR

GRID ARRAY

YES

Tin/Lead (Sn63Pb37)

BALL

1.27 mm

BOTTOM

2.36 mm

22 mm

14 mm

INTEGRATED DEVICE TECHNOLOGY INC

BGA

BGA, BGA119,7X17,50

119

not_compliant

3A991.B.2.A

8542.32.00.41

1999-12-31

IDT71V65703S85BQGI

Integrated Device Technology Inc

Check for Price

Yes

Transferred

9.4372 Mbit

256KX36

3.3 V

8.5 ns

ZBT SRAM

FLOW-THROUGH ARCHITECTURE

256000

262.144 k

SYNCHRONOUS

PARALLEL

3.465 V

3.135 V

CMOS

INDUSTRIAL

R-PBGA-B165

Not Qualified

85 °C

-40 °C

165

PLASTIC/EPOXY

TBGA

RECTANGULAR

GRID ARRAY, THIN PROFILE

YES

TIN SILVER COPPER

BALL

1 mm

BOTTOM

1.2 mm

15 mm

13 mm

INTEGRATED DEVICE TECHNOLOGY INC

BGA

TBGA,

165

compliant

3A991.B.2.A

8542.32.00.41

IDT71V65703S75PF

Integrated Device Technology Inc

Check for Price

Obsolete

9.4372 Mbit

256KX36

3.3 V

7.5 ns

100 MHz

ZBT SRAM

FLOW-THROUGH ARCHITECTURE

COMMON

256000

262.144 k

SYNCHRONOUS

3-STATE

PARALLEL

40 mA

3.14 V

275 µA

3.465 V

3.135 V

CMOS

COMMERCIAL

R-PQFP-G100

Not Qualified

70 °C

225

100

PLASTIC/EPOXY

LQFP

QFP100,.63X.87

RECTANGULAR

FLATPACK, LOW PROFILE

YES

Tin/Lead (Sn85Pb15)

GULL WING

650 µm

QUAD

1.6 mm

20 mm

14 mm

INTEGRATED DEVICE TECHNOLOGY INC

QFP

14 X 20 MM, 1.40 MM HEIGHT, MO-136DJ, PLASTIC, TQFP-100

100

not_compliant

3A991.B.2.A

8542.32.00.41

IDT71V65703S75PFG8

Integrated Device Technology Inc

Check for Price

Yes

Transferred

9.4372 Mbit

256KX36

3.3 V

7.5 ns

ZBT SRAM

FLOW-THROUGH ARCHITECTURE

256000

262.144 k

SYNCHRONOUS

PARALLEL

3.465 V

3.135 V

CMOS

COMMERCIAL

R-PQFP-G100

Not Qualified

70 °C

NOT SPECIFIED

100

PLASTIC/EPOXY

LQFP

RECTANGULAR

FLATPACK, LOW PROFILE

YES

Matte Tin (Sn)

GULL WING

650 µm

QUAD

1.6 mm

20 mm

14 mm

INTEGRATED DEVICE TECHNOLOGY INC

QFP

LQFP,

100

compliant

3A991.B.2.A

8542.32.00.41

1 2 3 4 5 Next