Parametric results for: idt72 under FIFOs

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Manufacturer Part Number: idt72
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IDT7201LA50SO
Integrated Device Technology Inc
$6.1749 No No Obsolete 4.608 kbit 9 512X9 5 V 50 ns 15.38 MHz 65 ns OTHER FIFO RETRANSMIT 1 512 512 words ASYNCHRONOUS 3-STATE NO PARALLEL 500 µA 80 µA 5.5 V 4.5 V CMOS COMMERCIAL R-PDSO-G28 Not Qualified e0 3 70 °C 225 30 28 PLASTIC/EPOXY SOP SOP28,.5 RECTANGULAR SMALL OUTLINE YES Tin/Lead (Sn85Pb15) GULL WING 1.27 mm DUAL 3.048 mm 18.3642 mm 8.763 mm INTEGRATED DEVICE TECHNOLOGY INC SOIC SOIC-28 28 not_compliant EAR99 8542.32.00.71
IDT72V283L10PFG8
Integrated Device Technology Inc
Check for Price Yes Yes Transferred 589.824 kbit 18 32KX18 3.3 V 6.5 ns 10 ns IT CAN ALSO BE CONFIGURED AS 64K X 9; RE... more 1 32000 32.768 k SYNCHRONOUS YES PARALLEL 3.45 V 3.15 V CMOS COMMERCIAL S-PQFP-G80 Not Qualified e3 3 70 °C NOT SPECIFIED NOT SPECIFIED 80 PLASTIC/EPOXY LQFP SQUARE FLATPACK, LOW PROFILE YES Matte Tin (Sn) GULL WING 650 µm QUAD 1.6 mm 14 mm 14 mm INTEGRATED DEVICE TECHNOLOGY INC QFP LQFP, 80 compliant EAR99 8542.32.00.71
IDT72V211L15PFI9
Integrated Device Technology Inc
Check for Price No No Obsolete 4.608 kbit 9 512X9 3.3 V 10 ns 15 ns OTHER FIFO 1 512 512 words SYNCHRONOUS YES PARALLEL 20 µA 3.6 V 3 V CMOS INDUSTRIAL S-PQFP-G32 Not Qualified e0 3 85 °C -40 °C 32 PLASTIC/EPOXY LQFP SQUARE FLATPACK, LOW PROFILE YES TIN LEAD GULL WING 800 µm QUAD 1.6 mm 7 mm 7 mm INTEGRATED DEVICE TECHNOLOGY INC QFP PLASTIC, TQFP-32 32 compliant EAR99 8542.32.00.71
IDT7204S40XEB
Integrated Device Technology Inc
Check for Price No No Obsolete 36.864 kbit 9 4KX9 5 V 40 ns 20 MHz 50 ns OTHER FIFO RETRANSMIT 1 4000 4.096 k ASYNCHRONOUS 3-STATE NO PARALLEL 12 mA 150 µA 5.5 V 4.5 V CMOS MILITARY R-GDFP-F28 Not Qualified e0 125 °C -55 °C 38535Q/M;38534H;883B 28 CERAMIC, GLASS-SEALED DFP FL28,.4 RECTANGULAR FLATPACK YES TIN LEAD FLAT 1.27 mm DUAL 2.921 mm 18.288 mm 12.446 mm INTEGRATED DEVICE TECHNOLOGY INC DFP CERPACK-28 28 not_compliant EAR99 8542.32.00.71
IDT7204L15TDG
Integrated Device Technology Inc
Check for Price Yes Yes Transferred 36.864 kbit 9 4KX9 5 V 15 ns 25 ns 1 4000 4.096 k ASYNCHRONOUS NO PARALLEL 5.5 V 4.5 V CMOS COMMERCIAL R-GDIP-T28 Not Qualified e3 70 °C 28 CERAMIC, GLASS-SEALED DIP RECTANGULAR IN-LINE NO MATTE TIN THROUGH-HOLE 2.54 mm DUAL 5.08 mm 37.1475 mm 7.62 mm INTEGRATED DEVICE TECHNOLOGY INC DIP DIP, 28 compliant EAR99 8542.32.00.71
IDT72215LB20J
Integrated Device Technology Inc
Check for Price No No Obsolete 9.216 kbit 18 512X18 5 V 12 ns 50 MHz 20 ns OTHER FIFO 1 512 512 words SYNCHRONOUS 3-STATE YES PARALLEL 70 mA 200 µA 5.5 V 4.5 V CMOS COMMERCIAL S-PQCC-J68 Not Qualified e0 1 70 °C 225 20 68 PLASTIC/EPOXY QCCJ LDCC68,1.0SQ SQUARE CHIP CARRIER YES TIN LEAD J BEND 1.27 mm QUAD 4.57 mm 24.2062 mm 24.2062 mm INTEGRATED DEVICE TECHNOLOGY INC LCC QCCJ, LDCC68,1.0SQ 68 not_compliant EAR99 8542.32.00.71
IDT72T18125L6-7BBI
Integrated Device Technology Inc
Check for Price No Obsolete 9.4372 Mbit 18 512KX18 2.5 V 12 ns 66 MHz 15 ns OTHER FIFO 9 1 512000 524.288 k SYNCHRONOUS/ASYNCHRONOUS YES Parallel/Serial 50 mA 60 µA CMOS INDUSTRIAL S-PBGA-B240 Not Qualified e0 3 85 °C -40 °C 225 30 240 PLASTIC/EPOXY BGA BGA240,18X18,40 SQUARE GRID ARRAY YES TIN LEAD BALL 1 mm BOTTOM INTEGRATED DEVICE TECHNOLOGY INC not_compliant EAR99 8542.32.00.71
IDT7201LA120TC
Integrated Device Technology Inc
Check for Price No No Obsolete 4.608 kbit 9 512X9 5 V 120 ns 140 ns OTHER FIFO RETRANSMIT 1 512 512 words ASYNCHRONOUS 3-STATE NO PARALLEL 125 µA 5.5 V 4.5 V CMOS COMMERCIAL R-CDIP-T28 Not Qualified e0 70 °C 28 CERAMIC, METAL-SEALED COFIRED DIP DIP28,.3 RECTANGULAR IN-LINE NO TIN LEAD THROUGH-HOLE 2.54 mm DUAL INTEGRATED DEVICE TECHNOLOGY INC DIP 0.300 INCH, SIDE BRAZED, THIN, CERAMIC, DIP-28 28 not_compliant EAR99 8542.32.00.71
IDT7203S12J8
Integrated Device Technology Inc
Check for Price No No Obsolete 18.432 kbit 9 2KX9 5 V 12 ns 20 ns OTHER FIFO RETRANSMIT 1 2000 2.048 k ASYNCHRONOUS 3-STATE NO PARALLEL 120 µA 5.5 V 4.5 V CMOS COMMERCIAL R-PQCC-J32 Not Qualified e0 1 70 °C 32 PLASTIC/EPOXY QCCJ RECTANGULAR CHIP CARRIER YES TIN LEAD J BEND 1.27 mm QUAD 3.55 mm 13.97 mm 11.43 mm INTEGRATED DEVICE TECHNOLOGY INC QFJ PLASTIC, LCC-32 32 compliant EAR99 8542.32.00.71
IDT7202LA30SOGB
Integrated Device Technology Inc
Check for Price Yes Yes Transferred 9.216 kbit 9 1KX9 5 V 30 ns 40 ns RETRANSMIT 1 1000 1.024 k ASYNCHRONOUS NO PARALLEL 5.5 V 4.5 V CMOS MILITARY R-PDSO-G28 Not Qualified e3 1 125 °C -55 °C MIL-STD-883 Class B 28 PLASTIC/EPOXY SOP RECTANGULAR SMALL OUTLINE YES MATTE TIN GULL WING 1.27 mm DUAL 3.048 mm 18.3642 mm 8.763 mm INTEGRATED DEVICE TECHNOLOGY INC SOIC SOP, 28 compliant EAR99 8542.32.00.71