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IDT7208L20J
Integrated Device Technology Inc
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Check for Price | No | No | Obsolete | 589.824 kbit | 9 | 64KX9 | 5 V | 20 ns | 33.3 MHz | 30 ns | OTHER FIFO | RETRANSMIT | 1 | 64000 | 65.536 k | ASYNCHRONOUS | NO | PARALLEL | 8 mA | 120 µA | 5.5 V | 4.5 V | CMOS | COMMERCIAL | R-PQCC-J32 | Not Qualified | e0 | 1 | 70 °C | 225 | 20 | 32 | PLASTIC/EPOXY | QCCJ | LDCC32,.5X.6 | RECTANGULAR | CHIP CARRIER | YES | Tin/Lead (Sn85Pb15) | J BEND | 1.27 mm | QUAD | 3.556 mm | 13.9954 mm | 11.4554 mm | INTEGRATED DEVICE TECHNOLOGY INC | QFJ | PLASTIC, LCC-32 | 32 | not_compliant | EAR99 | 8542.32.00.71 | |||
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IDT7208L25JI8
Integrated Device Technology Inc
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Check for Price | No | No | Obsolete | 589.824 kbit | 9 | 64KX9 | 5 V | 25 ns | 28.5 MHz | 35 ns | OTHER FIFO | 1 | 64000 | 65.536 k | ASYNCHRONOUS | NO | PARALLEL | 12 mA | 120 µA | 5.5 V | 4.5 V | CMOS | INDUSTRIAL | R-PQCC-J32 | Not Qualified | e0 | 1 | 85 °C | -40 °C | 225 | 20 | 32 | PLASTIC/EPOXY | QCCJ | LDCC32,.5X.6 | RECTANGULAR | CHIP CARRIER | YES | Tin/Lead (Sn85Pb15) | J BEND | 1.27 mm | QUAD | 3.55 mm | 13.97 mm | 11.43 mm | INTEGRATED DEVICE TECHNOLOGY INC | QFJ | PLASTIC, LCC-32 | 32 | not_compliant | EAR99 | 8542.32.00.71 | |||
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IDT7208L20PG
Integrated Device Technology Inc
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Check for Price | Yes | Yes | Obsolete | 589.824 kbit | 9 | 64KX9 | 5 V | 20 ns | 30 ns | OTHER FIFO | RETRANSMIT | 1 | 64000 | 65.536 k | ASYNCHRONOUS | NO | PARALLEL | 120 µA | 5.5 V | 4.5 V | CMOS | COMMERCIAL | R-PDIP-T28 | Not Qualified | e3 | 70 °C | 28 | PLASTIC/EPOXY | DIP | RECTANGULAR | IN-LINE | NO | MATTE TIN | THROUGH-HOLE | 2.54 mm | DUAL | 4.699 mm | 36.576 mm | 15.24 mm | INTEGRATED DEVICE TECHNOLOGY INC | DIP | DIP, | 28 | compliant | EAR99 | 8542.32.00.71 | |||||||||
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IDT7208L20PDG
Integrated Device Technology Inc
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Check for Price | Yes | Obsolete | 589.824 kbit | 9 | 64KX9 | 5 V | 20 ns | 30 ns | 1 | 64000 | 65.536 k | ASYNCHRONOUS | NO | PARALLEL | 5.5 V | 4.5 V | CMOS | COMMERCIAL | R-PDIP-T28 | Not Qualified | e3 | 1 | 70 °C | 28 | PLASTIC/EPOXY | DIP | RECTANGULAR | IN-LINE | NO | MATTE TIN | THROUGH-HOLE | 2.54 mm | DUAL | 4.699 mm | 36.576 mm | 15.24 mm | INTEGRATED DEVICE TECHNOLOGY INC | DIP | GREEN, PLASTIC, DIP-28 | 28 | compliant | EAR99 | 8542.32.00.71 | ||||||||||||
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IDT7208L25JG8
Integrated Device Technology Inc
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Check for Price | Yes | Yes | Transferred | 589.824 kbit | 9 | 64KX9 | 5 V | 25 ns | 35 ns | RETRANSMIT | 1 | 64000 | 65.536 k | ASYNCHRONOUS | NO | PARALLEL | 5.5 V | 4.5 V | CMOS | COMMERCIAL | R-PQCC-J32 | Not Qualified | e3 | 70 °C | 32 | PLASTIC/EPOXY | QCCJ | RECTANGULAR | CHIP CARRIER | YES | MATTE TIN | J BEND | 1.27 mm | QUAD | 3.55 mm | 13.97 mm | 11.43 mm | INTEGRATED DEVICE TECHNOLOGY INC | QFJ | QCCJ, | 32 | compliant | EAR99 | 8542.32.00.71 | |||||||||||
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IDT7208L25PGI
Integrated Device Technology Inc
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Check for Price | Yes | Yes | Transferred | 589.824 kbit | 9 | 64KX9 | 5 V | 25 ns | 35 ns | 1 | 64000 | 65.536 k | ASYNCHRONOUS | NO | PARALLEL | 5.5 V | 4.5 V | CMOS | INDUSTRIAL | R-PDIP-T28 | Not Qualified | e3 | 85 °C | -40 °C | 28 | PLASTIC/EPOXY | DIP | RECTANGULAR | IN-LINE | NO | MATTE TIN | THROUGH-HOLE | 2.54 mm | DUAL | 4.699 mm | 36.576 mm | 15.24 mm | INTEGRATED DEVICE TECHNOLOGY INC | DIP | DIP, | 28 | compliant | EAR99 | 8542.32.00.71 | |||||||||||
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IDT7208L25JGI8
Integrated Device Technology Inc
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Check for Price | Yes | Yes | Transferred | 589.824 kbit | 9 | 64KX9 | 5 V | 25 ns | 35 ns | 1 | 64000 | 65.536 k | ASYNCHRONOUS | NO | PARALLEL | 5.5 V | 4.5 V | CMOS | INDUSTRIAL | R-PQCC-J32 | Not Qualified | e3 | 85 °C | -40 °C | 32 | PLASTIC/EPOXY | QCCJ | RECTANGULAR | CHIP CARRIER | YES | MATTE TIN | J BEND | 1.27 mm | QUAD | 3.55 mm | 13.97 mm | 11.43 mm | INTEGRATED DEVICE TECHNOLOGY INC | QFJ | QCCJ, | 32 | compliant | EAR99 | 8542.32.00.71 | |||||||||||
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IDT7208L25JG
Integrated Device Technology Inc
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Check for Price | Yes | Yes | Transferred | 589.824 kbit | 9 | 64KX9 | 5 V | 25 ns | 35 ns | 1 | 64000 | 65.536 k | ASYNCHRONOUS | NO | PARALLEL | 5.5 V | 4.5 V | CMOS | COMMERCIAL | R-PQCC-J32 | Not Qualified | e3 | 70 °C | 32 | PLASTIC/EPOXY | QCCJ | RECTANGULAR | CHIP CARRIER | YES | MATTE TIN | J BEND | 1.27 mm | QUAD | 3.556 mm | 13.9954 mm | 11.4554 mm | INTEGRATED DEVICE TECHNOLOGY INC | QFJ | QCCJ, | 32 | compliant | EAR99 | 8542.32.00.71 | ||||||||||||
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IDT7208L35P
Integrated Device Technology Inc
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Check for Price | No | Obsolete | 589.824 kbit | 9 | 64KX9 | 5 V | 35 ns | 22.2 MHz | 45 ns | OTHER FIFO | RETRANSMIT | 1 | 64000 | 65.536 k | ASYNCHRONOUS | NO | PARALLEL | 8 mA | 120 µA | 5.5 V | 4.5 V | CMOS | COMMERCIAL | R-PDIP-T28 | Not Qualified | e0 | 70 °C | 240 | 20 | 28 | PLASTIC/EPOXY | DIP | DIP28,.6 | RECTANGULAR | IN-LINE | NO | Tin/Lead (Sn85Pb15) | THROUGH-HOLE | 2.54 mm | DUAL | 4.699 mm | 36.576 mm | 15.24 mm | INTEGRATED DEVICE TECHNOLOGY INC | DIP | PLASTIC, DIP-28 | 28 | not_compliant | EAR99 | 8542.32.00.71 | |||||
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IDT7208L25P
Integrated Device Technology Inc
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Check for Price | No | Obsolete | 589.824 kbit | 9 | 64KX9 | 5 V | 25 ns | 28.5 MHz | 35 ns | OTHER FIFO | RETRANSMIT | 1 | 64000 | 65.536 k | ASYNCHRONOUS | NO | PARALLEL | 8 mA | 120 µA | 5.5 V | 4.5 V | CMOS | COMMERCIAL | R-PDIP-T28 | Not Qualified | e0 | 1 | 70 °C | 240 | 20 | 28 | PLASTIC/EPOXY | DIP | DIP28,.6 | RECTANGULAR | IN-LINE | NO | Tin/Lead (Sn85Pb15) | THROUGH-HOLE | 2.54 mm | DUAL | 4.699 mm | 36.576 mm | 15.24 mm | INTEGRATED DEVICE TECHNOLOGY INC | DIP | PLASTIC, DIP-28 | 28 | not_compliant | EAR99 | 8542.32.00.71 |