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Manufacturer Part Number: idt72v04
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IDT72V04L25JI
 Integrated Device Technology Inc 		Check for Price No No Obsolete 36.864 kbit 9 4KX9 3.3 V 25 ns 28.5 MHz 35 ns OTHER FIFO 1 4000 4.096 k ASYNCHRONOUS 3-STATE NO PARALLEL 300 µA 50 µA 3.6 V 3 V CMOS INDUSTRIAL R-PQCC-J32 Not Qualified e0 1 85 °C -40 °C 225 20 32 PLASTIC/EPOXY QCCJ LDCC32,.5X.6 RECTANGULAR CHIP CARRIER YES Tin/Lead (Sn85Pb15) J BEND 1.27 mm QUAD 3.556 mm 13.9954 mm 11.4554 mm INTEGRATED DEVICE TECHNOLOGY INC QFJ PLASTIC, LCC-32 32 not_compliant EAR99 8542.32.00.71
IDT72V04L25JGI
 Integrated Device Technology Inc 		Check for Price Yes Yes Transferred 36.864 kbit 9 4KX9 3.3 V 25 ns 28.5 MHz 35 ns OTHER FIFO RETRANSMIT 1 4000 4.096 k ASYNCHRONOUS 3-STATE NO PARALLEL 5 mA 60 µA 3.6 V 3 V CMOS INDUSTRIAL R-PQCC-J32 Not Qualified e3 3 85 °C -40 °C 260 30 32 PLASTIC/EPOXY QCCJ LDCC32,.5X.6 RECTANGULAR CHIP CARRIER YES Matte Tin (Sn) - annealed J BEND 1.27 mm QUAD 3.55 mm 13.97 mm 11.43 mm INTEGRATED DEVICE TECHNOLOGY INC QFJ QCCJ, LDCC32,.5X.6 32 compliant EAR99 8542.32.00.71 1988-01-01
IDT72V04L25JG
 Integrated Device Technology Inc 		Check for Price Yes Yes Transferred 36.864 kbit 9 4KX9 3.3 V 25 ns 28.5 MHz 35 ns OTHER FIFO RETRANSMIT 1 4000 4.096 k ASYNCHRONOUS NO PARALLEL 5 mA 60 µA 3.6 V 3 V CMOS COMMERCIAL R-PQCC-J32 Not Qualified e3 3 70 °C 260 30 32 PLASTIC/EPOXY QCCJ LDCC32,.5X.6 RECTANGULAR CHIP CARRIER YES Matte Tin (Sn) - annealed J BEND 1.27 mm QUAD INTEGRATED DEVICE TECHNOLOGY INC QFJ QCCJ, LDCC32,.5X.6 32 compliant EAR99 8542.32.00.71
IDT72V04L35JG8
 Integrated Device Technology Inc 		Check for Price Yes Yes Transferred 36.864 kbit 9 4KX9 3.3 V 35 ns 45 ns RETRANSMIT 1 4000 4.096 k ASYNCHRONOUS 3-STATE NO PARALLEL 3.6 V 3 V CMOS COMMERCIAL R-PQCC-J32 Not Qualified e3 70 °C 32 PLASTIC/EPOXY QCCJ RECTANGULAR CHIP CARRIER YES MATTE TIN J BEND 1.27 mm QUAD 3.55 mm 13.97 mm 11.43 mm INTEGRATED DEVICE TECHNOLOGY INC QFJ QCCJ, 32 compliant EAR99 8542.32.00.71
IDT72V04L25J
 Integrated Device Technology Inc 		Check for Price No No Obsolete 36.864 kbit 9 4KX9 3.3 V 25 ns 28.5 MHz 35 ns OTHER FIFO RETRANSMIT 1 4000 4.096 k ASYNCHRONOUS 3-STATE NO PARALLEL 300 µA 50 µA 3.6 V 3 V CMOS COMMERCIAL R-PQCC-J32 Not Qualified e0 1 70 °C 225 20 32 PLASTIC/EPOXY QCCJ LDCC32,.5X.6 RECTANGULAR CHIP CARRIER YES Tin/Lead (Sn85Pb15) J BEND 1.27 mm QUAD 3.556 mm 13.9954 mm 11.4554 mm INTEGRATED DEVICE TECHNOLOGY INC QFJ PLASTIC, LCC-32 32 not_compliant EAR99 8542.32.00.71
IDT72V04L25J8
 Integrated Device Technology Inc 		Check for Price No No Obsolete 36.864 kbit 9 4KX9 3.3 V 25 ns 28.5 MHz 35 ns OTHER FIFO RETRANSMIT 1 4000 4.096 k ASYNCHRONOUS 3-STATE NO PARALLEL 300 µA 50 µA 3.6 V 3 V CMOS COMMERCIAL R-PQCC-J32 Not Qualified e0 1 70 °C 225 20 32 PLASTIC/EPOXY QCCJ LDCC32,.5X.6 RECTANGULAR CHIP CARRIER YES Tin/Lead (Sn85Pb15) J BEND 1.27 mm QUAD 3.556 mm 13.9954 mm 11.4554 mm INTEGRATED DEVICE TECHNOLOGY INC QFJ PLASTIC, LCC-32 32 not_compliant EAR99 8542.32.00.71
IDT72V04L35J8
 Integrated Device Technology Inc 		Check for Price No No Obsolete 36.864 kbit 9 4KX9 3.3 V 35 ns 22.2 MHz 45 ns OTHER FIFO RETRANSMIT 1 4000 4.096 k ASYNCHRONOUS 3-STATE NO PARALLEL 300 µA 50 µA 3.6 V 3 V CMOS COMMERCIAL R-PQCC-J32 Not Qualified e0 1 70 °C 225 20 32 PLASTIC/EPOXY QCCJ LDCC32,.5X.6 RECTANGULAR CHIP CARRIER YES Tin/Lead (Sn85Pb15) J BEND 1.27 mm QUAD 3.556 mm 13.9954 mm 11.4554 mm INTEGRATED DEVICE TECHNOLOGY INC QFJ PLASTIC, LCC-32 32 not_compliant EAR99 8542.32.00.71
IDT72V04L15J8
 Integrated Device Technology Inc 		Check for Price No No Obsolete 36.864 kbit 9 4KX9 3.3 V 15 ns 50 MHz 25 ns OTHER FIFO 1 4000 4.096 k ASYNCHRONOUS NO PARALLEL 50 µA 3.6 V 3 V CMOS COMMERCIAL R-PQCC-J32 Not Qualified e0 1 70 °C 225 20 32 PLASTIC/EPOXY QCCJ LDCC32,.5X.6 RECTANGULAR CHIP CARRIER YES Tin/Lead (Sn85Pb15) J BEND 1.27 mm QUAD 3.556 mm 13.9954 mm 11.4554 mm INTEGRATED DEVICE TECHNOLOGY INC QFJ PLASTIC, LCC-32 32 not_compliant EAR99 8542.32.00.71
IDT72V04L15JG8
 Integrated Device Technology Inc 		Check for Price Yes Yes Transferred 36.864 kbit 9 4KX9 3.3 V 15 ns 40 MHz 25 ns OTHER FIFO 1 4000 4.096 k ASYNCHRONOUS NO PARALLEL 5 mA 60 µA 3.6 V 3 V CMOS COMMERCIAL R-PQCC-J32 Not Qualified e3 3 70 °C 260 30 32 PLASTIC/EPOXY QCCJ LDCC32,.5X.6 RECTANGULAR CHIP CARRIER YES Matte Tin (Sn) - annealed J BEND 1.27 mm QUAD 3.55 mm 13.97 mm 11.43 mm INTEGRATED DEVICE TECHNOLOGY INC QFJ QCCJ, LDCC32,.5X.6 32 compliant EAR99 8542.32.00.71 1988-01-01
IDT72V04L35JG
 Integrated Device Technology Inc 		Check for Price Yes Yes Transferred 36.864 kbit 9 4KX9 3.3 V 35 ns 22.2 MHz 45 ns OTHER FIFO RETRANSMIT 1 4000 4.096 k ASYNCHRONOUS 3-STATE NO PARALLEL 5 mA 60 µA 3.6 V 3 V CMOS COMMERCIAL R-PQCC-J32 Not Qualified e3 3 70 °C 260 30 32 PLASTIC/EPOXY QCCJ LDCC32,.5X.6 RECTANGULAR CHIP CARRIER YES Matte Tin (Sn) - annealed J BEND 1.27 mm QUAD 3.55 mm 13.97 mm 11.43 mm INTEGRATED DEVICE TECHNOLOGY INC QFJ QCCJ, LDCC32,.5X.6 32 compliant EAR99 8542.32.00.71
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