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IDT72V2113L7.5BCGI
Integrated Device Technology Inc
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Check for Price | Yes | Yes | Transferred | 4.7186 Mbit | 18 | 256KX18 | 3.3 V | 5 ns | 7.5 ns | CAN ALSO BE CONFIGURED AS 524,288 X 9 | 1 | 256000 | 262.144 k | SYNCHRONOUS | YES | PARALLEL | 3.45 V | 3.15 V | CMOS | INDUSTRIAL | S-PBGA-B100 | Not Qualified | e1 | 3 | 85 °C | -40 °C | 100 | PLASTIC/EPOXY | LBGA | SQUARE | GRID ARRAY, LOW PROFILE | YES | TIN SILVER COPPER | BALL | 1 mm | BOTTOM | 1.5 mm | 11 mm | 11 mm | INTEGRATED DEVICE TECHNOLOGY INC | BGA | LBGA, | 100 | compliant | EAR99 | 8542.32.00.71 | |||||||||||
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IDT72V2113L7-5BCGI
Integrated Device Technology Inc
|
Check for Price | Yes | Yes | Transferred | 4.7186 Mbit | 18 | 256KX18 | 3.3 V | 5 ns | 133.3 MHz | 7.5 ns | OTHER FIFO | ALTERNATIVE MEMORY WIDTH 9; ASYNCHRONOUS MODE ALSO POSSIBLE | 9 | 1 | 256000 | 262.144 k | SYNCHRONOUS | YES | PARALLEL | 15 mA | 35 µA | 3.45 V | 3.15 V | CMOS | INDUSTRIAL | S-PBGA-B100 | Not Qualified | e1 | 3 | 85 °C | -40 °C | 260 | 30 | 100 | PLASTIC/EPOXY | LBGA | BGA100,10X10,40 | SQUARE | GRID ARRAY, LOW PROFILE | YES | Tin/Silver/Copper (Sn/Ag/Cu) | BALL | 1 mm | BOTTOM | 1.5 mm | 11 mm | 11 mm | INTEGRATED DEVICE TECHNOLOGY INC | BGA | LBGA, BGA100,10X10,40 | 100 | compliant | EAR99 | 8542.32.00.71 | |||
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IDT72V2113L7-5BC
Integrated Device Technology Inc
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Check for Price | No | No | Transferred | 4.7186 Mbit | 18 | 256KX18 | 3.3 V | 5 ns | 133.3 MHz | 7.5 ns | OTHER FIFO | ALTERNATIVE MEMORY WIDTH 9; ASYNCHRONOUS MODE ALSO POSSIBLE | 9 | 1 | 256000 | 262.144 k | SYNCHRONOUS | YES | PARALLEL | 15 mA | 35 µA | 3.45 V | 3.15 V | CMOS | COMMERCIAL | S-PBGA-B100 | Not Qualified | e0 | 3 | 70 °C | 225 | 30 | 100 | PLASTIC/EPOXY | LBGA | BGA100,10X10,40 | SQUARE | GRID ARRAY, LOW PROFILE | YES | TIN LEAD | BALL | 1 mm | BOTTOM | 1.5 mm | 11 mm | 11 mm | INTEGRATED DEVICE TECHNOLOGY INC | BGA | LBGA, BGA100,10X10,40 | 100 | not_compliant | EAR99 | 8542.32.00.71 | 1998-11-01 | |||
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IDT72V2113L7-5BCG
Integrated Device Technology Inc
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Check for Price | Yes | Yes | Transferred | 4.7186 Mbit | 18 | 256KX18 | 3.3 V | 5 ns | 133.3 MHz | 7.5 ns | OTHER FIFO | ALTERNATIVE MEMORY WIDTH 9; ASYNCHRONOUS MODE ALSO POSSIBLE | 9 | 1 | 256000 | 262.144 k | SYNCHRONOUS | YES | PARALLEL | 15 mA | 35 µA | 3.45 V | 3.15 V | CMOS | COMMERCIAL | S-PBGA-B100 | Not Qualified | e1 | 3 | 70 °C | 260 | 30 | 100 | PLASTIC/EPOXY | LBGA | BGA100,10X10,40 | SQUARE | GRID ARRAY, LOW PROFILE | YES | Tin/Silver/Copper (Sn/Ag/Cu) | BALL | 1 mm | BOTTOM | 1.5 mm | 11 mm | 11 mm | INTEGRATED DEVICE TECHNOLOGY INC | BGA | LBGA, BGA100,10X10,40 | 100 | compliant | EAR99 | 8542.32.00.71 | ||||
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IDT72V2113L7.5BC
Integrated Device Technology Inc
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Check for Price | No | Obsolete | 4.7186 Mbit | 18 | 256KX18 | 3.3 V | 10 ns | 83 MHz | OTHER FIFO | 9 | 256000 | 262.144 k | SYNCHRONOUS/ASYNCHRONOUS | 15 mA | 35 µA | CMOS | COMMERCIAL | S-PBGA-B100 | Not Qualified | e0 | 3 | 70 °C | 225 | 30 | 100 | PLASTIC/EPOXY | BGA | BGA100,10X10,40 | SQUARE | GRID ARRAY | YES | TIN LEAD | BALL | 1 mm | BOTTOM | INTEGRATED DEVICE TECHNOLOGY INC | not_compliant | EAR99 | 8542.32.00.71 | ||||||||||||||||||
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IDT72V2113L7-5BCI
Integrated Device Technology Inc
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Check for Price | No | No | Transferred | 4.7186 Mbit | 18 | 256KX18 | 3.3 V | 5 ns | 133.3 MHz | 7.5 ns | OTHER FIFO | ALTERNATIVE MEMORY WIDTH 9; ASYNCHRONOUS MODE ALSO POSSIBLE | 9 | 1 | 256000 | 262.144 k | SYNCHRONOUS | YES | PARALLEL | 15 mA | 35 µA | 3.45 V | 3.15 V | CMOS | INDUSTRIAL | S-PBGA-B100 | Not Qualified | e0 | 3 | 85 °C | -40 °C | 225 | 30 | 100 | PLASTIC/EPOXY | LBGA | BGA100,10X10,40 | SQUARE | GRID ARRAY, LOW PROFILE | YES | TIN LEAD | BALL | 1 mm | BOTTOM | 1.5 mm | 11 mm | 11 mm | INTEGRATED DEVICE TECHNOLOGY INC | BGA | LBGA, BGA100,10X10,40 | 100 | not_compliant | EAR99 | 8542.32.00.71 | 1998-11-01 | ||
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IDT72V2113L7.5BCG
Integrated Device Technology Inc
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Check for Price | Yes | Yes | Transferred | 4.7186 Mbit | 18 | 256KX18 | 3.3 V | 5 ns | 7.5 ns | CAN ALSO BE CONFIGURED AS 524,288 X 9 | 1 | 256000 | 262.144 k | SYNCHRONOUS | YES | PARALLEL | 3.45 V | 3.15 V | CMOS | COMMERCIAL | S-PBGA-B100 | Not Qualified | e1 | 3 | 70 °C | 100 | PLASTIC/EPOXY | LBGA | SQUARE | GRID ARRAY, LOW PROFILE | YES | TIN SILVER COPPER | BALL | 1 mm | BOTTOM | 1.5 mm | 11 mm | 11 mm | INTEGRATED DEVICE TECHNOLOGY INC | BGA | LBGA, | 100 | compliant | EAR99 | 8542.32.00.71 |