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JAN1N4495
Microchip Technology Inc
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$9.8013 | No | Active | 1.4 mA | 1.5 W | 180 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | NO | 1 | ZENER | HIGH RELIABILITY, METALLURGICALLY BONDED | 5 % | Qualified | O-LALF-W2 | e0 | MIL-19500 | DO-41 | 175 °C | -65 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WIRE | AXIAL | MICROCHIP TECHNOLOGY INC | HERMETIC SEALED, GLASS PACKAGE-2 | compliant | ||||||
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JAN1N4495
Semtech Corporation
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$14.7019 | Transferred | 1.4 mA | 1.5 W | 180 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | NO | 1 | ZENER | 1.3 kΩ | 5 % | Qualified | O-XALF-W2 | MIL-19500/406 | 175 °C | ISOLATED | 2 | UNSPECIFIED | ROUND | LONG FORM | WIRE | AXIAL | SEMTECH CORP | HERMETIC SEALED, G99, 2 PIN | unknown | 2 | EAR99 | 8541.10.00.50 | ||||||||
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JAN1N4495US
Microchip Technology Inc
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$14.7883 | No | Active | 1.4 mA | 1.5 W | 180 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | YES | 1 | ZENER | METALLURGICALLY BONDED | 5 % | Qualified | O-LELF-R2 | e0 | MIL-19500 | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WRAP AROUND | END | MICROCHIP TECHNOLOGY INC | HERMETIC SEALED, GLASS PACKAGE-2 | compliant | |||||||||
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JAN1N4495US
Semtech Corporation
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$15.6715 | Transferred | 1.4 mA | 1.5 W | 180 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | YES | 1 | ZENER | 1.3 kΩ | 5 % | Qualified | O-LELF-R2 | MIL-19500/406 | 175 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | WRAP AROUND | END | SEMTECH CORP | HERMETIC SEALED PACKAGE-2 | unknown | 2 | EAR99 | 8541.10.00.50 | ||||||||
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JAN1N4495C
Microchip Technology Inc
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$25.0930 | No | Active | 1.4 mA | 1.5 W | 180 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | NO | 1 | ZENER | HIGH RELIABILITY, METALLURGICALLY BONDED | 2 % | Qualified | O-LALF-W2 | e0 | MIL-19500 | DO-41 | 175 °C | -65 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WIRE | AXIAL | MICROCHIP TECHNOLOGY INC | HERMETIC SEALED, GLASS PACKAGE-2 | compliant | ||||||
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JAN1N4495D
Microchip Technology Inc
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$26.2221 | No | Active | 1.4 mA | 1.5 W | 180 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | NO | 1 | ZENER | HIGH RELIABILITY, METALLURGICALLY BONDED | 1 % | Qualified | O-LALF-W2 | e0 | MIL-19500 | DO-41 | 175 °C | -65 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WIRE | AXIAL | MICROCHIP TECHNOLOGY INC | HERMETIC SEALED, GLASS PACKAGE-2 | compliant | ||||||
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JAN1N4495CUS
Microchip Technology Inc
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$27.5684 | No | Active | 1.4 mA | 1.5 W | 180 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | YES | 1 | ZENER | HIGH RELIABILITY, METALLURGICALLY BONDED | 2 % | Qualified | O-LELF-R2 | e0 | MIL-19500/406 | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WRAP AROUND | END | MICROCHIP TECHNOLOGY INC | HERMETIC SEALED, GLASS, D-5A, 2 PIN | compliant | |||||||||
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JAN1N4495DUS
Microchip Technology Inc
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$34.4629 | No | Active | 1.4 mA | 1.5 W | 180 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | YES | 1 | ZENER | HIGH RELIABILITY, METALLURGICALLY BONDED | 1 % | Qualified | O-LELF-R2 | e0 | MIL-19500/406 | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WRAP AROUND | END | MICROCHIP TECHNOLOGY INC | HERMETIC SEALED, GLASS, D-5A, 2 PIN | compliant | |||||||||
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JAN1N4495USD
Microsemi Corporation
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Check for Price | No | Obsolete | 1.4 mA | 1.5 W | 180 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | YES | 1 | ZENER | METALLURGICALLY BONDED | 1 % | Not Qualified | O-LELF-R2 | e0 | MIL-19500 | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WRAP AROUND | END | MICROSEMI CORP | O-LELF-R2 | compliant | 2 | EAR99 | 8541.10.00.50 | ||||||
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JAN1N4495US
Bkc Semiconductors Inc
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Check for Price | No | Obsolete | 1.4 mA | 1.5 W | 180 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | YES | 1 | ZENER | HIGH SURGE CAPABILITY | 1.3 kΩ | 5 % | Not Qualified | O-MELF-R2 | e0 | MIL-19500/406 | 175 °C | ISOLATED | 2 | METAL | ROUND | LONG FORM | TIN LEAD | WRAP AROUND | END | BKC SEMICONDUCTORS INC | unknown |