Filter Your Search
1 - 7 of 7 results
|
|
JAN1N6642UBCA
Microchip Technology Inc
|
$24.6767 | No | Active | 300 mA | 800 mV | 5 ns | SILICON | RECTIFIER DIODE | COMMON ANODE, 2 ELEMENTS | YES | 100 V | 2 | METALLURGICALLY BONDED | GENERAL PURPOSE | 2.5 A | 1 | Qualified | R-CDSO-N3 | e0 | MIL-19500/578E | 200 °C | 3 | CERAMIC, METAL-SEALED COFIRED | RECTANGULAR | SMALL OUTLINE | TIN LEAD | NO LEAD | DUAL | MICROCHIP TECHNOLOGY INC | CERAMIC PACKAGE-3 | compliant | |||||||||||
|
|
JAN1N6642UBCA
Defense Logistics Agency
|
Check for Price | Active | 300 mA | 5 ns | SILICON | RECTIFIER DIODE | COMMON ANODE, 2 ELEMENTS | YES | 75 V | 2 | METALLURGICALLY BONDED | GENERAL PURPOSE | Qualified | R-CDSO-N3 | MIL-19500/578E | 3 | CERAMIC, METAL-SEALED COFIRED | RECTANGULAR | SMALL OUTLINE | NO LEAD | DUAL | DEFENSE LOGISTICS AGENCY | CERAMIC PACKAGE-3 | unknown | ||||||||||||||||||
|
|
JAN1N6642UBCA
MACOM
|
Check for Price | Transferred | 300 mA | 5 ns | SILICON | RECTIFIER DIODE | COMMON ANODE, 2 ELEMENTS | YES | 75 V | 2 | METALLURGICALLY BONDED | Qualified | R-CDSO-N3 | e0 | MIL-19500/578E | NOT SPECIFIED | NOT SPECIFIED | 3 | CERAMIC, METAL-SEALED COFIRED | RECTANGULAR | SMALL OUTLINE | TIN LEAD | NO LEAD | DUAL | M/A-COM TECHNOLOGY SOLUTIONS INC | CERAMIC PACKAGE-3 | compliant | EAR99 | 8541.10.00.70 | |||||||||||||
|
|
JAN1N6642UBCA
Cobham PLC
|
Check for Price | Transferred | 300 mA | 5 ns | SILICON | RECTIFIER DIODE | COMMON ANODE, 2 ELEMENTS | YES | 75 V | 2 | METALLURGICALLY BONDED | Not Qualified | R-CDSO-N3 | e0 | MIL-19500/578E | NOT SPECIFIED | NOT SPECIFIED | 3 | CERAMIC, METAL-SEALED COFIRED | RECTANGULAR | SMALL OUTLINE | TIN LEAD | NO LEAD | DUAL | COBHAM PLC | CERAMIC PACKAGE-3 | unknown | EAR99 | 8541.10.00.70 | |||||||||||||
|
|
JAN1N6642UBCA
VPT Components
|
Check for Price | No | Active | 300 mA | 1.2 V | 5 ns | 500 nA | SILICON | RECTIFIER DIODE | COMMON ANODE, 2 ELEMENTS | YES | 75 V | 2 | FAST RECOVERY | 2.5 A | 1 | 75 V | Qualified | R-CDSO-N3 | MIL-19500 | 200 °C | -65 °C | NOT SPECIFIED | NOT SPECIFIED | 3 | CERAMIC, METAL-SEALED COFIRED | RECTANGULAR | SMALL OUTLINE | NO LEAD | DUAL | VPT COMPONENTS | compliant | EAR99 | |||||||||
|
|
JAN1N6642UBCA
Cobham Semiconductor Solutions
|
Check for Price | No | Transferred | 300 mA | 5 ns | SILICON | RECTIFIER DIODE | COMMON ANODE, 2 ELEMENTS | YES | 75 V | 2 | METALLURGICALLY BONDED | Not Qualified | R-CDSO-N3 | e0 | MIL-19500/578E | NOT SPECIFIED | NOT SPECIFIED | 3 | CERAMIC, METAL-SEALED COFIRED | RECTANGULAR | SMALL OUTLINE | TIN LEAD | NO LEAD | DUAL | AEROFLEX/METELICS INC | CERAMIC PACKAGE-3 | unknown | EAR99 | 8541.10.00.70 | 3 | |||||||||||
|
|
JAN1N6642UBCA
Microsemi Corporation
|
Check for Price | No | No | Transferred | 300 mA | 800 mV | 5 ns | SILICON | RECTIFIER DIODE | COMMON ANODE, 2 ELEMENTS | YES | 100 V | 2 | METALLURGICALLY BONDED | GENERAL PURPOSE | 2.5 A | Not Qualified | R-CDSO-N3 | e0 | MIL-19500/578E | 200 °C | 3 | CERAMIC, METAL-SEALED COFIRED | RECTANGULAR | SMALL OUTLINE | TIN LEAD | NO LEAD | DUAL | MICROSEMI CORP | CERAMIC PACKAGE-3 | unknown | EAR99 | 8541.10.00.70 | 3 |