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JAN1N746A-1
Microchip Technology Inc
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$2.0997 | No | Active | 20 mA | 500 mW | 3.3 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | NO | 1 | ZENER | METALLURGICALLY BONDED | 5 % | Qualified | O-LALF-W2 | e0 | MIL-19500/127 | DO-35 | 175 °C | -65 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WIRE | AXIAL | MICROCHIP TECHNOLOGY INC | HERMETIC SEALED, GLASS PACKAGE-2 | compliant | ||||||||
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JAN1N746A-1/TR
Microchip Technology Inc
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$2.2511 | No | Active | 120 mA | 5 µA | 500 mW | 3.3 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | NO | 1 | ZENER | METALLURGICALLY BONDED | 24 Ω | 1 V | -2.31 mV/°C | 5 % | O-LALF-W2 | e0 | MIL-PRF-19500; MIL-STD-750 | DO-204AH | 175 °C | -65 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | Tin/Lead (Sn/Pb) | WIRE | AXIAL | MICROCHIP TECHNOLOGY INC | DO-35, 2 PIN | compliant | |||||
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JAN1N746AUR-1
Microchip Technology Inc
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$4.5828 | No | Active | 20 mA | 5 µA | 500 mW | 3.3 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | YES | 1 | ZENER | METALLURGICALLY BONDED | 24 Ω | 1 V | 5 % | Qualified | O-LELF-R2 | e0 | MIL-19500 | DO-213AA | 175 °C | -65 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | Tin/Lead (Sn/Pb) | WRAP AROUND | END | MICROCHIP TECHNOLOGY INC | MELF-2 | compliant | |||||
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JAN1N746C-1
Microchip Technology Inc
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$5.3520 | No | Active | 20 mA | 500 mW | 3.3 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | NO | 1 | ZENER | METALLURGICALLY BONDED | 2 % | Qualified | O-LALF-W2 | e0 | MIL-19500/127 | DO-35 | ISOLATED | 2 | GLASS | ROUND | LONG FORM | Tin/Lead (Sn/Pb) | WIRE | AXIAL | MICROCHIP TECHNOLOGY INC | HERMETIC SEALED, GLASS PACKAGE-2 | compliant | ||||||||||
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JAN1N746C-1/TR
Microchip Technology Inc
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$5.5162 | No | Active | 120 mA | 5 µA | 500 mW | 3.3 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | NO | 1 | ZENER | METALLURGICALLY BONDED | 24 Ω | 1 V | -2.31 mV/°C | 2 % | O-LALF-W2 | e0 | MIL-PRF-19500; MIL-STD-750 | DO-204AH | 175 °C | -65 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | Tin/Lead (Sn/Pb) | WIRE | AXIAL | MICROCHIP TECHNOLOGY INC | DO-35, 2 PIN | compliant | |||||
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JAN1N746D-1
Microchip Technology Inc
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$6.6925 | No | Active | 20 mA | 500 mW | 3.3 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | NO | 1 | ZENER | METALLURGICALLY BONDED | 1 % | Qualified | O-LALF-W2 | e0 | MIL-19500/127 | DO-35 | ISOLATED | 2 | GLASS | ROUND | LONG FORM | Tin/Lead (Sn/Pb) | WIRE | AXIAL | MICROCHIP TECHNOLOGY INC | HERMETIC SEALED, GLASS PACKAGE-2 | compliant | ||||||||||
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JAN1N746D-1/TR
Microchip Technology Inc
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$6.8496 | No | Active | 120 mA | 5 µA | 500 mW | 3.3 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | NO | 1 | ZENER | METALLURGICALLY BONDED | 24 Ω | 1 V | -2.31 mV/°C | 1 % | O-LALF-W2 | e0 | MIL-PRF-19500; MIL-STD-750 | DO-204AH | 175 °C | -65 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | Tin/Lead (Sn/Pb) | WIRE | AXIAL | MICROCHIP TECHNOLOGY INC | DO-35, 2 PIN | compliant | |||||
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JAN1N746CUR-1
Microchip Technology Inc
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$11.7410 | No | Active | 20 mA | 5 µA | 500 mW | 3.3 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | YES | 1 | ZENER | METALLURGICALLY BONDED | 24 Ω | 1 V | 2 % | Qualified | O-LELF-R2 | e0 | MIL-19500 | DO-213AA | 175 °C | -65 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | Tin/Lead (Sn/Pb) | WRAP AROUND | END | MICROCHIP TECHNOLOGY INC | MELF-2 | compliant | |||||
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JAN1N746DUR-1
Microchip Technology Inc
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$14.6719 | No | Active | 20 mA | 5 µA | 500 mW | 3.3 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | YES | 1 | ZENER | METALLURGICALLY BONDED | 24 Ω | 1 V | 1 % | Qualified | O-LELF-R2 | e0 | MIL-19500 | DO-213AA | 175 °C | -65 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | Tin/Lead (Sn/Pb) | WRAP AROUND | END | MICROCHIP TECHNOLOGY INC | MELF-2 | compliant | |||||
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JAN1N746A-1
Cobham PLC
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Check for Price | Transferred | 20 mA | 500 mW | 3.3 V | SILICON | ZENER DIODE | UNIDIRECTIONAL | SINGLE | YES | 1 | ZENER | 5 % | Not Qualified | O-LELF-R2 | MIL | DO-213AA | ISOLATED | 2 | GLASS | ROUND | LONG FORM | WRAP AROUND | END | COBHAM PLC | unknown | EAR99 | 8541.10.00.50 |