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JAN1N938B-1
Microchip Technology Inc
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Check for Price | No | Active | 500 mW | 9 V | SILICON | ZENER DIODE | SINGLE | NO | 1 | ZENER | METALLURGICALLY BONDED | 0.09 mV/°C | 5 % | Qualified | O-LALF-W2 | e0 | MIL-19500 | DO-35 | 175 °C | -65 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WIRE | AXIAL | MICROCHIP TECHNOLOGY INC | HERMETIC SEALED, GLASS PACKAGE-2 | compliant | Microchip | |||||||
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JAN1N938B-1
Defense Logistics Agency
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Check for Price | Active | 500 mW | 9 V | SILICON | ZENER DIODE | SINGLE | NO | 1 | ZENER | 5 % | Qualified | O-LALF-W2 | MIL-19500/156M | DO-35 | ISOLATED | 2 | GLASS | ROUND | LONG FORM | WIRE | AXIAL | DEFENSE LOGISTICS AGENCY | HERMETIC SEALED, GLASS, DO-7, 2 PIN | unknown | |||||||||||||||
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JAN1N938B-1
Microsemi Corporation
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Check for Price | No | No | Transferred | 500 mW | 9 V | SILICON | ZENER DIODE | SINGLE | NO | 1 | ZENER | METALLURGICALLY BONDED | 0.09 mV/°C | 5 % | Not Qualified | O-LALF-W2 | e0 | MIL-19500 | DO-35 | 175 °C | -65 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | TIN LEAD | WIRE | AXIAL | MICROSEMI CORP | HERMETIC SEALED, GLASS PACKAGE-2 | unknown | Microsemi Corporation | DO-7 | 2 | EAR99 | 8541.10.00.50 | ||
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JAN1N938B-1
Compensated Devices Inc
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Check for Price | Transferred | 500 mW | 9 V | SILICON | ZENER DIODE | SINGLE | NO | 1 | ZENER | METALLURGICALLY BONDED | 0.09 mV/°C | 5 % | Not Qualified | O-LALF-W2 | MIL-19500/156M | DO-35 | 175 °C | -65 °C | ISOLATED | 2 | GLASS | ROUND | LONG FORM | WIRE | AXIAL | COMPENSATED DEVICES INC | HERMETIC SEALED, GLASS, DO-7, 2 PIN | unknown |