Parametric results for: k8d6316ubm-li07 under Flash Memories

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Manufacturer Part Number: k8d6316ubmli07
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K8D6316UBM-LI07T
Samsung Semiconductor
Check for Price Yes Obsolete 67.1089 Mbit 16 8K,64K 4MX16 70 ns FLASH 8 BOTTOM YES YES YES 8,127 4000000 4.1943 M PARALLEL YES 30 µA 50 µA CMOS INDUSTRIAL YES NOR TYPE R-PBGA-B48 Not Qualified 85 °C -40 °C 48 PLASTIC/EPOXY FBGA BGA48,6X8,32 RECTANGULAR GRID ARRAY, FINE PITCH YES BALL 800 µm BOTTOM SAMSUNG SEMICONDUCTOR INC FBGA, BGA48,6X8,32 compliant EAR99 8542.32.00.51
K8D6316UBM-LI07
Samsung Semiconductor
Check for Price Yes Obsolete 67.1089 Mbit 16 8K,64K 4MX16 70 ns FLASH 8 BOTTOM YES YES YES 8,127 4000000 4.1943 M PARALLEL YES 30 µA 50 µA CMOS INDUSTRIAL YES NOR TYPE R-PBGA-B48 Not Qualified 85 °C -40 °C 48 PLASTIC/EPOXY FBGA BGA48,6X8,32 RECTANGULAR GRID ARRAY, FINE PITCH YES BALL 800 µm BOTTOM SAMSUNG SEMICONDUCTOR INC FBGA, BGA48,6X8,32 compliant EAR99 8542.32.00.51
K8D6316UBM-LI070
Samsung Semiconductor
Check for Price Yes Obsolete 67.1089 Mbit 16 8K,64K 4MX16 3 V 70 ns FLASH 8 BOTTOM YES YES YES 1 8,127 4000000 4.1943 M ASYNCHRONOUS PARALLEL 2.7 V YES 30 µA 50 µA 3.6 V 2.7 V CMOS INDUSTRIAL YES NOR TYPE R-PBGA-B48 Not Qualified e1 2 85 °C -40 °C 48 PLASTIC/EPOXY VFBGA BGA48,6X8,32 RECTANGULAR GRID ARRAY, VERY THIN PROFILE, FINE PITCH YES TIN SILVER COPPER BALL 800 µm BOTTOM 1 mm 9 mm 6 mm SAMSUNG SEMICONDUCTOR INC VFBGA, BGA48,6X8,32 compliant EAR99 8542.32.00.51 BGA 48
K8D6316UBMLI0700
Samsung Semiconductor
Check for Price Yes Obsolete 67.1089 Mbit 16 4MX16 3 V 70 ns FLASH 8 BOTTOM 1 4000000 4.1943 M ASYNCHRONOUS PARALLEL 2.7 V 3.6 V 2.7 V CMOS INDUSTRIAL NOR TYPE R-PBGA-B48 Not Qualified e1 2 85 °C -40 °C 48 PLASTIC/EPOXY VFBGA RECTANGULAR GRID ARRAY, VERY THIN PROFILE, FINE PITCH YES TIN SILVER COPPER BALL 800 µm BOTTOM 1 mm 9 mm 6 mm SAMSUNG SEMICONDUCTOR INC VFBGA, compliant EAR99 8542.32.00.51 BGA 48