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KAD5512HP-17Q48
Renesas Electronics Corporation
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$47.2000 | Yes | End Of Life | 1.8 V | 1.54 V | 1 | 0.048828 % | 12 | 170 MHz | 5.88 ns | YES | ADC, PROPRIETARY METHOD | -1.54 V | 1 | OFFSET BINARY, 2'S COMPLEMENT BINARY, GRAY CODE | SAMPLE | CMOS | INDUSTRIAL | PARALLEL, WORD | S-PQCC-N48 | e3 | 3 | 85 °C | -40 °C | 260 | 30 | 48 | PLASTIC/EPOXY | HVQCCN | LCC48,.27SQ,20 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | MATTE TIN | NO LEAD | 500 µm | QUAD | 7 mm | 900 µm | 7 mm | RENESAS ELECTRONICS CORP | QFN | HVQCCN, LCC48,.27SQ,20 | 48 | L48.7X7E | compliant | 3A991.C.2 | 8542.39.00.01 | 2017-10-26 | Renesas Electronics | |||
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KAD5512HP-17Q48
Intersil Corporation
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Check for Price | Transferred | 1.8 V | 1.54 V | 1 | 0.0488 % | 12 | 170 MHz | 5.9 ns | YES | ADC, PROPRIETARY METHOD | 1 | OFFSET BINARY, 2'S COMPLEMENT BINARY, GRAY CODE | SAMPLE | CMOS | INDUSTRIAL | PARALLEL, WORD | S-PQCC-N48 | Not Qualified | e3 | 3 | 85 °C | -40 °C | 260 | 30 | 48 | PLASTIC/EPOXY | HVQCCN | LCC48,.27SQ,20 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | MATTE TIN | NO LEAD | 500 µm | QUAD | 7 mm | 900 µm | 7 mm | INTERSIL CORP | QFN, QFN | HVQCCN, LCC48,.27SQ,20 | 48, 72 | compliant | 3A991.C.2 | 8542.39.00.01 |