Findchips: Parametric Search Results for lld


Select Parts		Part Number

		GS4288C18GL-24IT GSI Technology
		GS4288S18GL-24I GSI Technology
		GS4288C18GL-24I GSI Technology
		GS4288S18GL-24IT GSI Technology

			Most Relevant							Technical																Compliance		Operating Conditions			Physical											Dimensions			Other
Composite Price	Rohs Code	Part Life Cycle Code	Memory Density	Memory Width	Organization	Supply Voltage-Nom (Vsup)	Clock Frequency-Max (fCLK)	Refresh Cycles	Access Mode	Memory IC Type	Additional Feature	I/O Type	Interleaved Burst Length	Number of Functions	Number of Ports	Number of Words Code	Number of Words	Operating Mode	Self Refresh	Sequential Burst Length	Standby Current-Max	Supply Current-Max	Supply Voltage-Max (Vsup)	Supply Voltage-Min (Vsup)	Technology	JESD-30 Code	JESD-609 Code	Moisture Sensitivity Level	Operating Temperature-Max	Operating Temperature-Min	Number of Terminals	Package Body Material	Package Code	Package Equivalence Code	Package Shape	Package Style	Surface Mount	Terminal Finish	Terminal Form	Terminal Pitch	Terminal Position	Seated Height-Max	Length	Width	Ihs Manufacturer	Package Description	Reach Compliance Code	ECCN Code	HTS Code

Check for Price

Obsolete

301.9899 Mbit

16MX18

1.8 V

400 MHz

8192

MULTI BANK PAGE BURST

LLDRAM2

AUTO REFRESH

2,4,8

16000000

16.7772 M

SYNCHRONOUS

2,4,8

1.9 V

1.7 V

CMOS

R-PBGA-B144

95 °C

-40 °C

144

PLASTIC/EPOXY

TBGA

BGA144,12X18,40/32

RECTANGULAR

GRID ARRAY, THIN PROFILE

YES

BALL

1 mm

BOTTOM

1.2 mm

18.5 mm

11 mm

GSI TECHNOLOGY

compliant

EAR99

8542.32.00.28

Check for Price

Yes

Active

301.9899 Mbit

16MX18

1.8 V

400 MHz

8192

MULTI BANK PAGE BURST

LLDRAM2

AUTO REFRESH

SEPARATE

2,4,8

16000000

16.7772 M

SYNCHRONOUS

2,4,8

30 mA

475 µA

1.9 V

1.7 V

CMOS

R-PBGA-B144

95 °C

-40 °C

144

PLASTIC/EPOXY

TBGA

BGA144,12X18,40/32

RECTANGULAR

GRID ARRAY, THIN PROFILE

YES

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

1 mm

BOTTOM

1.2 mm

18.5 mm

11 mm

GSI TECHNOLOGY

compliant

EAR99

8542.32.00.28

Check for Price

Yes

Obsolete

301.9899 Mbit

16MX18

1.8 V

400 MHz

8192

MULTI BANK PAGE BURST

LLDRAM2

AUTO REFRESH

2,4,8

16000000

16.7772 M

SYNCHRONOUS

2,4,8

1.9 V

1.7 V

CMOS

R-PBGA-B144

95 °C

-40 °C

144

PLASTIC/EPOXY

TBGA

BGA144,12X18,40/32

RECTANGULAR

GRID ARRAY, THIN PROFILE

YES

BALL

1 mm

BOTTOM

1.2 mm

18.5 mm

11 mm

GSI TECHNOLOGY

compliant

EAR99

8542.32.00.28

Check for Price

Active

301.9899 Mbit

16MX18

1.8 V

400 MHz

8192

MULTI BANK PAGE BURST

LLDRAM2

AUTO REFRESH

SEPARATE

2,4,8

16000000

16.7772 M

SYNCHRONOUS

2,4,8

30 mA

475 µA

1.9 V

1.7 V

CMOS

R-PBGA-B144

95 °C

-40 °C

144

PLASTIC/EPOXY

TBGA

BGA144,12X18,40/32

RECTANGULAR

GRID ARRAY, THIN PROFILE

YES

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

1 mm

BOTTOM

1.2 mm

18.5 mm

11 mm

GSI TECHNOLOGY

compliant

EAR99

8542.32.00.28

Compare

GS4288C18GL-24IT

GSI Technology

Check for Price

Obsolete

301.9899 Mbit

16MX18

1.8 V

400 MHz

8192

MULTI BANK PAGE BURST

LLDRAM2

AUTO REFRESH

2,4,8

16000000

16.7772 M

SYNCHRONOUS

2,4,8

1.9 V

1.7 V

CMOS

R-PBGA-B144

95 °C

-40 °C

144

PLASTIC/EPOXY

TBGA

BGA144,12X18,40/32

RECTANGULAR

GRID ARRAY, THIN PROFILE

YES

BALL

1 mm

BOTTOM

1.2 mm

18.5 mm

11 mm

GSI TECHNOLOGY

compliant

EAR99

8542.32.00.28

GS4288S18GL-24I

GSI Technology

Check for Price

Yes

Active

301.9899 Mbit

16MX18

1.8 V

400 MHz

8192

MULTI BANK PAGE BURST

LLDRAM2

AUTO REFRESH

SEPARATE

2,4,8

16000000

16.7772 M

SYNCHRONOUS

2,4,8

30 mA

475 µA

1.9 V

1.7 V

CMOS

R-PBGA-B144

95 °C

-40 °C

144

PLASTIC/EPOXY

TBGA

BGA144,12X18,40/32

RECTANGULAR

GRID ARRAY, THIN PROFILE

YES

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

1 mm

BOTTOM

1.2 mm

18.5 mm

11 mm

GSI TECHNOLOGY

compliant

EAR99

8542.32.00.28

GS4288C18GL-24I

GSI Technology

Check for Price

Yes

Obsolete

301.9899 Mbit

16MX18

1.8 V

400 MHz

8192

MULTI BANK PAGE BURST

LLDRAM2

AUTO REFRESH

2,4,8

16000000

16.7772 M

SYNCHRONOUS

2,4,8

1.9 V

1.7 V

CMOS

R-PBGA-B144

95 °C

-40 °C

144

PLASTIC/EPOXY

TBGA

BGA144,12X18,40/32

RECTANGULAR

GRID ARRAY, THIN PROFILE

YES

BALL

1 mm

BOTTOM

1.2 mm

18.5 mm

11 mm

GSI TECHNOLOGY

compliant

EAR99

8542.32.00.28

GS4288S18GL-24IT

GSI Technology

Check for Price

Active

301.9899 Mbit

16MX18

1.8 V

400 MHz

8192

MULTI BANK PAGE BURST

LLDRAM2

AUTO REFRESH

SEPARATE

2,4,8

16000000

16.7772 M

SYNCHRONOUS

2,4,8

30 mA

475 µA

1.9 V

1.7 V

CMOS

R-PBGA-B144

95 °C

-40 °C

144

PLASTIC/EPOXY

TBGA

BGA144,12X18,40/32

RECTANGULAR

GRID ARRAY, THIN PROFILE

YES

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

1 mm

BOTTOM

1.2 mm

18.5 mm

11 mm

GSI TECHNOLOGY

compliant

EAR99

8542.32.00.28

Parametric results for: lld under DRAMs