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LTC1407CMSE-1#PBF
Linear Technology
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$3.9499 | Yes | Transferred | 3 V | 1.25 V | 2 | 0.0488 % | 12 | 3 MHz | 660 ns | YES | ADC, PROPRIETARY METHOD | -1.25 V | 1 | 2'S COMPLEMENT BINARY | SAMPLE | CMOS | COMMERCIAL | SERIAL | S-PDSO-G10 | Not Qualified | e3 | 1 | 70 °C | 260 | 30 | 10 | PLASTIC/EPOXY | HTSSOP | TSSOP10,.19,20 | SQUARE | SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH | Matte Tin (Sn) | GULL WING | 500 µm | DUAL | 3 mm | 1.1 mm | 3 mm | LINEAR TECHNOLOGY CORP | MSOP | LEAD FREE, PLASTIC, MSOP-10 | 10 | MSE | compliant | 8542.39.00.01 | ||||
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LTC1407CMSE-1
Analog Devices Inc
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Check for Price | No | Active | 3 V | 1.25 V | 2 | 0.0488 % | 12 | 3 MHz | YES | ADC, PROPRIETARY METHOD | -1.25 V | 1 | 2'S COMPLEMENT BINARY | SAMPLE | COMMERCIAL | SERIAL | S-PDSO-G10 | Not Qualified | e0 | 1 | 70 °C | 10 | PLASTIC/EPOXY | HTSSOP | SQUARE | SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH | Tin/Lead (Sn/Pb) | GULL WING | 500 µm | DUAL | 3 mm | 1.1 mm | 3 mm | ANALOG DEVICES INC | PLASTIC, MSOP-10 | not_compliant | 8542.39.00.01 | ||||||||||||
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LTC1407CMSE-1#TRPBF
Linear Technology
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Check for Price | Yes | Transferred | 3 V | 1.25 V | 2 | 0.0488 % | 12 | 3 MHz | 660 ns | YES | ADC, PROPRIETARY METHOD | -1.25 V | 1 | 2'S COMPLEMENT BINARY | SAMPLE | CMOS | COMMERCIAL | SERIAL | S-PDSO-G10 | Not Qualified | e3 | 1 | 70 °C | 260 | 30 | 10 | PLASTIC/EPOXY | HTSSOP | TSSOP10,.19,20 | SQUARE | SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH | Matte Tin (Sn) | GULL WING | 500 µm | DUAL | 3 mm | 1.1 mm | 3 mm | LINEAR TECHNOLOGY CORP | MSOP | LEAD FREE, PLASTIC, MSOP-10 | 10 | MSE | compliant | 8542.39.00.01 | ||||
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LTC1407CMSE-1#TR
Analog Devices Inc
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Check for Price | No | Obsolete | 3 V | 1.25 V | 2 | 0.0488 % | 12 | 3 MHz | YES | ADC, PROPRIETARY METHOD | -1.25 V | 1 | 2'S COMPLEMENT BINARY | SAMPLE | COMMERCIAL | SERIAL | S-PDSO-G10 | Not Qualified | e0 | 1 | 70 °C | 10 | PLASTIC/EPOXY | HTSSOP | SQUARE | SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH | Tin/Lead (Sn/Pb) | GULL WING | 500 µm | DUAL | 3 mm | 1.1 mm | 3 mm | ANALOG DEVICES INC | HTSSOP, | not_compliant | 8542.39.00.01 | ||||||||||||
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LTC1407CMSE-1#TRPBF
Analog Devices Inc
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Check for Price | No | Yes | Active | 3 V | 1.25 V | 2 | 0.0488 % | 12 | 3 MHz | 660 ns | YES | ADC, PROPRIETARY METHOD | -1.25 V | 1 | 2'S COMPLEMENT BINARY | SAMPLE | CMOS | COMMERCIAL | SERIAL | S-PDSO-G10 | Not Qualified | e3 | 1 | 70 °C | 260 | 30 | 10 | PLASTIC/EPOXY | HTSSOP | SQUARE | SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH | Matte Tin (Sn) - annealed | GULL WING | 500 µm | DUAL | 3 mm | 1.1 mm | 3 mm | ANALOG DEVICES INC | LEAD FREE, PLASTIC, MSOP-10 | 10 | 05-08-1664 | compliant | Analog Devices | |||||
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LTC1407CMSE-1#PBF
Analog Devices Inc
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Check for Price | No | Yes | Active | 3 V | 1.25 V | 2 | 0.0488 % | 12 | 3 MHz | 660 ns | YES | ADC, PROPRIETARY METHOD | -1.25 V | 1 | 2'S COMPLEMENT BINARY | SAMPLE | CMOS | COMMERCIAL | SERIAL | S-PDSO-G10 | Not Qualified | e3 | 1 | 70 °C | 260 | 30 | 10 | PLASTIC/EPOXY | HTSSOP | SQUARE | SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH | Matte Tin (Sn) | GULL WING | 500 µm | DUAL | 3 mm | 1.1 mm | 3 mm | ANALOG DEVICES INC | LEAD FREE, PLASTIC, MSOP-10 | 10 | 05-08-1664 | compliant | Analog Devices | |||||
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LTC1407CMSE-1
Linear Technology
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Check for Price | No | Transferred | 3 V | 1.25 V | 2 | 0.0488 % | 12 | 3 MHz | YES | ADC, PROPRIETARY METHOD | -1.25 V | 1 | 2'S COMPLEMENT BINARY | SAMPLE | CMOS | COMMERCIAL | SERIAL | S-PDSO-G10 | Not Qualified | e0 | 1 | 70 °C | 10 | PLASTIC/EPOXY | HTSSOP | TSSOP10,.19,20 | SQUARE | SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH | TIN LEAD | GULL WING | 500 µm | DUAL | 3 mm | 1.1 mm | 3 mm | LINEAR TECHNOLOGY CORP | MSOP | HTSSOP, TSSOP10,.19,20 | 10 | MSE | not_compliant | 8542.39.00.01 | |||||||
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LTC1407CMSE-1#TR
Linear Technology
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Check for Price | No | Transferred | 3 V | 1.25 V | 2 | 0.0488 % | 12 | 3 MHz | YES | ADC, PROPRIETARY METHOD | -1.25 V | 1 | 2'S COMPLEMENT BINARY | SAMPLE | CMOS | COMMERCIAL | SERIAL | S-PDSO-G10 | Not Qualified | e0 | 1 | 70 °C | 10 | PLASTIC/EPOXY | HTSSOP | TSSOP10,.19,20 | SQUARE | SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH | TIN LEAD | GULL WING | 500 µm | DUAL | 3 mm | 1.1 mm | 3 mm | LINEAR TECHNOLOGY CORP | MSOP | HTSSOP, TSSOP10,.19,20 | 10 | MSE | not_compliant | 8542.39.00.01 |