Parametric results for: ltc2637h under Digital to Analog Converters
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LTC2637HDE-HZ8#PBF
Linear Technology
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$4.4778 | Yes | Transferred | 5 V | 4.096 V | 0.1953 % | 8 | YES | D/A CONVERTER | BINARY | SERIAL | 8 | 3.9 µs | 1.5 mA | CMOS | AUTOMOTIVE | R-PDSO-N14 | Not Qualified | e3 | 1 | 125 °C | -40 °C | 260 | 30 | 14 | PLASTIC/EPOXY | HVSON | SOLCC14,.12,20 | RECTANGULAR | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | MATTE TIN | NO LEAD | 500 µm | DUAL | 3 mm | 800 µm | 4 mm | LINEAR TECHNOLOGY CORP | DFN | 4 X 3 MM, LEAD FREE, PLASTIC, MO-229WGED-3, DFN-14 | 14 | DE | compliant | 8542.39.00.01 | ||
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LTC2637HDE-HMX8#PBF
Linear Technology
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$4.4778 | Yes | Transferred | 5 V | 4.096 V | 0.1953 % | 8 | YES | D/A CONVERTER | BINARY | SERIAL | 8 | 3.9 µs | 1.5 mA | CMOS | AUTOMOTIVE | R-PDSO-N14 | Not Qualified | e3 | 1 | 125 °C | -40 °C | 260 | 30 | 14 | PLASTIC/EPOXY | HVSON | SOLCC14,.12,20 | RECTANGULAR | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | MATTE TIN | NO LEAD | 500 µm | DUAL | 3 mm | 800 µm | 4 mm | LINEAR TECHNOLOGY CORP | DFN | 4 X 3 MM, LEAD FREE, PLASTIC, MO-229WGED-3, DFN-14 | 14 | DE | compliant | 8542.39.00.01 | ||
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LTC2637HDE-LMI8#PBF
Linear Technology
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$4.4778 | Yes | Transferred | 3 V | 2.5 V | 0.1953 % | 8 | YES | D/A CONVERTER | BINARY | SERIAL | 8 | 3.5 µs | 1.5 mA | CMOS | AUTOMOTIVE | R-PDSO-N14 | Not Qualified | e3 | 1 | 125 °C | -40 °C | 260 | 30 | 14 | PLASTIC/EPOXY | HVSON | SOLCC14,.12,20 | RECTANGULAR | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | MATTE TIN | NO LEAD | 500 µm | DUAL | 3 mm | 800 µm | 4 mm | LINEAR TECHNOLOGY CORP | DFN | 4 X 3 MM, LEAD FREE, PLASTIC, MO-229WGED-3, DFN-14 | 14 | DE | compliant | 8542.39.00.01 | ||
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LTC2637HDE-HMI8#PBF
Linear Technology
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$4.4778 | Yes | Transferred | 5 V | 4.096 V | 0.1953 % | 8 | YES | D/A CONVERTER | BINARY | SERIAL | 8 | 3.9 µs | 1.5 mA | CMOS | AUTOMOTIVE | R-PDSO-N14 | Not Qualified | e3 | 1 | 125 °C | -40 °C | 260 | 30 | 14 | PLASTIC/EPOXY | HVSON | SOLCC14,.12,20 | RECTANGULAR | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | MATTE TIN | NO LEAD | 500 µm | DUAL | 3 mm | 800 µm | 4 mm | LINEAR TECHNOLOGY CORP | DFN | 4 X 3 MM, LEAD FREE, PLASTIC, MO-229WGED-3, DFN-14 | 14 | DE | compliant | 8542.39.00.01 | ||
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LTC2637HDE-LMX8#PBF
Linear Technology
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$4.4778 | Yes | Transferred | 3 V | 2.5 V | 0.1953 % | 8 | YES | D/A CONVERTER | BINARY | SERIAL | 8 | 3.5 µs | 1.5 mA | CMOS | AUTOMOTIVE | R-PDSO-N14 | Not Qualified | e3 | 1 | 125 °C | -40 °C | 260 | 30 | 14 | PLASTIC/EPOXY | HVSON | SOLCC14,.12,20 | RECTANGULAR | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | MATTE TIN | NO LEAD | 500 µm | DUAL | 3 mm | 800 µm | 4 mm | LINEAR TECHNOLOGY CORP | DFN | 4 X 3 MM, LEAD FREE, PLASTIC, MO-229WGED-3, DFN-14 | 14 | DE | compliant | 8542.39.00.01 | ||
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LTC2637HDE-LZ8#PBF
Linear Technology
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$4.4778 | Yes | Transferred | 3 V | 2.5 V | 0.1953 % | 8 | YES | D/A CONVERTER | BINARY | SERIAL | 8 | 3.5 µs | 1.5 mA | CMOS | AUTOMOTIVE | R-PDSO-N14 | Not Qualified | e3 | 1 | 125 °C | -40 °C | 260 | 30 | 14 | PLASTIC/EPOXY | HVSON | SOLCC14,.12,20 | RECTANGULAR | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | MATTE TIN | NO LEAD | 500 µm | DUAL | 3 mm | 800 µm | 4 mm | LINEAR TECHNOLOGY CORP | DFN | 4 X 3 MM, LEAD FREE, PLASTIC, MO-229WGED-3, DFN-14 | 14 | DE | compliant | 8542.39.00.01 | ||
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LTC2637HMS-HMI8#PBF
Linear Technology
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$4.4778 | Yes | Transferred | 5 V | 4.096 V | 0.1953 % | 8 | YES | D/A CONVERTER | BINARY | SERIAL | 8 | 3.9 µs | 1.5 mA | CMOS | AUTOMOTIVE | R-PDSO-G16 | Not Qualified | e3 | 1 | 125 °C | -40 °C | 260 | 30 | 16 | PLASTIC/EPOXY | TSSOP | TSSOP16,.19,20 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | MATTE TIN | GULL WING | 500 µm | DUAL | 3 mm | 1.1 mm | 4.039 mm | LINEAR TECHNOLOGY CORP | MSOP | 4 X 5 MM, LEAD FREE, PLASTIC, MSOP-16 | 16 | MS | compliant | 8542.39.00.01 | ||
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LTC2637HMS-HMX8#PBF
Linear Technology
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$4.4778 | Yes | Transferred | 5 V | 4.096 V | 0.1953 % | 8 | YES | D/A CONVERTER | BINARY | SERIAL | 8 | 3.9 µs | 1.5 mA | CMOS | AUTOMOTIVE | R-PDSO-G16 | Not Qualified | e3 | 1 | 125 °C | -40 °C | 260 | 30 | 16 | PLASTIC/EPOXY | TSSOP | TSSOP16,.19,20 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | MATTE TIN | GULL WING | 500 µm | DUAL | 3 mm | 1.1 mm | 4.039 mm | LINEAR TECHNOLOGY CORP | MSOP | 4 X 5 MM, LEAD FREE, PLASTIC, MSOP-16 | 16 | MS | compliant | 8542.39.00.01 | ||
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LTC2637HMS-HZ8#PBF
Linear Technology
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$4.4778 | Yes | Transferred | 5 V | 4.096 V | 0.1953 % | 8 | YES | D/A CONVERTER | BINARY | SERIAL | 8 | 3.9 µs | 1.5 mA | CMOS | AUTOMOTIVE | R-PDSO-G16 | Not Qualified | e3 | 1 | 125 °C | -40 °C | 260 | 30 | 16 | PLASTIC/EPOXY | TSSOP | TSSOP16,.19,20 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | MATTE TIN | GULL WING | 500 µm | DUAL | 3 mm | 1.1 mm | 4.039 mm | LINEAR TECHNOLOGY CORP | MSOP | 4 X 5 MM, LEAD FREE, PLASTIC, MSOP-16 | 16 | MS | compliant | 8542.39.00.01 | ||
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LTC2637HMS-LZ8#PBF
Linear Technology
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$4.4778 | Yes | Transferred | 3 V | 2.5 V | 0.1953 % | 8 | YES | D/A CONVERTER | BINARY | SERIAL | 8 | 3.5 µs | 1.5 mA | CMOS | AUTOMOTIVE | R-PDSO-G16 | Not Qualified | e3 | 1 | 125 °C | -40 °C | 260 | 30 | 16 | PLASTIC/EPOXY | TSSOP | TSSOP16,.19,20 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | MATTE TIN | GULL WING | 500 µm | DUAL | 3 mm | 1.1 mm | 4.039 mm | LINEAR TECHNOLOGY CORP | MSOP | 4 X 5 MM, LEAD FREE, PLASTIC, MSOP-16 | 16 | MS | compliant | 8542.39.00.01 |