Parametric results for: m24c3 under EEPROMs

All Filters Additional Feature Clock Frequency-Max (fCLK) Command User Interface Data Polling Data Retention Time-Min Endurance I2C Control Byte JESD-30 Code JESD-609 Code Length Manufacturer Memory Density Memory IC Type Memory Width Moisture Sensitivity Level Number of Functions Number of Terminals Number of Words Number of Words Code Operating Mode Operating Temperature-Max Operating Temperature-Min Organization Output Characteristics Package Body Material Package Code Package Equivalence Code Package Shape Package Style Page Size Power Supplies Supply Voltage-Nom (Vsup)

32 BYTE PAGE WRITE; DATA RETENTION = 40 YEARS 56 DATA RETENTION > 40 YEARS 48 DATA RETENTION TIME @ 55 DEGREE CENTIGRADE 391 SEATED HGT-NOM 1

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Clock Frequency-Max (fCLK) (4)

100 kHz 138 400 kHz 1,295 750 kHz 4 1 MHz 782

Min (MHz) - Max (MHz)

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NO 48

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YES 48

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40 629 50 6 100 21 200 393

Min - Max

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900000.0 Write/Erase Cycles 6 1000000.0 Write/Erase Cycles 630 1200000.0 Write/Erase Cycles 391 4000000.0 Write/Erase Cycles 2

Min (Write/EraseCycles) - Max (Write/EraseCycles)

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1010DDDR 1,029

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R-PBGA-B4 244 R-PBGA-B6 1 R-PBGA-B8 48 R-PDIP-T8 347 R-PDSO-G14 20 R-PDSO-G8 1,036 R-PDSO-N5 28 R-PDSO-N8 146 R-XBCC-B5 14 R-XDSO-N8 308 R-XQCC-N5 88 S-PBGA-B4 4 S-PDSO-G8 8 X-XUUC-N 1

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e0 465 e3 309 e4 354

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795 µm 244 833 µm 4 1.7 mm 130 1.805 mm 48 3 mm 433 4.4 mm 437 4.9 mm 542 4.925 mm 6 5 mm 16 5.3 mm 28 9.27 mm 240 9.55 mm 8 9.817 mm 94

Min (mm) - Max (mm)

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Manufacturer (6)

Adesto Technologies Corporation 16 Dialog Semiconductor GmbH 15 Fairchild Semiconductor Corporation 205 Rochester Electronics LLC 20 Shanghai Fudan Microelectronics Group Co Limited 29 STMicroelectronics 2,144

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Memory Density (1)

32.768 kbit 2,294

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EEPROM 2,396 EEPROM CARD 4

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Memory Width (2)

1 16 8 2,278

Min - Max

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1 525 NOT APPLICABLE 39 NOT SPECIFIED 3

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1.0 2,233

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14 20 4 248 5 130 6 1 8 1,893

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4.096 k 2,278 32.768 k 16

Min (words) - Max (words)

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4000.0 2,278 32000.0 16

Min - Max

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SYNCHRONOUS 2,233

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70.0 °C 121 85.0 °C 1,679 105.0 °C 12 125.0 °C 482

Min (°C) - Max (°C)

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-40.0 °C 1,424 -20.0 °C 749 0.0 °C 121

Min (°C) - Max (°C)

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Organization (2)

32KX1 16 4KX8 2,278

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OPEN-DRAIN 115

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PLASTIC/EPOXY 1,882 UNSPECIFIED 236

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BCC 14 DIE 1 DIP 347 HVSON 230 HVSSOP 1 SON 30 SOP 586 TSSOP 477 VFBGA 297 VSON 310

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DIP8,.3 157 SOLCC5,.06,16 88 SOLCC8,.11,20 228 SOP8,.25 284 SOP8,.3 27 TSSOP14,.25 12 TSSOP8,.16 10 TSSOP8,.19 8 TSSOP8,.25 215

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RECTANGULAR 2,281 SQUARE 12 UNSPECIFIED 1

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CHIP CARRIER 14 GRID ARRAY, VERY THIN PROFILE, FINE PITCH 297 IN-LINE 347 SMALL OUTLINE 616 SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE 318 SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE, SHRINK PITCH 1 SMALL OUTLINE, THIN PROFILE, SHRINK PITCH 477 SMALL OUTLINE, VERY THIN PROFILE 222 UNCASED CHIP 1

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32 words 48

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Power Supplies (3)

1.8/5 V 10 2/5 V 14 3/5 V 29

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Supply Voltage-Nom (Vsup) (6)

1.8 V 319 2.5 V 400 2.7 V 297 3 V 65 3.3 V 68 5 V 311

Min (V) - Max (V)

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