Parametric results for: max11046- under Analog to Digital Converters
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MAX11046BETN+
Maxim Integrated Products
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$12.9452 | Yes | Yes | Obsolete | 5 V | 5.0166 V | 8 | 0.0046 % | 16 | 250 kHz | 3 µs | YES | ADC, SUCCESSIVE APPROXIMATION | -5.0166 V | 1 | OFFSET BINARY, 2'S COMPLEMENT BINARY | TRACK | BICMOS | INDUSTRIAL | PARALLEL, WORD | S-XQCC-N56 | Not Qualified | e3 | 3 | 85 °C | -40 °C | 260 | 30 | 56 | UNSPECIFIED | HVQCCN | LCC56,.31SQ,20 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | MATTE TIN | NO LEAD | 500 µm | QUAD | 8 mm | 800 µm | 8 mm | MAXIM INTEGRATED PRODUCTS INC | HVQCCN, LCC56,.31SQ,20 | compliant | EAR99 | 8542.39.00.01 | |||||||
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MAX11046BECB+
Maxim Integrated Products
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$12.9691 | Yes | Yes | Obsolete | 5 V | 5.0166 V | 8 | 0.0046 % | 16 | 250 kHz | 3 µs | YES | ADC, SUCCESSIVE APPROXIMATION | -5.0166 V | 1 | OFFSET BINARY, 2'S COMPLEMENT BINARY | TRACK | BICMOS | INDUSTRIAL | PARALLEL, WORD | S-PQFP-G64 | Not Qualified | e3 | 3 | 85 °C | -40 °C | 260 | 30 | 64 | PLASTIC/EPOXY | HTFQFP | TQFP64,.47SQ | SQUARE | FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH | MATTE TIN | GULL WING | 500 µm | QUAD | 10 mm | 1.2 mm | 10 mm | MAXIM INTEGRATED PRODUCTS INC | 10 X 10 MM, ROHS COMPLIANT, TQFP-64 | compliant | EAR99 | 8542.39.00.01 | |||||||
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MAX11046ECB+
Maxim Integrated Products
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$17.2095 | Yes | Yes | Transferred | 5 V | 5 V | 8 | 0.0031 % | 16 | 250 kHz | 3 µs | YES | ADC, SUCCESSIVE APPROXIMATION | -5 V | 1 | OFFSET BINARY, 2'S COMPLEMENT BINARY | TRACK | BICMOS | INDUSTRIAL | PARALLEL, WORD | S-PQFP-G64 | Not Qualified | e3 | 3 | 85 °C | -40 °C | 260 | 30 | 64 | PLASTIC/EPOXY | HTFQFP | QFP64,.47SQ,20 | SQUARE | FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH | MATTE TIN | GULL WING | 500 µm | QUAD | 10 mm | 1.2 mm | 10 mm | MAXIM INTEGRATED PRODUCTS INC | HTFQFP, QFP64,.47SQ,20 | compliant | EAR99 | 8542.39.00.01 | QFP | 64 | |||||
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MAX11046ECB+T
Maxim Integrated Products
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$18.0710 | Yes | Yes | Transferred | 5 V | 5.0166 V | 8 | 0.0031 % | 16 | 250 kHz | 3 µs | YES | A/D CONVERTER | -5.0166 V | 1 | OFFSET BINARY, 2'S COMPLEMENT BINARY | TRACK | BICMOS | INDUSTRIAL | PARALLEL, WORD | S-XQFP-G64 | Not Qualified | e3 | 3 | 85 °C | -40 °C | 260 | 30 | 64 | UNSPECIFIED | HTFQFP | QFP64,.47SQ,20 | SQUARE | FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH | MATTE TIN | GULL WING | 500 µm | QUAD | 10 mm | 1.2 mm | 10 mm | MAXIM INTEGRATED PRODUCTS INC | HTFQFP, QFP64,.47SQ,20 | compliant | EAR99 | 8542.39.00.01 | QFP | 64 | |||||
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MAX11046ETN+
Maxim Integrated Products
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$22.8722 | Yes | Yes | Transferred | 5 V | 5 V | 8 | 0.0031 % | 16 | 250 kHz | 3 µs | YES | ADC, SUCCESSIVE APPROXIMATION | -5 V | 1 | OFFSET BINARY, 2'S COMPLEMENT BINARY | TRACK | BICMOS | INDUSTRIAL | PARALLEL, WORD | S-XQCC-N56 | Not Qualified | e3 | 3 | 85 °C | -40 °C | 260 | 30 | 56 | UNSPECIFIED | HVQCCN | LCC56,.31SQ,20 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | MATTE TIN | NO LEAD | 500 µm | QUAD | 8 mm | 800 µm | 8 mm | MAXIM INTEGRATED PRODUCTS INC | 8 X 8 MM, ROHS COMPLIANT, TQFN-56 | compliant | EAR99 | 8542.39.00.01 | QFN | 56 | |||||
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MAX11046ECB+
Analog Devices Inc
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Check for Price | Yes | Active | 5 V | 5 V | 8 | 0.0031 % | 16 | 250 kHz | 3 µs | YES | ADC, SUCCESSIVE APPROXIMATION | -5 V | 1 | OFFSET BINARY, 2'S COMPLEMENT BINARY | TRACK | BICMOS | INDUSTRIAL | PARALLEL, WORD | S-PQFP-G64 | Not Qualified | e3 | 3 | 85 °C | -40 °C | 260 | 30 | 64 | PLASTIC/EPOXY | HTFQFP | QFP64,.47SQ,20 | SQUARE | FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH | Matte Tin (Sn) - annealed | GULL WING | 500 µm | QUAD | 10 mm | 1.2 mm | 10 mm | 64-TQFP_EP-10X10X1.0 | 64 | 64-TQFP_EP-10X10X1.0 | 2009-11-24 | Analog Devices | ||||||||
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MAX11046BETN+T
Maxim Integrated Products
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Check for Price | Yes | Yes | Obsolete | 5.0166 V | 8 | 0.0046 % | 16 | 250 kHz | 3 µs | YES | ADC, SUCCESSIVE APPROXIMATION | -5.0166 V | 1 | OFFSET BINARY, 2'S COMPLEMENT BINARY | TRACK | BICMOS | INDUSTRIAL | PARALLEL, WORD | S-XQCC-N56 | e3 | 3 | 85 °C | -40 °C | 260 | 30 | 56 | UNSPECIFIED | HVQCCN | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | MATTE TIN | NO LEAD | 500 µm | QUAD | 8 mm | 800 µm | 8 mm | MAXIM INTEGRATED PRODUCTS INC | HVQCCN, | compliant | 8542.39.00.01 | |||||||||||
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MAX11046ECB+T
Analog Devices Inc
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Check for Price | Yes | Active | 5 V | 5.0166 V | 8 | 0.0031 % | 16 | 250 kHz | 3 µs | YES | A/D CONVERTER | -5.0166 V | 1 | OFFSET BINARY, 2'S COMPLEMENT BINARY | TRACK | BICMOS | INDUSTRIAL | PARALLEL, WORD | S-XQFP-G64 | Not Qualified | e3 | 3 | 85 °C | -40 °C | 260 | 30 | 64 | UNSPECIFIED | HTFQFP | QFP64,.47SQ,20 | SQUARE | FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH | Matte Tin (Sn) | GULL WING | 500 µm | QUAD | 10 mm | 1.2 mm | 10 mm | 64-TQFP_EP-10X10X1.0 | 64 | 64-TQFP_EP-10X10X1.0 | 2009-11-24 | Analog Devices | ||||||||
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MAX11046ETN+T
Analog Devices Inc
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Check for Price | Yes | Active | 5 V | 5.0166 V | 8 | 0.0031 % | 16 | 250 kHz | 3 µs | YES | A/D CONVERTER | -5.0166 V | 1 | OFFSET BINARY, 2'S COMPLEMENT BINARY | TRACK | BICMOS | INDUSTRIAL | PARALLEL, WORD | S-XQCC-N56 | Not Qualified | e3 | 3 | 85 °C | -40 °C | 260 | 30 | 56 | UNSPECIFIED | HVQCCN | LCC56,.31SQ,20 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | Matte Tin (Sn) | NO LEAD | 500 µm | QUAD | 8 mm | 800 µm | 8 mm | 56-LFCSP-8X8X0.75 | 56 | 56-LFCSP-8X8X0.75 | 2009-11-24 | Analog Devices | ||||||||
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MAX11046ETN+
Analog Devices Inc
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Check for Price | Yes | Active | 5 V | 5 V | 8 | 0.0031 % | 16 | 250 kHz | 3 µs | YES | ADC, SUCCESSIVE APPROXIMATION | -5 V | 1 | OFFSET BINARY, 2'S COMPLEMENT BINARY | TRACK | BICMOS | INDUSTRIAL | PARALLEL, WORD | S-XQCC-N56 | Not Qualified | e3 | 3 | 85 °C | -40 °C | 260 | 30 | 56 | UNSPECIFIED | HVQCCN | LCC56,.31SQ,20 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | Matte Tin (Sn) | NO LEAD | 500 µm | QUAD | 8 mm | 800 µm | 8 mm | ANALOG DEVICES INC | 8 X 8 MM, ROHS COMPLIANT, TQFN-56 | compliant | 56-LFCSP-8X8X0.75 | 56 | 56-LFCSP-8X8X0.75 | 2009-11-24 | Analog Devices |