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MAX5530ETC+
Maxim Integrated Products
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$4.4034 | Yes | Yes | Transferred | 3 V | 0.1953 % | 12 | YES | D/A CONVERTER | BINARY | SERIAL | 1 | 660 µs | BICMOS | INDUSTRIAL | S-XQCC-N12 | Not Qualified | e3 | 1 | 85 °C | -40 °C | 260 | 30 | 12 | UNSPECIFIED | HVQCCN | LCC12,.16SQ,32 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | MATTE TIN | NO LEAD | 800 µm | QUAD | 4 mm | 800 µm | 4 mm | MAXIM INTEGRATED PRODUCTS INC | QFN | 4 X 4 MM, 0.80 MM HEIGHT, MO-220, QFN-12 | 12 | compliant | EAR99 | 8542.39.00.01 | ||||||
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MAX5530ETC+
Analog Devices Inc
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Check for Price | Yes | Active | 3 V | 0.1953 % | 12 | YES | D/A CONVERTER | BINARY | SERIAL | 1 | 660 µs | BICMOS | INDUSTRIAL | S-XQCC-N12 | Not Qualified | e3 | 1 | 85 °C | -40 °C | 260 | 30 | 12 | UNSPECIFIED | HVQCCN | LCC12,.16SQ,32 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | Matte Tin (Sn) | NO LEAD | 800 µm | QUAD | 4 mm | 800 µm | 4 mm | ANALOG DEVICES INC | 12-LFCSP-4X4X0.75 | 4 X 4 MM, 0.80 MM HEIGHT, MO-220, QFN-12 | 12 | compliant | 12-LFCSP-4X4X0.75 | 2004-02-09 | Analog Devices | ||||||
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MAX5530ETC+T
Maxim Integrated Products
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Check for Price | Yes | Yes | Transferred | 3 V | 0.1953 % | 12 | YES | D/A CONVERTER | BINARY | SERIAL | 1 | 660 µs | BICMOS | INDUSTRIAL | S-XQCC-N12 | Not Qualified | e3 | 1 | 85 °C | -40 °C | 260 | 30 | 12 | UNSPECIFIED | HVQCCN | LCC12,.16SQ,32 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | MATTE TIN | NO LEAD | 800 µm | QUAD | 4 mm | 800 µm | 4 mm | MAXIM INTEGRATED PRODUCTS INC | QFN | 4 X 4 MM, 0.80 MM HEIGHT, MO-220, QFN-12 | 12 | compliant | EAR99 | 8542.39.00.01 | ||||||
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MAX5530ETC-T
Maxim Integrated Products
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Check for Price | No | No | Obsolete | 3 V | 0.1953 % | 12 | YES | D/A CONVERTER | BINARY | SERIAL | 1 | 660 µs | BICMOS | INDUSTRIAL | S-XQCC-N12 | Not Qualified | e0 | 1 | 85 °C | -40 °C | 12 | UNSPECIFIED | HVQCCN | LCC12,.16SQ,32 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | TIN LEAD | NO LEAD | 800 µm | QUAD | 4 mm | 800 µm | 4 mm | MAXIM INTEGRATED PRODUCTS INC | QFN | HVQCCN, | 12 | compliant | 8542.39.00.01 | |||||||||
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MAX5530ETC+T
Analog Devices Inc
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Check for Price | Yes | Active | 3 V | 0.1953 % | 12 | YES | D/A CONVERTER | BINARY | SERIAL | 1 | 660 µs | BICMOS | INDUSTRIAL | S-XQCC-N12 | Not Qualified | e3 | 1 | 85 °C | -40 °C | 260 | 30 | 12 | UNSPECIFIED | HVQCCN | LCC12,.16SQ,32 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | Matte Tin (Sn) | NO LEAD | 800 µm | QUAD | 4 mm | 800 µm | 4 mm | ANALOG DEVICES INC | 12-LFCSP-4X4X0.75 | 4 X 4 MM, 0.80 MM HEIGHT, MO-220, QFN-12 | 12 | compliant | 12-LFCSP-4X4X0.75 | 2004-02-09 | Analog Devices | ||||||
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MAX5530ETC
Maxim Integrated Products
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Check for Price | No | No | Obsolete | 3 V | 0.1953 % | 12 | YES | D/A CONVERTER | BINARY | SERIAL | 1 | 660 µs | 5 µA | BICMOS | INDUSTRIAL | S-XQCC-N12 | Not Qualified | e0 | 1 | 85 °C | -40 °C | 245 | 12 | UNSPECIFIED | HVQCCN | LCC12,.16SQ,32 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | TIN LEAD | NO LEAD | 800 µm | QUAD | 4 mm | 800 µm | 4 mm | MAXIM INTEGRATED PRODUCTS INC | QFN | HVQCCN, LCC12,.16SQ,32 | 12 | not_compliant | EAR99 | 8542.39.00.01 | ||||||
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MAX5530ETC
Rochester Electronics LLC
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Check for Price | No | Active | 3 V | 0.1953 % | 12 | YES | D/A CONVERTER | BINARY | SERIAL | 1 | 660 µs | BICMOS | INDUSTRIAL | S-XQCC-N12 | COMMERCIAL | e0 | 1 | 85 °C | -40 °C | 245 | NOT SPECIFIED | 12 | UNSPECIFIED | HVQCCN | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | TIN LEAD | NO LEAD | 800 µm | QUAD | 4 mm | 800 µm | 4 mm | ROCHESTER ELECTRONICS LLC | QFN | 4 X 4 MM, 0.80 MM HEIGHT, MO-220, QFN-12 | 12 | unknown |