Parametric results for: max5550 under Digital to Analog Converters
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MAX5550ETE+
Maxim Integrated Products
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$6.6880 | Yes | Yes | Transferred | 3 V | 10 | YES | D/A CONVERTER | OFFSET BINARY | SERIAL | 1 | 30 µs | BICMOS | INDUSTRIAL | S-XQCC-N16 | Not Qualified | e3 | 1 | 85 °C | -40 °C | 260 | 30 | 16 | UNSPECIFIED | HVQCCN | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | MATTE TIN | NO LEAD | 500 µm | QUAD | 3 mm | 800 µm | 3 mm | MAXIM INTEGRATED PRODUCTS INC | QFN | 3 X 3 MM, 0.80 MM HEIGHT, EXPOSED PAD, MO-220WEED-2, QFN-16 | 16 | compliant | EAR99 | 8542.39.00.01 | |||||||
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MAX5550ETE
Maxim Integrated Products
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Check for Price | No | No | Obsolete | 3 V | 10 | YES | D/A CONVERTER | OFFSET BINARY | SERIAL | 1 | 30 µs | 6 mA | BICMOS | INDUSTRIAL | S-XQCC-N16 | Not Qualified | e0 | 1 | 85 °C | -40 °C | 245 | 16 | UNSPECIFIED | HVQCCN | LCC16,.12SQ,20 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | TIN LEAD | NO LEAD | 500 µm | QUAD | 3 mm | 800 µm | 3 mm | MAXIM INTEGRATED PRODUCTS INC | QFN | 3 X 3 MM, 0.80 MM HEIGHT, EXPOSED PAD, MO-220WEED-2, QFN-16 | 16 | not_compliant | EAR99 | 8542.39.00.01 | ||||||
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MAX5550ETE+T
Analog Devices Inc
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Check for Price | Yes | Active | 3 V | 10 | YES | D/A CONVERTER | OFFSET BINARY | SERIAL | 1 | 30 µs | BICMOS | INDUSTRIAL | S-XQCC-N16 | Not Qualified | e3 | 1 | 85 °C | -40 °C | 260 | 30 | 16 | UNSPECIFIED | HVQCCN | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | Matte Tin (Sn) | NO LEAD | 500 µm | QUAD | 3 mm | 800 µm | 3 mm | 16-LFCSP-3X3X0.75 | 16 | 16-LFCSP-3X3X0.75 | 2005-07-20 | Analog Devices | ||||||||||
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MAX5550ETE+
Analog Devices Inc
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Check for Price | Yes | Active | 3 V | 10 | YES | D/A CONVERTER | OFFSET BINARY | SERIAL | 1 | 30 µs | BICMOS | INDUSTRIAL | S-XQCC-N16 | Not Qualified | e3 | 1 | 85 °C | -40 °C | 260 | 30 | 16 | UNSPECIFIED | HVQCCN | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | Matte Tin (Sn) - annealed | NO LEAD | 500 µm | QUAD | 3 mm | 800 µm | 3 mm | ANALOG DEVICES INC | 16-LFCSP-3X3X0.75 | 3 X 3 MM, 0.80 MM HEIGHT, EXPOSED PAD, MO-220WEED-2, QFN-16 | 16 | compliant | 16-LFCSP-3X3X0.75 | 2005-07-20 | Analog Devices | |||||||
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MAX5550ETE-T
Maxim Integrated Products
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Check for Price | No | No | Obsolete | 3 V | 10 | YES | D/A CONVERTER | OFFSET BINARY | SERIAL | 1 | 30 µs | 6 mA | BICMOS | INDUSTRIAL | S-XQCC-N16 | Not Qualified | e0 | 1 | 85 °C | -40 °C | 245 | 16 | UNSPECIFIED | HVQCCN | LCC16,.12SQ,20 | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | TIN LEAD | NO LEAD | 500 µm | QUAD | 3 mm | 800 µm | 3 mm | MAXIM INTEGRATED PRODUCTS INC | QFN | 3 X 3 MM, 0.80 MM HEIGHT, EXPOSED PAD, MO-220WEED-2, QFN-16 | 16 | not_compliant | EAR99 | 8542.39.00.01 | ||||||
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MAX5550ETE+T
Maxim Integrated Products
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Check for Price | Yes | Yes | Transferred | 3 V | 10 | YES | D/A CONVERTER | OFFSET BINARY | SERIAL | 1 | 30 µs | BICMOS | INDUSTRIAL | S-XQCC-N16 | Not Qualified | e3 | 1 | 85 °C | -40 °C | 260 | 30 | 16 | UNSPECIFIED | HVQCCN | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | MATTE TIN | NO LEAD | 500 µm | QUAD | 3 mm | 800 µm | 3 mm | MAXIM INTEGRATED PRODUCTS INC | QFN | HVQCCN, | 16 | compliant | EAR99 | 8542.39.00.01 |