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MPC8314ECVRAGDA
Freescale Semiconductor
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$40.4436 | Yes | Yes | Transferred | 32 | 400 MHz | 66.67 MHz | YES | 1 V | MICROPROCESSOR | CMOS | YES | FLOATING POINT | YES | YES | 1.05 V | 950 mV | INDUSTRIAL | S-PBGA-B620 | Not Qualified | e2 | 3 | 105 °C | -40 °C | 260 | 40 | 620 | PLASTIC/EPOXY | HBGA | BGA620,28X28,40 | SQUARE | GRID ARRAY, HEAT SINK/SLUG | Tin/Silver (Sn/Ag) | BALL | 1 mm | BOTTOM | 2.46 mm | 29 mm | 29 mm | FREESCALE SEMICONDUCTOR INC | BGA | 29 X 29 MM, 2.23 MM HEIGHT, 1 MM PITCH, LEAD FREE, PLASTIC, TEBGA-620 | 620 | compliant | 5A002 | 8542.31.00.01 | NXP | ||
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MPC8314ECVRAGDA
NXP Semiconductors
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$42.3959 | Yes | Not Recommended | 32 | 400 MHz | 66.67 MHz | YES | 1 V | MICROPROCESSOR | CMOS | YES | FLOATING POINT | YES | YES | 1.05 V | 950 mV | INDUSTRIAL | S-PBGA-B620 | Not Qualified | e2 | 3 | 105 °C | -40 °C | 260 | 40 | 620 | PLASTIC/EPOXY | HBGA | BGA620,28X28,40 | SQUARE | GRID ARRAY, HEAT SINK/SLUG | Tin/Silver (Sn/Ag) | BALL | 1 mm | BOTTOM | 2.46 mm | 29 mm | 29 mm | NXP SEMICONDUCTORS | 29 X 29 MM, 2.23 MM HEIGHT, 1 MM PITCH, LEAD FREE, PLASTIC, TEBGA-620 | compliant | 5A002.A.1 | 8542.31.00.01 | NXP |