Findchips: Parametric Search Results for mt47h256m4

Parametric results for: mt47h256m4 under DRAMs

Select parts from the table below to compare.

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Select Parts		Part Number

		MT47H256M4HQ-37EAT:G Micron Technology Inc
		MT47H256M4BT-25EL:A Micron Technology Inc
		MT47H256M4HQ-37EL:E Micron Technology Inc
		MT47H256M4B7-3 Micron Technology Inc
		MT47H256M4HV-3EAT:E Micron Technology Inc
		MT47H256M4CF-3EAT:H Micron Technology Inc
		MT47H256M4B7-25EL:D Micron Technology Inc
		MT47H256M4HV-5ELIT:G Micron Technology Inc
		MT47H256M4HV-187EL:G Micron Technology Inc
		MT47H256M4HW-3L:G Micron Technology Inc

				Most Relevant								Technical																	Compliance			Operating Conditions		Physical											Dimensions			Other
Composite Price	Pbfree Code	Rohs Code	Part Life Cycle Code	Memory Density	Memory Width	Organization	Supply Voltage-Nom (Vsup)	Access Time-Max	Clock Frequency-Max (fCLK)	Refresh Cycles	Access Mode	Memory IC Type	Additional Feature	I/O Type	Interleaved Burst Length	Number of Functions	Number of Ports	Number of Words Code	Number of Words	Operating Mode	Output Characteristics	Self Refresh	Sequential Burst Length	Supply Current-Max	Supply Voltage-Max (Vsup)	Supply Voltage-Min (Vsup)	Technology	Temperature Grade	JESD-30 Code	Qualification Status	JESD-609 Code	Operating Temperature-Max	Operating Temperature-Min	Number of Terminals	Package Body Material	Package Code	Package Equivalence Code	Package Shape	Package Style	Surface Mount	Terminal Finish	Terminal Form	Terminal Pitch	Terminal Position	Seated Height-Max	Length	Width	Ihs Manufacturer	Part Package Code	Package Description	Pin Count	Reach Compliance Code	ECCN Code	HTS Code

Check for Price

Yes

Obsolete

1.0737 Gbit

256MX4

1.8 V

500 ps

267 MHz

8192

MULTI BANK PAGE BURST

DDR2 DRAM

AUTO/SELF REFRESH

COMMON

4,8

256000000

268.4355 M

SYNCHRONOUS

3-STATE

YES

4,8

270 µA

1.9 V

1.7 V

CMOS

INDUSTRIAL

R-PBGA-B60

Not Qualified

105 °C

-40 °C

PLASTIC/EPOXY

TFBGA

BGA60,9X11,32

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

TIN SILVER COPPER

BALL

800 µm

BOTTOM

1.2 mm

11.5 mm

8 mm

MICRON TECHNOLOGY INC

BGA

TFBGA, BGA60,9X11,32

compliant

EAR99

8542.32.00.32

Check for Price

Yes

Obsolete

1.0737 Gbit

256MX4

1.8 V

400 ps

400 MHz

8192

MULTI BANK PAGE BURST

DDR2 DRAM

AUTO/SELF REFRESH

COMMON

4,8

256000000

268.4355 M

SYNCHRONOUS

3-STATE

YES

4,8

335 µA

1.9 V

1.7 V

CMOS

OTHER

R-PBGA-B92

Not Qualified

85 °C

PLASTIC/EPOXY

TFBGA

BGA92,9X21,32

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

TIN SILVER COPPER

BALL

800 µm

BOTTOM

1.2 mm

19 mm

11 mm

MICRON TECHNOLOGY INC

BGA

TFBGA, BGA92,9X21,32

compliant

EAR99

8542.32.00.32

Check for Price

Yes

Obsolete

1.0737 Gbit

256MX4

1.8 V

500 ps

267 MHz

8192

MULTI BANK PAGE BURST

DDR2 DRAM

AUTO/SELF REFRESH

COMMON

4,8

256000000

268.4355 M

SYNCHRONOUS

3-STATE

YES

4,8

270 µA

1.9 V

1.7 V

CMOS

INDUSTRIAL

R-PBGA-B60

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

TFBGA

BGA60,9X11,32

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

TIN SILVER COPPER

BALL

800 µm

BOTTOM

1.2 mm

11.5 mm

8 mm

MICRON TECHNOLOGY INC

BGA

TFBGA, BGA60,9X11,32

compliant

EAR99

8542.32.00.32

Check for Price

Yes

Obsolete

1.0737 Gbit

256MX4

1.8 V

450 ps

333 MHz

8192

DDR2 DRAM

COMMON

4,8

256000000

268.4355 M

3-STATE

4,8

CMOS

R-PBGA-B68

Not Qualified

PLASTIC/EPOXY

FBGA

BGA68,9X19,32

RECTANGULAR

GRID ARRAY, FINE PITCH

YES

BALL

800 µm

BOTTOM

MICRON TECHNOLOGY INC

FBGA, BGA68,9X19,32

compliant

EAR99

8542.32.00.32

Check for Price

Obsolete

1.0737 Gbit

256MX4

1.8 V

450 ps

333 MHz

8192

MULTI BANK PAGE BURST

DDR2 DRAM

AUTO/SELF REFRESH

COMMON

4,8

256000000

268.4355 M

SYNCHRONOUS

3-STATE

YES

4,8

280 µA

1.9 V

1.7 V

CMOS

INDUSTRIAL

R-PBGA-B60

Not Qualified

105 °C

-40 °C

PLASTIC/EPOXY

TFBGA

BGA60,9X11,32

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

TIN LEAD SILVER

BALL

800 µm

BOTTOM

1.2 mm

11.5 mm

8 mm

MICRON TECHNOLOGY INC

BGA

8 X 11.50 MM, FBGA-60

not_compliant

EAR99

8542.32.00.32

Check for Price

Yes

Obsolete

1.0737 Gbit

256MX4

1.8 V

450 ps

333 MHz

8192

MULTI BANK PAGE BURST

DDR2 DRAM

AUTO/SELF REFRESH

COMMON

4,8

256000000

268.4355 M

SYNCHRONOUS

3-STATE

YES

4,8

185 µA

1.9 V

1.7 V

CMOS

INDUSTRIAL

R-PBGA-B60

Not Qualified

105 °C

-40 °C

PLASTIC/EPOXY

TFBGA

BGA60,9X11,32

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

TIN SILVER COPPER

BALL

800 µm

BOTTOM

1.2 mm

10 mm

8 mm

MICRON TECHNOLOGY INC

BGA

TFBGA, BGA60,9X11,32

compliant

EAR99

8542.32.00.32

Check for Price

Yes

Obsolete

1.0737 Gbit

256MX4

1.8 V

400 ps

400 MHz

8192

MULTI BANK PAGE BURST

DDR2 DRAM

AUTO/SELF REFRESH

COMMON

4,8

256000000

268.4355 M

SYNCHRONOUS

3-STATE

YES

4,8

1.9 V

1.7 V

CMOS

OTHER

R-PBGA-B68

Not Qualified

85 °C

PLASTIC/EPOXY

VFBGA

BGA68,9X19,32

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

YES

TIN SILVER COPPER

BALL

800 µm

BOTTOM

1 mm

16.5 mm

10 mm

MICRON TECHNOLOGY INC

BGA

VFBGA, BGA68,9X19,32

compliant

EAR99

8542.32.00.32

Check for Price

Obsolete

1.0737 Gbit

256MX4

1.8 V

600 ps

200 MHz

8192

MULTI BANK PAGE BURST

DDR2 DRAM

AUTO/SELF REFRESH

COMMON

4,8

256000000

268.4355 M

SYNCHRONOUS

3-STATE

YES

4,8

260 µA

1.9 V

1.7 V

CMOS

INDUSTRIAL

R-PBGA-B60

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

HBGA

BGA60,9X11,32

RECTANGULAR

GRID ARRAY

YES

BALL

800 µm

BOTTOM

1.2 mm

11.5 mm

8 mm

MICRON TECHNOLOGY INC

BGA

8 X 11.50 MM, FBGA-60

unknown

EAR99

8542.32.00.32

Check for Price

Obsolete

1.0737 Gbit

256MX4

1.8 V

3.5 ns

533 MHz

8192

MULTI BANK PAGE BURST

DDR2 DRAM

AUTO/SELF REFRESH

COMMON

4,8

256000000

268.4355 M

SYNCHRONOUS

3-STATE

YES

4,8

425 µA

1.9 V

1.7 V

CMOS

OTHER

R-PBGA-B60

Not Qualified

85 °C

PLASTIC/EPOXY

TFBGA

BGA60,9X11,32

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

TIN LEAD SILVER

BALL

800 µm

BOTTOM

1.2 mm

11.5 mm

8 mm

MICRON TECHNOLOGY INC

BGA

8 X 11.50 MM, FBGA-60

not_compliant

EAR99

8542.32.00.32

Check for Price

Obsolete

1.0737 Gbit

256MX4

1.8 V

400 ps

MULTI BANK PAGE BURST

DDR2 DRAM

AUTO/SELF REFRESH

256000000

268.4355 M

SYNCHRONOUS

YES

1.9 V

1.7 V

CMOS

INDUSTRIAL

R-PBGA-B84

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

TFBGA

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

TIN LEAD SILVER

BALL

800 µm

BOTTOM

1.2 mm

12.5 mm

8 mm

MICRON TECHNOLOGY INC

BGA

TFBGA,

compliant

EAR99

8542.32.00.32

1 2 3 4 5 Next

Compare

MT47H256M4HQ-37EAT:G

Micron Technology Inc

Check for Price

Yes

Obsolete

1.0737 Gbit

256MX4

1.8 V

500 ps

267 MHz

8192

MULTI BANK PAGE BURST

DDR2 DRAM

AUTO/SELF REFRESH

COMMON

4,8

256000000

268.4355 M

SYNCHRONOUS

3-STATE

YES

4,8

270 µA

1.9 V

1.7 V

CMOS

INDUSTRIAL

R-PBGA-B60

Not Qualified

105 °C

-40 °C

PLASTIC/EPOXY

TFBGA

BGA60,9X11,32

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

TIN SILVER COPPER

BALL

800 µm

BOTTOM

1.2 mm

11.5 mm

8 mm

MICRON TECHNOLOGY INC

BGA

TFBGA, BGA60,9X11,32

compliant

EAR99

8542.32.00.32

MT47H256M4BT-25EL:A

Micron Technology Inc

Check for Price

Yes

Obsolete

1.0737 Gbit

256MX4

1.8 V

400 ps

400 MHz

8192

MULTI BANK PAGE BURST

DDR2 DRAM

AUTO/SELF REFRESH

COMMON

4,8

256000000

268.4355 M

SYNCHRONOUS

3-STATE

YES

4,8

335 µA

1.9 V

1.7 V

CMOS

OTHER

R-PBGA-B92

Not Qualified

85 °C

PLASTIC/EPOXY

TFBGA

BGA92,9X21,32

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

TIN SILVER COPPER

BALL

800 µm

BOTTOM

1.2 mm

19 mm

11 mm

MICRON TECHNOLOGY INC

BGA

TFBGA, BGA92,9X21,32

compliant

EAR99

8542.32.00.32

MT47H256M4HQ-37EL:E

Micron Technology Inc

Check for Price

Yes

Obsolete

1.0737 Gbit

256MX4

1.8 V

500 ps

267 MHz

8192

MULTI BANK PAGE BURST

DDR2 DRAM

AUTO/SELF REFRESH

COMMON

4,8

256000000

268.4355 M

SYNCHRONOUS

3-STATE

YES

4,8

270 µA

1.9 V

1.7 V

CMOS

INDUSTRIAL

R-PBGA-B60

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

TFBGA

BGA60,9X11,32

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

TIN SILVER COPPER

BALL

800 µm

BOTTOM

1.2 mm

11.5 mm

8 mm

MICRON TECHNOLOGY INC

BGA

TFBGA, BGA60,9X11,32

compliant

EAR99

8542.32.00.32

MT47H256M4B7-3

Micron Technology Inc

Check for Price

Yes

Obsolete

1.0737 Gbit

256MX4

1.8 V

450 ps

333 MHz

8192

DDR2 DRAM

COMMON

4,8

256000000

268.4355 M

3-STATE

4,8

CMOS

R-PBGA-B68

Not Qualified

PLASTIC/EPOXY

FBGA

BGA68,9X19,32

RECTANGULAR

GRID ARRAY, FINE PITCH

YES

BALL

800 µm

BOTTOM

MICRON TECHNOLOGY INC

FBGA, BGA68,9X19,32

compliant

EAR99

8542.32.00.32

MT47H256M4HV-3EAT:E

Micron Technology Inc

Check for Price

Obsolete

1.0737 Gbit

256MX4

1.8 V

450 ps

333 MHz

8192

MULTI BANK PAGE BURST

DDR2 DRAM

AUTO/SELF REFRESH

COMMON

4,8

256000000

268.4355 M

SYNCHRONOUS

3-STATE

YES

4,8

280 µA

1.9 V

1.7 V

CMOS

INDUSTRIAL

R-PBGA-B60

Not Qualified

105 °C

-40 °C

PLASTIC/EPOXY

TFBGA

BGA60,9X11,32

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

TIN LEAD SILVER

BALL

800 µm

BOTTOM

1.2 mm

11.5 mm

8 mm

MICRON TECHNOLOGY INC

BGA

8 X 11.50 MM, FBGA-60

not_compliant

EAR99

8542.32.00.32

MT47H256M4CF-3EAT:H

Micron Technology Inc

Check for Price

Yes

Obsolete

1.0737 Gbit

256MX4

1.8 V

450 ps

333 MHz

8192

MULTI BANK PAGE BURST

DDR2 DRAM

AUTO/SELF REFRESH

COMMON

4,8

256000000

268.4355 M

SYNCHRONOUS

3-STATE

YES

4,8

185 µA

1.9 V

1.7 V

CMOS

INDUSTRIAL

R-PBGA-B60

Not Qualified

105 °C

-40 °C

PLASTIC/EPOXY

TFBGA

BGA60,9X11,32

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

TIN SILVER COPPER

BALL

800 µm

BOTTOM

1.2 mm

10 mm

8 mm

MICRON TECHNOLOGY INC

BGA

TFBGA, BGA60,9X11,32

compliant

EAR99

8542.32.00.32

MT47H256M4B7-25EL:D

Micron Technology Inc

Check for Price

Yes

Obsolete

1.0737 Gbit

256MX4

1.8 V

400 ps

400 MHz

8192

MULTI BANK PAGE BURST

DDR2 DRAM

AUTO/SELF REFRESH

COMMON

4,8

256000000

268.4355 M

SYNCHRONOUS

3-STATE

YES

4,8

1.9 V

1.7 V

CMOS

OTHER

R-PBGA-B68

Not Qualified

85 °C

PLASTIC/EPOXY

VFBGA

BGA68,9X19,32

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

YES

TIN SILVER COPPER

BALL

800 µm

BOTTOM

1 mm

16.5 mm

10 mm

MICRON TECHNOLOGY INC

BGA

VFBGA, BGA68,9X19,32

compliant

EAR99

8542.32.00.32

MT47H256M4HV-5ELIT:G

Micron Technology Inc

Check for Price

Obsolete

1.0737 Gbit

256MX4

1.8 V

600 ps

200 MHz

8192

MULTI BANK PAGE BURST

DDR2 DRAM

AUTO/SELF REFRESH

COMMON

4,8

256000000

268.4355 M

SYNCHRONOUS

3-STATE

YES

4,8

260 µA

1.9 V

1.7 V

CMOS

INDUSTRIAL

R-PBGA-B60

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

HBGA

BGA60,9X11,32

RECTANGULAR

GRID ARRAY

YES

BALL

800 µm

BOTTOM

1.2 mm

11.5 mm

8 mm

MICRON TECHNOLOGY INC

BGA

8 X 11.50 MM, FBGA-60

unknown

EAR99

8542.32.00.32

MT47H256M4HV-187EL:G

Micron Technology Inc

Check for Price

Obsolete

1.0737 Gbit

256MX4

1.8 V

3.5 ns

533 MHz

8192

MULTI BANK PAGE BURST

DDR2 DRAM

AUTO/SELF REFRESH

COMMON

4,8

256000000

268.4355 M

SYNCHRONOUS

3-STATE

YES

4,8

425 µA

1.9 V

1.7 V

CMOS

OTHER

R-PBGA-B60

Not Qualified

85 °C

PLASTIC/EPOXY

TFBGA

BGA60,9X11,32

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

TIN LEAD SILVER

BALL

800 µm

BOTTOM

1.2 mm

11.5 mm

8 mm

MICRON TECHNOLOGY INC

BGA

8 X 11.50 MM, FBGA-60

not_compliant

EAR99

8542.32.00.32

MT47H256M4HW-3L:G

Micron Technology Inc

Check for Price

Obsolete

1.0737 Gbit

256MX4

1.8 V

400 ps

MULTI BANK PAGE BURST

DDR2 DRAM

AUTO/SELF REFRESH

256000000

268.4355 M

SYNCHRONOUS

YES

1.9 V

1.7 V

CMOS

INDUSTRIAL

R-PBGA-B84

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

TFBGA

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

TIN LEAD SILVER

BALL

800 µm

BOTTOM

1.2 mm

12.5 mm

8 mm

MICRON TECHNOLOGY INC

BGA

TFBGA,

compliant

EAR99

8542.32.00.32

1 2 3 4 5 Next