Filter Your Search
1 - 10 of 10 results
![]() |
MT47H32M16CC-5EL:B
Micron Technology Inc
|
Check for Price | Yes | Obsolete | 536.8709 Mbit | 16 | 32MX16 | 1.8 V | 600 ps | 200 MHz | 8192 | FOUR BANK PAGE BURST | DDR2 DRAM | AUTO/SELF REFRESH | COMMON | 4,8 | 1 | 1 | 32000000 | 33.5544 M | SYNCHRONOUS | 3-STATE | YES | 4,8 | 7 mA | 340 µA | 1.9 V | 1.7 V | CMOS | OTHER | R-PBGA-B84 | Not Qualified | e1 | 85 °C | 84 | PLASTIC/EPOXY | TFBGA | BGA84,9X15,32 | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | YES | TIN SILVER COPPER | BALL | 800 µm | BOTTOM | 1.2 mm | 12.5 mm | 12 mm | MICRON TECHNOLOGY INC | BGA | TFBGA, BGA84,9X15,32 | 84 | unknown | EAR99 | 8542.32.00.28 | |||||||
![]() |
MT47H32M16CC-5EAT:B
Micron Technology Inc
|
Check for Price | Yes | Obsolete | 1.0737 Gbit | 16 | 64MX16 | 1.8 V | 600 ps | FOUR BANK PAGE BURST | DDR2 DRAM | AUTO/SELF REFRESH | 1 | 1 | 64000000 | 67.1089 M | SYNCHRONOUS | YES | 1.9 V | 1.7 V | CMOS | INDUSTRIAL | R-PBGA-B84 | Not Qualified | e1 | 105 °C | -40 °C | 84 | PLASTIC/EPOXY | TFBGA | RECTANGULAR | GRID ARRAY | YES | TIN SILVER COPPER | BALL | 800 µm | BOTTOM | 1.2 mm | 12.5 mm | 12 mm | MICRON TECHNOLOGY INC | BGA | TFBGA, | 84 | compliant | EAR99 | 8542.32.00.32 | |||||||||||||||
![]() |
MT47H32M16CC-5ELIT:B
Micron Technology Inc
|
Check for Price | Yes | Obsolete | 536.8709 Mbit | 16 | 32MX16 | 1.8 V | 600 ps | 200 MHz | 8192 | FOUR BANK PAGE BURST | DDR2 DRAM | AUTO/SELF REFRESH | COMMON | 4,8 | 1 | 1 | 32000000 | 33.5544 M | SYNCHRONOUS | 3-STATE | YES | 4,8 | 7 mA | 340 µA | 1.9 V | 1.7 V | CMOS | INDUSTRIAL | R-PBGA-B84 | Not Qualified | e1 | 85 °C | -40 °C | 84 | PLASTIC/EPOXY | TFBGA | BGA84,9X15,32 | RECTANGULAR | GRID ARRAY | YES | TIN SILVER COPPER | BALL | 800 µm | BOTTOM | 1.2 mm | 12.5 mm | 12 mm | MICRON TECHNOLOGY INC | BGA | TFBGA, BGA84,9X15,32 | 84 | compliant | EAR99 | 8542.32.00.28 | ||||||
![]() |
MT47H32M16CC-5E:B
Micron Technology Inc
|
Check for Price | Yes | Obsolete | 536.8709 Mbit | 16 | 32MX16 | 1.8 V | 600 ps | 200 MHz | 8192 | FOUR BANK PAGE BURST | DDR2 DRAM | AUTO/SELF REFRESH | COMMON | 4,8 | 1 | 1 | 32000000 | 33.5544 M | SYNCHRONOUS | 3-STATE | YES | 4,8 | 7 mA | 340 µA | 1.9 V | 1.7 V | CMOS | OTHER | R-PBGA-B84 | Not Qualified | e1 | 85 °C | 260 | 30 | 84 | PLASTIC/EPOXY | TFBGA | BGA84,9X15,32 | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | YES | Tin/Silver/Copper (Sn/Ag/Cu) | BALL | 800 µm | BOTTOM | 1.2 mm | 12.5 mm | 12 mm | MICRON TECHNOLOGY INC | BGA | TFBGA, BGA84,9X15,32 | 84 | unknown | EAR99 | 8542.32.00.28 | |||||
![]() |
MT47H32M16CC-5E
Micron Technology Inc
|
Check for Price | Yes | Yes | Obsolete | 536.8709 Mbit | 16 | 32MX16 | 1.8 V | 600 ps | 200 MHz | 8192 | FOUR BANK PAGE BURST | DDR2 DRAM | AUTO/SELF REFRESH | COMMON | 4,8 | 1 | 1 | 32000000 | 33.5544 M | SYNCHRONOUS | 3-STATE | YES | 4,8 | 7 mA | 1.9 V | 1.7 V | CMOS | OTHER | R-PBGA-B84 | Not Qualified | e1 | 85 °C | 260 | 84 | PLASTIC/EPOXY | TFBGA | BGA84,9X15,32 | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | YES | TIN SILVER COPPER | BALL | 800 µm | BOTTOM | 1.2 mm | 12.5 mm | 12 mm | MICRON TECHNOLOGY INC | BGA | TFBGA, BGA84,9X15,32 | 84 | compliant | EAR99 | 8542.32.00.28 | ||||||
|
MT47H32M16CC-5EIT
Micron Technology Inc
|
Check for Price | Yes | Yes | Obsolete | 536.8709 Mbit | 16 | 32MX16 | 1.8 V | 600 ns | 200 MHz | 8192 | DDR2 DRAM | COMMON | 4,8 | 32000000 | 33.5544 M | 3-STATE | 4,8 | 7 mA | CMOS | INDUSTRIAL | R-PBGA-B84 | Not Qualified | e3 | 1 | 85 °C | -40 °C | 84 | PLASTIC/EPOXY | FBGA | BGA84,9X15,32 | RECTANGULAR | GRID ARRAY, FINE PITCH | YES | MATTE TIN | BALL | 800 µm | BOTTOM | MICRON TECHNOLOGY INC | FBGA, BGA84,9X15,32 | compliant | EAR99 | 8542.32.00.28 | ||||||||||||||||||
|
MT47H32M16CC-5ELIT
Micron Technology Inc
|
Check for Price | Yes | Yes | Obsolete | 536.8709 Mbit | 16 | 32MX16 | 1.8 V | 600 ns | 200 MHz | 8192 | DDR2 DRAM | COMMON | 4,8 | 32000000 | 33.5544 M | 3-STATE | 4,8 | 7 mA | CMOS | INDUSTRIAL | R-PBGA-B84 | Not Qualified | e3 | 1 | 85 °C | -40 °C | 84 | PLASTIC/EPOXY | FBGA | BGA84,9X15,32 | RECTANGULAR | GRID ARRAY, FINE PITCH | YES | MATTE TIN | BALL | 800 µm | BOTTOM | MICRON TECHNOLOGY INC | FBGA, BGA84,9X15,32 | compliant | EAR99 | 8542.32.00.28 | ||||||||||||||||||
|
MT47H32M16CC-5EL
Micron Technology Inc
|
Check for Price | Yes | Yes | Obsolete | 536.8709 Mbit | 16 | 32MX16 | 1.8 V | 600 ns | 200 MHz | 8192 | DDR2 DRAM | COMMON | 4,8 | 32000000 | 33.5544 M | 3-STATE | 4,8 | 7 mA | CMOS | R-PBGA-B84 | Not Qualified | e3 | 1 | 84 | PLASTIC/EPOXY | FBGA | BGA84,9X15,32 | RECTANGULAR | GRID ARRAY, FINE PITCH | YES | MATTE TIN | BALL | 800 µm | BOTTOM | MICRON TECHNOLOGY INC | FBGA, BGA84,9X15,32 | compliant | EAR99 | 8542.32.00.28 | |||||||||||||||||||||
![]() |
MT47H32M16CC-5EIT:B
Micron Technology Inc
|
Check for Price | Yes | Obsolete | 536.8709 Mbit | 16 | 32MX16 | 1.8 V | 600 ps | 200 MHz | 8192 | FOUR BANK PAGE BURST | DDR2 DRAM | AUTO/SELF REFRESH | COMMON | 4,8 | 1 | 1 | 32000000 | 33.5544 M | SYNCHRONOUS | 3-STATE | YES | 4,8 | 7 mA | 340 µA | 1.9 V | 1.7 V | CMOS | INDUSTRIAL | R-PBGA-B84 | Not Qualified | e1 | 85 °C | -40 °C | 260 | 30 | 84 | PLASTIC/EPOXY | TFBGA | BGA84,9X15,32 | RECTANGULAR | GRID ARRAY | YES | Tin/Silver/Copper (Sn/Ag/Cu) | BALL | 800 µm | BOTTOM | 1.2 mm | 12.5 mm | 12 mm | MICRON TECHNOLOGY INC | BGA | TFBGA, BGA84,9X15,32 | 84 | unknown | EAR99 | 8542.32.00.28 | ||||
![]() |
MT47H32M16CC-5ELAT:B
Micron Technology Inc
|
Check for Price | Yes | Obsolete | 1.0737 Gbit | 16 | 64MX16 | 1.8 V | 600 ps | FOUR BANK PAGE BURST | DDR DRAM | AUTO/SELF REFRESH | 1 | 1 | 64000000 | 67.1089 M | SYNCHRONOUS | YES | 1.9 V | 1.7 V | CMOS | INDUSTRIAL | R-PBGA-B84 | Not Qualified | 105 °C | -40 °C | 84 | PLASTIC/EPOXY | TFBGA | RECTANGULAR | GRID ARRAY | YES | BALL | 800 µm | BOTTOM | 1.2 mm | 12.5 mm | 12 mm | MICRON TECHNOLOGY INC | BGA | TFBGA, | 84 | compliant | EAR99 | 8542.32.00.32 |