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MT47H64M16HR-3 IT:H
Micron Technology Inc
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$1.3162 | Yes | Yes | Obsolete | 1.0737 Gbit | 16 | 64MX16 | 1.8 V | 450 ps | 333 MHz | 8192 | MULTI BANK PAGE BURST | DDR2 DRAM | AUTO/SELF REFRESH | COMMON | 4,8 | 1 | 1 | 64000000 | 67.1089 M | SYNCHRONOUS | 3-STATE | YES | 4,8 | 7 mA | 230 µA | 1.9 V | 1.7 V | CMOS | INDUSTRIAL | R-PBGA-B84 | Not Qualified | e1 | 85 °C | -40 °C | 260 | 30 | 84 | PLASTIC/EPOXY | TFBGA | BGA84,9X15,32 | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | YES | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | BALL | 800 µm | BOTTOM | 1.2 mm | 12.5 mm | 8 mm | MICRON TECHNOLOGY INC | TFBGA, BGA84,9X15,32 | unknown | 3A991 | 8542.32.00.32 | Micron | ||||
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MT47H64M8SH-25E:H
Micron Technology Inc
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$3.8007 | Yes | Yes | Active | 536.8709 Mbit | 8 | 64MX8 | 1.8 V | 400 ps | 400 MHz | 8192 | FOUR BANK PAGE BURST | DDR2 DRAM | AUTO/SELF REFRESH | COMMON | 4,8 | 1 | 1 | 64000000 | 67.1089 M | SYNCHRONOUS | 3-STATE | YES | 4,8 | 10 mA | 150 µA | 1.9 V | 1.7 V | CMOS | OTHER | R-PBGA-B60 | Not Qualified | e1 | 85 °C | 260 | 30 | 60 | PLASTIC/EPOXY | TFBGA | BGA60,9X11,32 | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | YES | TIN SILVER COPPER | BALL | 800 µm | BOTTOM | 1.2 mm | 10 mm | 8 mm | MICRON TECHNOLOGY INC | TFBGA, BGA60,9X11,32 | compliant | EAR99 | 8542.32.00.28 | Micron | BGA | 60 | |||
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MT47H32M16NF-25E:H
Micron Technology Inc
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$3.9634 | Yes | Yes | Active | 536.8709 Mbit | 16 | 32MX16 | 1.8 V | 400 ps | 400 MHz | 8192 | FOUR BANK PAGE BURST | DDR2 DRAM | AUTO/SELF REFRESH | COMMON | 4,8 | 1 | 1 | 32000000 | 33.5544 M | SYNCHRONOUS | 3-STATE | YES | 4,8 | 10 mA | 215 µA | 1.9 V | 1.7 V | CMOS | OTHER | R-PBGA-B84 | Not Qualified | e1 | 85 °C | 260 | 30 | 84 | PLASTIC/EPOXY | TFBGA | BGA84,9X15,32 | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | YES | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | BALL | 800 µm | BOTTOM | 1.2 mm | 12.5 mm | 8 mm | MICRON TECHNOLOGY INC | FBGA-84 | not_compliant | EAR99 | 8542.32.00.28 | Micron | BGA | 84 | |||
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MT47H128M8SH-25E:M
Micron Technology Inc
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$4.5348 | Yes | Yes | Active | 1.0737 Gbit | 8 | 128MX8 | 1.8 V | 400 ps | 400 MHz | 8192 | MULTI BANK PAGE BURST | DDR2 DRAM | AUTO/SELF REFRESH | COMMON | 4,8 | 1 | 1 | 128000000 | 134.2177 M | SYNCHRONOUS | 3-STATE | YES | 4,8 | 1.9 V | 1.7 V | CMOS | OTHER | R-PBGA-B60 | Not Qualified | e1 | 85 °C | 260 | 30 | 60 | PLASTIC/EPOXY | TFBGA | BGA60,9X11,32 | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | YES | TIN SILVER COPPER | BALL | 800 µm | BOTTOM | 1.2 mm | 10 mm | 8 mm | MICRON TECHNOLOGY INC | TFBGA, BGA60,9X11,32 | compliant | EAR99 | 8542.32.00.32 | Micron | BGA | 60 | |||||
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MT47H64M16NF-25E:M
Micron Technology Inc
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$4.6572 | Yes | Yes | Active | 1.0737 Gbit | 16 | 64MX16 | 1.8 V | 400 ps | 400 MHz | 8192 | MULTI BANK PAGE BURST | DDR2 DRAM | SELF REFRESH | COMMON | 4,8 | 1 | 1 | 64000000 | 67.1089 M | SYNCHRONOUS | 3-STATE | YES | 4,8 | 1.9 V | 1.7 V | CMOS | OTHER | R-PBGA-B84 | Not Qualified | e1 | 85 °C | 260 | 30 | 84 | PLASTIC/EPOXY | TFBGA | BGA84,9X15,32 | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | YES | TIN SILVER COPPER | BALL | 800 µm | BOTTOM | 1.2 mm | 12.5 mm | 8 mm | MICRON TECHNOLOGY INC | 8 X 12.50 MM, ROHS COMPLIANT, FBGA-84 | compliant | EAR99 | 8542.32.00.32 | Micron | BGA | 84 | |||||
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MT47H256M8EB-25E:C
Micron Technology Inc
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$10.0799 | Yes | Yes | Active | 2.1475 Gbit | 8 | 256MX8 | 1.8 V | 400 ps | 400 MHz | 8192 | MULTI BANK PAGE BURST | DDR2 DRAM | AUTO/SELF REFRESH | COMMON | 4,8 | 1 | 1 | 256000000 | 268.4355 M | SYNCHRONOUS | 3-STATE | YES | 4,8 | 12 mA | 250 µA | 1.9 V | 1.7 V | CMOS | OTHER | R-PBGA-B60 | Not Qualified | e1 | 85 °C | 260 | 30 | 60 | PLASTIC/EPOXY | TFBGA | BGA60,9X11,32 | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | YES | TIN SILVER COPPER | BALL | 800 µm | BOTTOM | 1.2 mm | 11.5 mm | 9 mm | MICRON TECHNOLOGY INC | TFBGA, BGA60,9X11,32 | compliant | EAR99 | 8542.32.00.36 | Micron | BGA | 60 | |||
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MT47H128M16RT-25E:C
Micron Technology Inc
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$13.1100 | Yes | Yes | Active | 2.1475 Gbit | 16 | 128MX16 | 1.8 V | 400 ps | 400 MHz | 8192 | MULTI BANK PAGE BURST | DDR2 DRAM | AUTO/SELF REFRESH | COMMON | 4,8 | 1 | 1 | 128000000 | 134.2177 M | SYNCHRONOUS | 3-STATE | YES | 4,8 | 12 mA | 330 µA | 1.9 V | 1.7 V | CMOS | OTHER | R-PBGA-B84 | Not Qualified | e1 | 85 °C | 260 | 30 | 84 | PLASTIC/EPOXY | TFBGA | BGA84,9X15,32 | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | YES | TIN SILVER COPPER | BALL | 800 µm | BOTTOM | 1.2 mm | 12.5 mm | 9 mm | MICRON TECHNOLOGY INC | 9 X 12.50 MM, ROHS COMPLIANT, FBGA-84 | compliant | EAR99 | 8542.32.00.36 | Micron | BGA | 84 | |||
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MT47H256M8EB-25EIT:C
Micron Technology Inc
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$18.3700 | Yes | Yes | Obsolete | 2.1475 Gbit | 8 | 256MX8 | 1.8 V | 400 ps | 400 MHz | 8192 | MULTI BANK PAGE BURST | DDR2 DRAM | AUTO/SELF REFRESH | COMMON | 4,8 | 1 | 1 | 256000000 | 268.4355 M | SYNCHRONOUS | 3-STATE | YES | 4,8 | 12 mA | 250 µA | 1.9 V | 1.7 V | CMOS | INDUSTRIAL | R-PBGA-B60 | Not Qualified | e1 | 85 °C | -40 °C | 60 | PLASTIC/EPOXY | TFBGA | BGA60,9X11,32 | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | YES | TIN SILVER COPPER | BALL | 800 µm | BOTTOM | 1.2 mm | 11.5 mm | 9 mm | MICRON TECHNOLOGY INC | TFBGA, BGA60,9X11,32 | compliant | EAR99 | 8542.32.00.36 | BGA | 60 | |||||
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MT47H512M4EB-187EIT:C
Micron Technology Inc
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Check for Price | Yes | Active | 2.1475 Gbit | 4 | 512MX4 | 1.8 V | 350 ps | MULTI BANK PAGE BURST | DDR2 DRAM | AUTO/SELF REFRESH | 1 | 1 | 512000000 | 536.8709 M | SYNCHRONOUS | YES | 1.9 V | 1.7 V | CMOS | INDUSTRIAL | R-PBGA-B60 | e1 | 85 °C | -40 °C | 60 | PLASTIC/EPOXY | TFBGA | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | YES | TIN SILVER COPPER | BALL | 800 µm | BOTTOM | 1.2 mm | 11.5 mm | 9 mm | MICRON TECHNOLOGY INC | TFBGA, | compliant | EAR99 | 8542.32.00.36 | BGA | 60 | ||||||||||||||||
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MT47H128M8BT-3:E
Micron Technology Inc
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Check for Price | Yes | Yes | Obsolete | 1.0737 Gbit | 8 | 128MX8 | 1.8 V | 450 ps | 333 MHz | 8192 | DDR2 DRAM | COMMON | 4,8 | 128000000 | 134.2177 M | 3-STATE | 4,8 | CMOS | R-PBGA-B92 | Not Qualified | 260 | 92 | PLASTIC/EPOXY | FBGA | BGA92,9X21,32 | RECTANGULAR | GRID ARRAY, FINE PITCH | YES | BALL | 800 µm | BOTTOM | MICRON TECHNOLOGY INC | FBGA, BGA92,9X21,32 | compliant | EAR99 | 8542.32.00.32 |