Findchips: Parametric Search Results for mt55l256l18f

Parametric results for: mt55l256l18f under SRAMs

Select parts from the table below to compare.

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Select Parts		Part Number

		MT55L256L18F1B-12IT Micron Technology Inc
		MT55L256L18F1B-12 Cypress Semiconductor
		MT55L256L18FT-12TR Micron Technology Inc
		MT55L256L18F1T-12TR Micron Technology Inc
		MT55L256L18FT-10.5 Micron Technology Inc
		MT55L256L18F1B-10 Cypress Semiconductor
		MT55L256L18F1T-12IT Micron Technology Inc
		MT55L256L18FT-12 Micron Technology Inc
		MT55L256L18FT-11TR Micron Technology Inc
		MT55L256L18F1B-12IT Cypress Semiconductor

			Most Relevant						Technical																	Compliance			Operating Conditions		Physical											Dimensions			Other
Composite Price	Rohs Code	Part Life Cycle Code	Memory Density	Memory Width	Organization	Supply Voltage-Nom (Vsup)	Access Time-Max	Clock Frequency-Max (fCLK)	Memory IC Type	I/O Type	Number of Functions	Number of Ports	Number of Words Code	Number of Words	Operating Mode	Output Characteristics	Output Enable	Parallel/Serial	Standby Current-Max	Standby Voltage-Min	Supply Current-Max	Supply Voltage-Max (Vsup)	Supply Voltage-Min (Vsup)	Technology	Temperature Grade	JESD-30 Code	Qualification Status	JESD-609 Code	Operating Temperature-Max	Operating Temperature-Min	Number of Terminals	Package Body Material	Package Code	Package Equivalence Code	Package Shape	Package Style	Surface Mount	Terminal Finish	Terminal Form	Terminal Pitch	Terminal Position	Seated Height-Max	Length	Width	Ihs Manufacturer	Part Package Code	Package Description	Pin Count	Reach Compliance Code	ECCN Code	HTS Code

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Transferred

4.7186 Mbit

256KX18

3.3 V

9 ns

83 MHz

ZBT SRAM

COMMON

256000

262.144 k

SYNCHRONOUS

3-STATE

PARALLEL

10 mA

3.14 V

3.465 V

3.135 V

CMOS

INDUSTRIAL

R-PBGA-B119

Not Qualified

85 °C

-40 °C

119

PLASTIC/EPOXY

BGA

BGA119,7X17,50

RECTANGULAR

GRID ARRAY

YES

Tin/Lead (Sn/Pb)

BALL

1.27 mm

BOTTOM

2.4 mm

22 mm

14 mm

MICRON TECHNOLOGY INC

BGA

14 X 22 MM, PLASTIC, MS-028BHA, BGA-119

119

not_compliant

3A991.B.2.A

8542.32.00.41

Check for Price

Obsolete

4.7186 Mbit

256KX18

3.3 V

9 ns

ZBT SRAM

256000

262.144 k

SYNCHRONOUS

PARALLEL

3.465 V

3.135 V

CMOS

COMMERCIAL

R-PBGA-B119

Not Qualified

70 °C

119

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

YES

TIN LEAD

BALL

1.27 mm

BOTTOM

2.4 mm

22 mm

14 mm

CYPRESS SEMICONDUCTOR CORP

BGA

BGA,

119

not_compliant

3A991.B.2.A

8542.32.00.41

Check for Price

Obsolete

4.7186 Mbit

256KX18

3.3 V

9 ns

ZBT SRAM

256000

262.144 k

SYNCHRONOUS

3-STATE

YES

PARALLEL

3.465 V

3.135 V

CMOS

COMMERCIAL

R-PQFP-G100

Not Qualified

70 °C

100

PLASTIC/EPOXY

LQFP

RECTANGULAR

FLATPACK, LOW PROFILE

YES

TIN LEAD

GULL WING

650 µm

QUAD

1.6 mm

20 mm

14 mm

MICRON TECHNOLOGY INC

QFP

LQFP,

100

unknown

3A991.B.2.A

8542.32.00.41

Check for Price

Active

ZBT SRAM

MICRON TECHNOLOGY INC

unknown

EAR99

8542.32.00.41

Check for Price

Obsolete

4.7186 Mbit

256KX18

3.3 V

8 ns

95 MHz

ZBT SRAM

COMMON

256000

262.144 k

SYNCHRONOUS

3-STATE

YES

PARALLEL

1 mA

3.14 V

300 µA

3.465 V

3.135 V

CMOS

COMMERCIAL

R-PQFP-G100

Not Qualified

70 °C

100

PLASTIC/EPOXY

LQFP

QFP100,.63X.87

RECTANGULAR

FLATPACK, LOW PROFILE

YES

TIN LEAD

GULL WING

650 µm

QUAD

1.6 mm

20 mm

14 mm

MICRON TECHNOLOGY INC

QFP

MS-026, TQFP-100

100

not_compliant

3A991.B.2.A

8542.32.00.41

Check for Price

Obsolete

4.7186 Mbit

256KX18

3.3 V

7.5 ns

ZBT SRAM

256000

262.144 k

SYNCHRONOUS

PARALLEL

3.465 V

3.135 V

CMOS

COMMERCIAL

R-PBGA-B119

Not Qualified

70 °C

119

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

YES

TIN LEAD

BALL

1.27 mm

BOTTOM

2.4 mm

22 mm

14 mm

CYPRESS SEMICONDUCTOR CORP

BGA

BGA,

119

not_compliant

3A991.B.2.A

8542.32.00.41

Check for Price

Transferred

4.7186 Mbit

256KX18

3.3 V

9 ns

83 MHz

ZBT SRAM

COMMON

256000

262.144 k

SYNCHRONOUS

3-STATE

PARALLEL

10 mA

3.14 V

250 µA

3.465 V

3.135 V

CMOS

INDUSTRIAL

R-PQFP-G100

Not Qualified

85 °C

-40 °C

100

PLASTIC/EPOXY

LQFP

QFP100,.63X.87

RECTANGULAR

FLATPACK, LOW PROFILE

YES

Tin/Lead (Sn/Pb)

GULL WING

650 µm

QUAD

1.6 mm

20 mm

14 mm

MICRON TECHNOLOGY INC

QFP

PLASTIC, MS-026BHA, TQFP-100

100

not_compliant

3A991.B.2.A

8542.32.00.41

Check for Price

Obsolete

4.7186 Mbit

256KX18

3.3 V

9 ns

83 MHz

ZBT SRAM

COMMON

256000

262.144 k

SYNCHRONOUS

3-STATE

YES

PARALLEL

10 mA

3.14 V

250 µA

3.465 V

3.135 V

CMOS

COMMERCIAL

R-PQFP-G100

Not Qualified

70 °C

100

PLASTIC/EPOXY

LQFP

QFP100,.63X.87

RECTANGULAR

FLATPACK, LOW PROFILE

YES

TIN LEAD

GULL WING

650 µm

QUAD

1.6 mm

20 mm

14 mm

MICRON TECHNOLOGY INC

QFP

PLASTIC, MS-026BHA, TQFP-100

100

not_compliant

3A991.B.2.A

8542.32.00.41

Check for Price

Obsolete

4.7186 Mbit

256KX18

3.3 V

8.5 ns

ZBT SRAM

256000

262.144 k

SYNCHRONOUS

3-STATE

YES

PARALLEL

3.465 V

3.135 V

CMOS

COMMERCIAL

R-PQFP-G100

Not Qualified

70 °C

100

PLASTIC/EPOXY

LQFP

RECTANGULAR

FLATPACK, LOW PROFILE

YES

TIN LEAD

GULL WING

650 µm

QUAD

1.6 mm

20 mm

14 mm

MICRON TECHNOLOGY INC

QFP

LQFP,

100

unknown

3A991.B.2.A

8542.32.00.41

Check for Price

Obsolete

4.7186 Mbit

256KX18

3.3 V

9 ns

ZBT SRAM

256000

262.144 k

SYNCHRONOUS

PARALLEL

3.465 V

3.135 V

CMOS

INDUSTRIAL

R-PBGA-B119

Not Qualified

85 °C

-40 °C

119

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

YES

TIN LEAD

BALL

1.27 mm

BOTTOM

2.4 mm

22 mm

14 mm

CYPRESS SEMICONDUCTOR CORP

BGA

BGA,

119

not_compliant

3A991.B.2.A

8542.32.00.41

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Compare

MT55L256L18F1B-12IT

Micron Technology Inc

Check for Price

Transferred

4.7186 Mbit

256KX18

3.3 V

9 ns

83 MHz

ZBT SRAM

COMMON

256000

262.144 k

SYNCHRONOUS

3-STATE

PARALLEL

10 mA

3.14 V

3.465 V

3.135 V

CMOS

INDUSTRIAL

R-PBGA-B119

Not Qualified

85 °C

-40 °C

119

PLASTIC/EPOXY

BGA

BGA119,7X17,50

RECTANGULAR

GRID ARRAY

YES

Tin/Lead (Sn/Pb)

BALL

1.27 mm

BOTTOM

2.4 mm

22 mm

14 mm

MICRON TECHNOLOGY INC

BGA

14 X 22 MM, PLASTIC, MS-028BHA, BGA-119

119

not_compliant

3A991.B.2.A

8542.32.00.41

MT55L256L18F1B-12

Cypress Semiconductor

Check for Price

Obsolete

4.7186 Mbit

256KX18

3.3 V

9 ns

ZBT SRAM

256000

262.144 k

SYNCHRONOUS

PARALLEL

3.465 V

3.135 V

CMOS

COMMERCIAL

R-PBGA-B119

Not Qualified

70 °C

119

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

YES

TIN LEAD

BALL

1.27 mm

BOTTOM

2.4 mm

22 mm

14 mm

CYPRESS SEMICONDUCTOR CORP

BGA

BGA,

119

not_compliant

3A991.B.2.A

8542.32.00.41

MT55L256L18FT-12TR

Micron Technology Inc

Check for Price

Obsolete

4.7186 Mbit

256KX18

3.3 V

9 ns

ZBT SRAM

256000

262.144 k

SYNCHRONOUS

3-STATE

YES

PARALLEL

3.465 V

3.135 V

CMOS

COMMERCIAL

R-PQFP-G100

Not Qualified

70 °C

100

PLASTIC/EPOXY

LQFP

RECTANGULAR

FLATPACK, LOW PROFILE

YES

TIN LEAD

GULL WING

650 µm

QUAD

1.6 mm

20 mm

14 mm

MICRON TECHNOLOGY INC

QFP

LQFP,

100

unknown

3A991.B.2.A

8542.32.00.41

MT55L256L18F1T-12TR

Micron Technology Inc

Check for Price

Active

ZBT SRAM

MICRON TECHNOLOGY INC

unknown

EAR99

8542.32.00.41

MT55L256L18FT-10.5

Micron Technology Inc

Check for Price

Obsolete

4.7186 Mbit

256KX18

3.3 V

8 ns

95 MHz

ZBT SRAM

COMMON

256000

262.144 k

SYNCHRONOUS

3-STATE

YES

PARALLEL

1 mA

3.14 V

300 µA

3.465 V

3.135 V

CMOS

COMMERCIAL

R-PQFP-G100

Not Qualified

70 °C

100

PLASTIC/EPOXY

LQFP

QFP100,.63X.87

RECTANGULAR

FLATPACK, LOW PROFILE

YES

TIN LEAD

GULL WING

650 µm

QUAD

1.6 mm

20 mm

14 mm

MICRON TECHNOLOGY INC

QFP

MS-026, TQFP-100

100

not_compliant

3A991.B.2.A

8542.32.00.41

MT55L256L18F1B-10

Cypress Semiconductor

Check for Price

Obsolete

4.7186 Mbit

256KX18

3.3 V

7.5 ns

ZBT SRAM

256000

262.144 k

SYNCHRONOUS

PARALLEL

3.465 V

3.135 V

CMOS

COMMERCIAL

R-PBGA-B119

Not Qualified

70 °C

119

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

YES

TIN LEAD

BALL

1.27 mm

BOTTOM

2.4 mm

22 mm

14 mm

CYPRESS SEMICONDUCTOR CORP

BGA

BGA,

119

not_compliant

3A991.B.2.A

8542.32.00.41

MT55L256L18F1T-12IT

Micron Technology Inc

Check for Price

Transferred

4.7186 Mbit

256KX18

3.3 V

9 ns

83 MHz

ZBT SRAM

COMMON

256000

262.144 k

SYNCHRONOUS

3-STATE

PARALLEL

10 mA

3.14 V

250 µA

3.465 V

3.135 V

CMOS

INDUSTRIAL

R-PQFP-G100

Not Qualified

85 °C

-40 °C

100

PLASTIC/EPOXY

LQFP

QFP100,.63X.87

RECTANGULAR

FLATPACK, LOW PROFILE

YES

Tin/Lead (Sn/Pb)

GULL WING

650 µm

QUAD

1.6 mm

20 mm

14 mm

MICRON TECHNOLOGY INC

QFP

PLASTIC, MS-026BHA, TQFP-100

100

not_compliant

3A991.B.2.A

8542.32.00.41

MT55L256L18FT-12

Micron Technology Inc

Check for Price

Obsolete

4.7186 Mbit

256KX18

3.3 V

9 ns

83 MHz

ZBT SRAM

COMMON

256000

262.144 k

SYNCHRONOUS

3-STATE

YES

PARALLEL

10 mA

3.14 V

250 µA

3.465 V

3.135 V

CMOS

COMMERCIAL

R-PQFP-G100

Not Qualified

70 °C

100

PLASTIC/EPOXY

LQFP

QFP100,.63X.87

RECTANGULAR

FLATPACK, LOW PROFILE

YES

TIN LEAD

GULL WING

650 µm

QUAD

1.6 mm

20 mm

14 mm

MICRON TECHNOLOGY INC

QFP

PLASTIC, MS-026BHA, TQFP-100

100

not_compliant

3A991.B.2.A

8542.32.00.41

MT55L256L18FT-11TR

Micron Technology Inc

Check for Price

Obsolete

4.7186 Mbit

256KX18

3.3 V

8.5 ns

ZBT SRAM

256000

262.144 k

SYNCHRONOUS

3-STATE

YES

PARALLEL

3.465 V

3.135 V

CMOS

COMMERCIAL

R-PQFP-G100

Not Qualified

70 °C

100

PLASTIC/EPOXY

LQFP

RECTANGULAR

FLATPACK, LOW PROFILE

YES

TIN LEAD

GULL WING

650 µm

QUAD

1.6 mm

20 mm

14 mm

MICRON TECHNOLOGY INC

QFP

LQFP,

100

unknown

3A991.B.2.A

8542.32.00.41

MT55L256L18F1B-12IT

Cypress Semiconductor

Check for Price

Obsolete

4.7186 Mbit

256KX18

3.3 V

9 ns

ZBT SRAM

256000

262.144 k

SYNCHRONOUS

PARALLEL

3.465 V

3.135 V

CMOS

INDUSTRIAL

R-PBGA-B119

Not Qualified

85 °C

-40 °C

119

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

YES

TIN LEAD

BALL

1.27 mm

BOTTOM

2.4 mm

22 mm

14 mm

CYPRESS SEMICONDUCTOR CORP

BGA

BGA,

119

not_compliant

3A991.B.2.A

8542.32.00.41

1 2 3 4 5 Next