Findchips: Parametric Search Results for mt58l128l32d1f-6


Select Parts		Part Number

		MT58L128L32D1F-6 Rochester Electronics LLC
		MT58L128L32D1F-6IT Micron Technology Inc
		MT58L128L32D1F-6 Micron Technology Inc
		MT58L128L32D1F-6 Cypress Semiconductor
		MT58L128L32D1F-6IT Cypress Semiconductor

			Most Relevant						Technical																Compliance			Operating Conditions		Physical											Dimensions			Other
Composite Price	Rohs Code	Part Life Cycle Code	Memory Density	Memory Width	Organization	Supply Voltage-Nom (Vsup)	Access Time-Max	Clock Frequency-Max (fCLK)	Memory IC Type	Additional Feature	I/O Type	Number of Functions	Number of Words Code	Number of Words	Operating Mode	Output Characteristics	Parallel/Serial	Standby Current-Max	Standby Voltage-Min	Supply Current-Max	Supply Voltage-Max (Vsup)	Supply Voltage-Min (Vsup)	Technology	Temperature Grade	JESD-30 Code	Qualification Status	JESD-609 Code	Operating Temperature-Max	Operating Temperature-Min	Number of Terminals	Package Body Material	Package Code	Package Equivalence Code	Package Shape	Package Style	Surface Mount	Terminal Finish	Terminal Form	Terminal Pitch	Terminal Position	Seated Height-Max	Length	Width	Ihs Manufacturer	Part Package Code	Package Description	Pin Count	Reach Compliance Code	ECCN Code	HTS Code

Check for Price

Not Recommended

4.1943 Mbit

128KX32

3.3 V

3.5 ns

CACHE SRAM

PIPELINED ARCHITECTURE

128000

131.072 k

SYNCHRONOUS

PARALLEL

3.6 V

3.135 V

CMOS

COMMERCIAL

R-PBGA-B165

COMMERCIAL

70 °C

165

PLASTIC/EPOXY

TBGA

RECTANGULAR

GRID ARRAY, THIN PROFILE

YES

TIN SILVER COPPER

BALL

1 mm

BOTTOM

1.2 mm

15 mm

13 mm

ROCHESTER ELECTRONICS INC

BGA

TBGA,

165

unknown

Check for Price

Transferred

4.1943 Mbit

128KX32

3.3 V

3.5 ns

STANDARD SRAM

128000

131.072 k

SYNCHRONOUS

PARALLEL

3.6 V

3.135 V

CMOS

INDUSTRIAL

R-PBGA-B165

Not Qualified

85 °C

-40 °C

165

PLASTIC/EPOXY

TBGA

RECTANGULAR

GRID ARRAY, THIN PROFILE

YES

TIN SILVER COPPER

BALL

1 mm

BOTTOM

1.2 mm

15 mm

13 mm

MICRON TECHNOLOGY INC

BGA

TBGA,

165

unknown

3A991.B.2.A

8542.32.00.41

Check for Price

Transferred

4.1943 Mbit

128KX32

3.3 V

3.5 ns

166 MHz

CACHE SRAM

PIPELINED ARCHITECTURE

COMMON

128000

131.072 k

SYNCHRONOUS

3-STATE

PARALLEL

10 mA

3.14 V

475 µA

3.6 V

3.135 V

CMOS

COMMERCIAL

R-PBGA-B165

Not Qualified

70 °C

165

PLASTIC/EPOXY

TBGA

BGA165,11X15,40

RECTANGULAR

GRID ARRAY, THIN PROFILE

YES

Tin/Lead (Sn/Pb)

BALL

1 mm

BOTTOM

1.2 mm

15 mm

13 mm

MICRON TECHNOLOGY INC

BGA

FBGA-165

165

not_compliant

3A991.B.2.A

8542.32.00.41

Check for Price

Obsolete

4.1943 Mbit

128KX32

3.3 V

3.5 ns

CACHE SRAM

PIPELINED ARCHITECTURE

128000

131.072 k

SYNCHRONOUS

PARALLEL

3.6 V

3.135 V

CMOS

COMMERCIAL

R-PBGA-B165

Not Qualified

70 °C

165

PLASTIC/EPOXY

TBGA

RECTANGULAR

GRID ARRAY, THIN PROFILE

YES

TIN LEAD

BALL

1 mm

BOTTOM

1.2 mm

15 mm

13 mm

CYPRESS SEMICONDUCTOR CORP

BGA

TBGA,

165

not_compliant

3A991.B.2.A

8542.32.00.41

Check for Price

Obsolete

4.1943 Mbit

128KX32

3.3 V

3.5 ns

STANDARD SRAM

128000

131.072 k

SYNCHRONOUS

PARALLEL

3.6 V

3.135 V

CMOS

INDUSTRIAL

R-PBGA-B165

Not Qualified

85 °C

-40 °C

165

PLASTIC/EPOXY

TBGA

RECTANGULAR

GRID ARRAY, THIN PROFILE

YES

BALL

1 mm

BOTTOM

1.2 mm

15 mm

13 mm

CYPRESS SEMICONDUCTOR CORP

BGA

TBGA,

165

unknown

3A991.B.2.A

8542.32.00.41

Compare

MT58L128L32D1F-6

Rochester Electronics LLC

Check for Price

Not Recommended

4.1943 Mbit

128KX32

3.3 V

3.5 ns

CACHE SRAM

PIPELINED ARCHITECTURE

128000

131.072 k

SYNCHRONOUS

PARALLEL

3.6 V

3.135 V

CMOS

COMMERCIAL

R-PBGA-B165

COMMERCIAL

70 °C

165

PLASTIC/EPOXY

TBGA

RECTANGULAR

GRID ARRAY, THIN PROFILE

YES

TIN SILVER COPPER

BALL

1 mm

BOTTOM

1.2 mm

15 mm

13 mm

ROCHESTER ELECTRONICS INC

BGA

TBGA,

165

unknown

MT58L128L32D1F-6IT

Micron Technology Inc

Check for Price

Transferred

4.1943 Mbit

128KX32

3.3 V

3.5 ns

STANDARD SRAM

128000

131.072 k

SYNCHRONOUS

PARALLEL

3.6 V

3.135 V

CMOS

INDUSTRIAL

R-PBGA-B165

Not Qualified

85 °C

-40 °C

165

PLASTIC/EPOXY

TBGA

RECTANGULAR

GRID ARRAY, THIN PROFILE

YES

TIN SILVER COPPER

BALL

1 mm

BOTTOM

1.2 mm

15 mm

13 mm

MICRON TECHNOLOGY INC

BGA

TBGA,

165

unknown

3A991.B.2.A

8542.32.00.41

MT58L128L32D1F-6

Micron Technology Inc

Check for Price

Transferred

4.1943 Mbit

128KX32

3.3 V

3.5 ns

166 MHz

CACHE SRAM

PIPELINED ARCHITECTURE

COMMON

128000

131.072 k

SYNCHRONOUS

3-STATE

PARALLEL

10 mA

3.14 V

475 µA

3.6 V

3.135 V

CMOS

COMMERCIAL

R-PBGA-B165

Not Qualified

70 °C

165

PLASTIC/EPOXY

TBGA

BGA165,11X15,40

RECTANGULAR

GRID ARRAY, THIN PROFILE

YES

Tin/Lead (Sn/Pb)

BALL

1 mm

BOTTOM

1.2 mm

15 mm

13 mm

MICRON TECHNOLOGY INC

BGA

FBGA-165

165

not_compliant

3A991.B.2.A

8542.32.00.41

MT58L128L32D1F-6

Cypress Semiconductor

Check for Price

Obsolete

4.1943 Mbit

128KX32

3.3 V

3.5 ns

CACHE SRAM

PIPELINED ARCHITECTURE

128000

131.072 k

SYNCHRONOUS

PARALLEL

3.6 V

3.135 V

CMOS

COMMERCIAL

R-PBGA-B165

Not Qualified

70 °C

165

PLASTIC/EPOXY

TBGA

RECTANGULAR

GRID ARRAY, THIN PROFILE

YES

TIN LEAD

BALL

1 mm

BOTTOM

1.2 mm

15 mm

13 mm

CYPRESS SEMICONDUCTOR CORP

BGA

TBGA,

165

not_compliant

3A991.B.2.A

8542.32.00.41

MT58L128L32D1F-6IT

Cypress Semiconductor

Check for Price

Obsolete

4.1943 Mbit

128KX32

3.3 V

3.5 ns

STANDARD SRAM

128000

131.072 k

SYNCHRONOUS

PARALLEL

3.6 V

3.135 V

CMOS

INDUSTRIAL

R-PBGA-B165

Not Qualified

85 °C

-40 °C

165

PLASTIC/EPOXY

TBGA

RECTANGULAR

GRID ARRAY, THIN PROFILE

YES

BALL

1 mm

BOTTOM

1.2 mm

15 mm

13 mm

CYPRESS SEMICONDUCTOR CORP

BGA

TBGA,

165

unknown

3A991.B.2.A

8542.32.00.41

Parametric results for: mt58l128l32d1f-6 under SRAMs