Parametric results for: n02gw under SRAMs

All Filters Access Time-Max Additional Feature Alternate Memory Width I/O Type JESD-30 Code JESD-609 Code Length Manufacturer Memory Density Memory IC Type Memory Width Moisture Sensitivity Level Number of Functions Number of Terminals Number of Words Number of Words Code Operating Mode Operating Temperature-Max Operating Temperature-Min Organization Output Characteristics Package Body Material Package Code Package Equivalence Code Package Shape Package Style Supply Voltage-Nom (Vsup) Access Time-Max (8)

20 ns 84 25 ns 86 55 ns 37 70 ns 78 85 ns 21 100 ns 1 150 ns 3 500 ns 1

Min (ns) - Max (ns)

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ALSO CONFIGURABLE AS 2M X 8 99 CONFIGURABLE AS 512K X 8 20 HIGH RELIABILITY 193 IT CAN ALSO BE ORGANIZED AS 512K X 8 12 TTL COMPATIBLE INPUTS/OUTPUTS 12

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16 131

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COMMON 143

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O-CXDB-X4 8 O-MUPM-D2 190 O-MUPM-H3 1 R-CDFP-F32 2 R-CDFP-F36 4 R-CDIP-T32 4 R-CDSO-J36 4 R-PBGA-B48 54 R-PDSO-F3 8 R-PDSO-G32 42 R-PDSO-G44 42 R-PDSO-G8 2 R-PDSO-J36 4 R-PDSO-N8 2 R-XDFP-F36 2 R-XDIP-T32 2 R-XDSO-J36 2 S-CPGA-P66 60 S-CQFP-F68 20 S-CQFP-G68 43 S-CQMA-F68 4 S-CQMA-G68 8 S-XPGA-P66 3 S-XQFP-F68 4 S-XQFP-G68 4 X-XUUC-N 3

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e0 70 e1 8 e3 1 e3/e4 3

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8 mm 38 11.8 mm 16 18.4 mm 13 18.41 mm 30 20.828 mm 2 22.352 mm 23 23.495 mm 4 23.876 mm 20 30.1 mm 10

Min (mm) - Max (mm)

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Manufacturer (14)

AMI Semiconductor 36 Amphenol Corporation 13 Cobham Advanced Electronic Solutions 28 Cobham PLC 73 Cobham Power Products 80 Cypress Semiconductor 4 IXYS Corporation 110 IXYS UK Westcode 109 Littelfuse Inc 10 NanoAmp Solutions, Inc. 53 onsemi 59 Renesas Electronics Corporation 21 Rochester Electronics LLC 5 Tripp Lite 12

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Memory Density (4)

262.144 kbit 4 2.0972 Mbit 141 4.1943 Mbit 66 16.7772 Mbit 104

Min (bit) - Max (bit)

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CACHE SRAM 18 CACHE SRAM MODULE 123 NON-VOLATILE SRAM 4 SRAM MODULE 23 STANDARD SRAM 147

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Memory Width (3)

8 77 16 93 32 142

Min - Max

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1 17

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1.0 253

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2 191 3 8 32 50 36 16 4 8 44 42 48 54 66 63 68 83 8 4

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32.768 k 4 131.072 k 134 262.144 k 45 524.288 k 132

Min (words) - Max (words)

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32000.0 4 128000.0 134 256000.0 45 512000.0 132

Min - Max

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ASYNCHRONOUS 311

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60.0 °C 2 70.0 °C 20 85.0 °C 163 125.0 °C 159 150.0 °C 11

Min (°C) - Max (°C)

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-55.0 °C 130 -40.0 °C 190 -30.0 °C 2 -20.0 °C 2 0.0 °C 20

Min (°C) - Max (°C)

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Organization (6)

128KX16 96 128KX32 38 256KX8 45 32KX8 4 512KX32 104 512KX8 28

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3-STATE 143

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CERAMIC 17 CERAMIC, METAL-SEALED COFIRED 157 METAL 191 PLASTIC/EPOXY 154 UNSPECIFIED 3

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DFP 8 DIE 3 DIP 6 FBGA 16 LFBGA 38 LSSOP 41 PGA 63 QFF 26 QFP 49 SOJ 10 SON 2 SOP 2 TSOP 12 TSOP1 18 TSSOP 13

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BGA48,6X8,30 48 DIP32,.6 4 FL36,.5 4 PGA66,11X11 6 QFL68,1.56SQ 8 QFP68,.99SQ,50 4 QFP68,1.1SQ,50 4 SOJ36,.44 4 SOLCC8,.16,37 2 SOP8,.25 2 TSOP44,.46,32 36 TSSOP32,.56,20 15 TSSOP32,.8,20 10

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RECTANGULAR 174 ROUND 199 SQUARE 146 UNSPECIFIED 3

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DISK BUTTON 8 FLATPACK 79 GRID ARRAY 63 GRID ARRAY, FINE PITCH 16 GRID ARRAY, LOW PROFILE, FINE PITCH 38 IN-LINE 6 MICROELECTRONIC ASSEMBLY 12 POST/STUD MOUNT 191 SMALL OUTLINE 22 SMALL OUTLINE, LOW PROFILE, SHRINK PITCH 41 SMALL OUTLINE, THIN PROFILE 30 SMALL OUTLINE, THIN PROFILE, SHRINK PITCH 13 UNCASED CHIP 3

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Supply Voltage-Nom (Vsup) (4)

1.8 V 28 3 V 72 3.3 V 14 5 V 158

Min (V) - Max (V)

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