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RDA112M4MSLPD-DI
Teledyne Technologies Inc
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Check for Price | Active | 3.3 V | 1.2 V | -1.2 V | 12 | YES | D/A CONVERTER | OFFSET BINARY | PARALLEL, WORD | 1 | OTHER | X-XUUC-N | 85 °C | -15 °C | UNSPECIFIED | DIE | DIE OR CHIP | UNSPECIFIED | UNCASED CHIP | NO LEAD | UNSPECIFIED | TELEDYNE TECHNOLOGIES INC | DIE, DIE OR CHIP | compliant | 8542.39.00.01 | |||||||||
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RDA112RZ-DI
Teledyne Technologies Inc
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Check for Price | Active | 3.3 V | 1.26 V | -1.26 V | 0.1 % | 12 | YES | D/A CONVERTER | OFFSET BINARY | PARALLEL, WORD | -5.2 V | 1 | INDUSTRIAL | R-XUUC-N59 | 85 °C | -40 °C | 59 | UNSPECIFIED | DIE | DIE OR CHIP | RECTANGULAR | UNCASED CHIP | NO LEAD | UNSPECIFIED | TELEDYNE TECHNOLOGIES INC | DIE, DIE OR CHIP | compliant | 8542.39.00.01 | ||||||
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RDA112M4MSLPD-BG
Teledyne Technologies Inc
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Check for Price | Active | 3.3 V | 1.2 V | -1.2 V | 12 | YES | D/A CONVERTER | OFFSET BINARY | PARALLEL, WORD | 1 | OTHER | S-PBGA-B224 | 85 °C | -15 °C | 224 | PLASTIC/EPOXY | HBGA | BGA224,18X18,50 | SQUARE | GRID ARRAY, HEAT SINK/SLUG | BALL | 1.27 mm | BOTTOM | 23 mm | 4.105 mm | 23 mm | TELEDYNE TECHNOLOGIES INC | HBGA, BGA224,18X18,50 | compliant | 8542.39.00.01 | ||||
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RDA112RZ-QP
Teledyne Technologies Inc
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Check for Price | Active | 3.3 V | 1.26 V | -1.26 V | 0.1 % | 12 | YES | D/A CONVERTER | OFFSET BINARY | PARALLEL, WORD | -5.2 V | 1 | INDUSTRIAL | S-PQFP-G60 | 85 °C | -40 °C | 60 | PLASTIC/EPOXY | HQFP | HQFP60,.8SQ,40 | SQUARE | FLATPACK, HEAT SINK/SLUG | GULL WING | 1.016 mm | QUAD | 16.76 mm | 2.515 mm | 16.76 mm | TELEDYNE TECHNOLOGIES INC | HQFP, HQFP60,.8SQ,40 | compliant | 8542.39.00.01 |