Findchips: Parametric Search Results for s25fl256sagbhi200


Select Parts		Part Number

		S25FL256SAGBHI200 Infineon Technologies AG
		S25FL256SAGBHI200 Spansion
		S25FL256SAGBHI200 Cypress Semiconductor

			Most Relevant					Technical																						Compliance			Operating Conditions						Physical											Dimensions			Other
Composite Price	Rohs Code	Part Life Cycle Code	Memory Density	Memory Width	Organization	Supply Voltage-Nom (Vsup)	Clock Frequency-Max (fCLK)	Memory IC Type	Additional Feature	Alternate Memory Width	Data Retention Time-Min	Endurance	Number of Functions	Number of Words Code	Number of Words	Operating Mode	Output Characteristics	Parallel/Serial	Programming Voltage	Serial Bus Type	Standby Current-Max	Supply Current-Max	Supply Voltage-Max (Vsup)	Supply Voltage-Min (Vsup)	Technology	Temperature Grade	Type	Write Cycle Time-Max (tWC)	Write Protection	JESD-30 Code	Qualification Status	JESD-609 Code	Moisture Sensitivity Level	Operating Temperature-Max	Operating Temperature-Min	Peak Reflow Temperature (Cel)	Screening Level	Time@Peak Reflow Temperature-Max (s)	Number of Terminals	Package Body Material	Package Code	Package Equivalence Code	Package Shape	Package Style	Surface Mount	Terminal Finish	Terminal Form	Terminal Pitch	Terminal Position	Seated Height-Max	Length	Width	Ihs Manufacturer	Reach Compliance Code	Samacsys Manufacturer	Part Package Code	Package Description	Pin Count	ECCN Code	HTS Code

$4.0800

Yes

Active

268.4355 Mbit

32MX8

3 V

133 MHz

FLASH

ALSO CONFIGURABLE AS 128M X 1

100000 Write/Erase Cycles

32000000

33.5544 M

SYNCHRONOUS

3-STATE

SERIAL

3 V

SPI

100 µA

3.6 V

2.7 V

CMOS

INDUSTRIAL

NOR TYPE

500 ms

HARDWARE/SOFTWARE

R-PBGA-B24

Not Qualified

85 °C

-40 °C

NOT SPECIFIED

AEC-Q100

NOT SPECIFIED

PLASTIC/EPOXY

TBGA

BGA24,5X5,40

RECTANGULAR

GRID ARRAY, THIN PROFILE

YES

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

1 mm

BOTTOM

1.2 mm

8 mm

6 mm

INFINEON TECHNOLOGIES AG

compliant

Infineon

Check for Price

Yes

Transferred

268.4355 Mbit

32MX8

3 V

133 MHz

FLASH

ALSO CONFIGURABLE AS 128M X 1

100000 Write/Erase Cycles

32000000

33.5544 M

SYNCHRONOUS

3-STATE

SERIAL

3 V

SPI

100 µA

3.6 V

2.7 V

CMOS

INDUSTRIAL

NOR TYPE

500 ms

HARDWARE/SOFTWARE

R-PBGA-B24

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

TBGA

BGA24,5X5,40

RECTANGULAR

GRID ARRAY, THIN PROFILE

YES

BALL

1 mm

BOTTOM

1.2 mm

8 mm

6 mm

SPANSION INC

compliant

Spansion

BGA

FBGA-24

3A991.B.1.A

8542.32.00.51

Check for Price

Yes

Transferred

268.4355 Mbit

32MX8

3 V

133 MHz

FLASH

ALSO CONFIGURABLE AS 128M X 1

100000 Write/Erase Cycles

32000000

33.5544 M

SYNCHRONOUS

3-STATE

SERIAL

3 V

SPI

100 µA

3.6 V

2.7 V

CMOS

INDUSTRIAL

NOR TYPE

500 ms

HARDWARE/SOFTWARE

R-PBGA-B24

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

TBGA

BGA24,5X5,40

RECTANGULAR

GRID ARRAY, THIN PROFILE

YES

TIN SILVER COPPER

BALL

1 mm

BOTTOM

1.2 mm

8 mm

6 mm

CYPRESS SEMICONDUCTOR CORP

compliant

3A991.B.1.A

8542.32.00.51

Compare

S25FL256SAGBHI200

Infineon Technologies AG

$4.0800

Yes

Active

268.4355 Mbit

32MX8

3 V

133 MHz

FLASH

ALSO CONFIGURABLE AS 128M X 1

100000 Write/Erase Cycles

32000000

33.5544 M

SYNCHRONOUS

3-STATE

SERIAL

3 V

SPI

100 µA

3.6 V

2.7 V

CMOS

INDUSTRIAL

NOR TYPE

500 ms

HARDWARE/SOFTWARE

R-PBGA-B24

Not Qualified

85 °C

-40 °C

NOT SPECIFIED

AEC-Q100

NOT SPECIFIED

PLASTIC/EPOXY

TBGA

BGA24,5X5,40

RECTANGULAR

GRID ARRAY, THIN PROFILE

YES

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

1 mm

BOTTOM

1.2 mm

8 mm

6 mm

INFINEON TECHNOLOGIES AG

compliant

Infineon

S25FL256SAGBHI200

Spansion

Check for Price

Yes

Transferred

268.4355 Mbit

32MX8

3 V

133 MHz

FLASH

ALSO CONFIGURABLE AS 128M X 1

100000 Write/Erase Cycles

32000000

33.5544 M

SYNCHRONOUS

3-STATE

SERIAL

3 V

SPI

100 µA

3.6 V

2.7 V

CMOS

INDUSTRIAL

NOR TYPE

500 ms

HARDWARE/SOFTWARE

R-PBGA-B24

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

TBGA

BGA24,5X5,40

RECTANGULAR

GRID ARRAY, THIN PROFILE

YES

BALL

1 mm

BOTTOM

1.2 mm

8 mm

6 mm

SPANSION INC

compliant

Spansion

BGA

FBGA-24

3A991.B.1.A

8542.32.00.51

S25FL256SAGBHI200

Cypress Semiconductor

Check for Price

Yes

Transferred

268.4355 Mbit

32MX8

3 V

133 MHz

FLASH

ALSO CONFIGURABLE AS 128M X 1

100000 Write/Erase Cycles

32000000

33.5544 M

SYNCHRONOUS

3-STATE

SERIAL

3 V

SPI

100 µA

3.6 V

2.7 V

CMOS

INDUSTRIAL

NOR TYPE

500 ms

HARDWARE/SOFTWARE

R-PBGA-B24

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

TBGA

BGA24,5X5,40

RECTANGULAR

GRID ARRAY, THIN PROFILE

YES

TIN SILVER COPPER

BALL

1 mm

BOTTOM

1.2 mm

8 mm

6 mm

CYPRESS SEMICONDUCTOR CORP

compliant

3A991.B.1.A

8542.32.00.51

Parametric results for: s25fl256sagbhi200 under Flash Memories