Findchips: Parametric Search Results for s29al004d

Parametric results for: s29al004d under Flash Memories

Select parts from the table below to compare.

Compare


Select Parts		Part Number

		S29AL004D55BANR20 Spansion
		S29AL004D90TAF023 Spansion
		S29AL004D70BAI013 Cypress Semiconductor
		S29AL004D90BFN022 Cypress Semiconductor
		S29AL004D55BFI010 Cypress Semiconductor
		S29AL004D55MANR13 Spansion
		S29AL004D70BFN022 AMD
		S29AL004D70BFI022 Spansion
		S29AL004D70MAI013 Spansion
		S29AL004D70TFN010 AMD

				Most Relevant						Technical																							Compliance			Operating Conditions					Physical											Dimensions			Other
Composite Price	Pbfree Code	Rohs Code	Part Life Cycle Code	Memory Density	Memory Width	Sector Size	Organization	Supply Voltage-Nom (Vsup)	Access Time-Max	Memory IC Type	Additional Feature	Alternate Memory Width	Boot Block	Command User Interface	Data Polling	Endurance	Number of Functions	Number of Sectors/Size	Number of Words Code	Number of Words	Operating Mode	Parallel/Serial	Programming Voltage	Ready/Busy	Standby Current-Max	Supply Current-Max	Supply Voltage-Max (Vsup)	Supply Voltage-Min (Vsup)	Technology	Temperature Grade	Toggle Bit	Type	JESD-30 Code	Qualification Status	JESD-609 Code	Moisture Sensitivity Level	Operating Temperature-Max	Operating Temperature-Min	Peak Reflow Temperature (Cel)	Time@Peak Reflow Temperature-Max (s)	Number of Terminals	Package Body Material	Package Code	Package Equivalence Code	Package Shape	Package Style	Surface Mount	Terminal Finish	Terminal Form	Terminal Pitch	Terminal Position	Seated Height-Max	Length	Width	Ihs Manufacturer	Part Package Code	Package Description	Pin Count	Reach Compliance Code	ECCN Code	HTS Code

Check for Price

Obsolete

4.1943 Mbit

16K,8K,32K,64K

256KX16

3.3 V

55 ns

FLASH

ALSO CONFIGURABLE AS 512K X 8; BOTTOM BOOT BLOCK

BOTTOM

YES

1000000 Write/Erase Cycles

1,2,1,7

256000

262.144 k

ASYNCHRONOUS

PARALLEL

3 V

YES

5 µA

35 µA

3.6 V

3 V

CMOS

AUTOMOTIVE

YES

NOR TYPE

R-PBGA-B48

Not Qualified

125 °C

-40 °C

260

PLASTIC/EPOXY

VFBGA

BGA48,6X8,32

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

YES

TIN LEAD

BALL

800 µm

BOTTOM

1 mm

8.15 mm

6.15 mm

SPANSION INC

BGA

VFBGA, BGA48,6X8,32

not_compliant

EAR99

8542.32.00.51

Check for Price

Obsolete

4.1943 Mbit

256KX16

3 V

90 ns

FLASH

ALSO CONFIGURABLE AS 512K X 8; BOTTOM BOOT BLOCK

BOTTOM

256000

262.144 k

ASYNCHRONOUS

PARALLEL

3 V

3.6 V

2.7 V

CMOS

INDUSTRIAL

NOR TYPE

R-PDSO-G48

Not Qualified

85 °C

-40 °C

NOT SPECIFIED

PLASTIC/EPOXY

TSSOP

RECTANGULAR

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

YES

GULL WING

500 µm

DUAL

1.2 mm

18.4 mm

12 mm

SPANSION INC

TSOP1

TSSOP,

unknown

EAR99

8542.32.00.51

Check for Price

Obsolete

4.1943 Mbit

256KX16

3 V

70 ns

FLASH

ALSO CONFIGURABLE AS 512K X 8; TOP BOOT BLOCK

TOP

256000

262.144 k

ASYNCHRONOUS

PARALLEL

3 V

3.6 V

2.7 V

CMOS

INDUSTRIAL

NOR TYPE

R-PBGA-B48

85 °C

-40 °C

260

PLASTIC/EPOXY

VFBGA

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

YES

TIN LEAD

BALL

800 µm

BOTTOM

1 mm

8.15 mm

6.15 mm

CYPRESS SEMICONDUCTOR CORP

FBGA-48

compliant

EAR99

8542.32.00.51

Check for Price

Yes

Obsolete

4.1943 Mbit

256KX16

3 V

90 ns

FLASH

ALSO CONFIGURABLE AS 512K X 8; BOTTOM BOOT BLOCK

BOTTOM

256000

262.144 k

ASYNCHRONOUS

PARALLEL

3 V

3.6 V

2.7 V

CMOS

AUTOMOTIVE

NOR TYPE

R-PBGA-B48

125 °C

-40 °C

260

PLASTIC/EPOXY

VFBGA

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

YES

TIN SILVER COPPER

BALL

800 µm

BOTTOM

1 mm

8.15 mm

6.15 mm

CYPRESS SEMICONDUCTOR CORP

FBGA-48

compliant

EAR99

8542.32.00.51

Check for Price

Yes

Obsolete

4.1943 Mbit

256KX16

3 V

55 ns

FLASH

ALSO CONFIGURABLE AS 512K X 8; TOP BOOT BLOCK

TOP

256000

262.144 k

ASYNCHRONOUS

PARALLEL

3 V

3.6 V

2.7 V

CMOS

INDUSTRIAL

NOR TYPE

R-PBGA-B48

85 °C

-40 °C

260

PLASTIC/EPOXY

VFBGA

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

YES

TIN SILVER COPPER

BALL

800 µm

BOTTOM

1 mm

8.15 mm

6.15 mm

CYPRESS SEMICONDUCTOR CORP

FBGA-48

compliant

EAR99

8542.32.00.51

Check for Price

Obsolete

4.1943 Mbit

16K,8K,32K,64K

256KX16

3.3 V

55 ns

FLASH

ALSO CONFIGURABLE AS 512K X 8; TOP BOOT BLOCK

TOP

YES

1000000 Write/Erase Cycles

1,2,1,7

256000

262.144 k

ASYNCHRONOUS

PARALLEL

3 V

YES

5 µA

35 µA

3.6 V

3 V

CMOS

AUTOMOTIVE

YES

NOR TYPE

R-PDSO-G44

Not Qualified

125 °C

-40 °C

260

PLASTIC/EPOXY

SOP

SOP44,.63

RECTANGULAR

SMALL OUTLINE

YES

TIN LEAD

GULL WING

1.27 mm

DUAL

2.8 mm

28.2 mm

13.3 mm

SPANSION INC

QFP

MO-108AA, SOP-44

compliant

EAR99

8542.32.00.51

Check for Price

Yes

Transferred

4.1943 Mbit

16K,8K,32K,64K

256KX16

70 ns

FLASH

BOTTOM

YES

1000000 Write/Erase Cycles

1,2,1,7

256000

262.144 k

PARALLEL

YES

5 µA

35 µA

CMOS

AUTOMOTIVE

YES

NOR TYPE

R-PBGA-B48

Not Qualified

125 °C

-40 °C

PLASTIC/EPOXY

FBGA

BGA48,6X8,32

RECTANGULAR

GRID ARRAY, FINE PITCH

YES

BALL

800 µm

BOTTOM

ADVANCED MICRO DEVICES INC

unknown

EAR99

8542.32.00.51

Check for Price

Yes

Obsolete

4.1943 Mbit

16K,8K,32K,64K

256KX16

3 V

70 ns

FLASH

ALSO CONFIGURABLE AS 512K X 8; BOTTOM BOOT BLOCK

BOTTOM

YES

1000000 Write/Erase Cycles

1,2,1,7

256000

262.144 k

ASYNCHRONOUS

PARALLEL

3 V

YES

5 µA

35 µA

3.6 V

2.7 V

CMOS

INDUSTRIAL

YES

NOR TYPE

R-PBGA-B48

Not Qualified

85 °C

-40 °C

260

PLASTIC/EPOXY

VFBGA

BGA48,6X8,32

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

YES

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BALL

800 µm

BOTTOM

1 mm

8.15 mm

6.15 mm

SPANSION INC

BGA

8.15 X 6.15 MM, LEAD FREE, FBGA-48

compliant

EAR99

8542.32.00.51

Check for Price

Obsolete

4.1943 Mbit

16K,8K,32K,64K

256KX16

3 V

70 ns

FLASH

ALSO CONFIGURABLE AS 512K X 8; TOP BOOT BLOCK

TOP

YES

1000000 Write/Erase Cycles

1,2,1,7

256000

262.144 k

ASYNCHRONOUS

PARALLEL

3 V

YES

5 µA

35 µA

3.6 V

2.7 V

CMOS

INDUSTRIAL

YES

NOR TYPE

R-PDSO-G44

Not Qualified

85 °C

-40 °C

260

PLASTIC/EPOXY

SOP

SOP44,.63

RECTANGULAR

SMALL OUTLINE

YES

TIN LEAD

GULL WING

1.27 mm

DUAL

2.8 mm

28.2 mm

13.3 mm

SPANSION INC

QFP

MO-108AA, SOP-44

compliant

EAR99

8542.32.00.51

Check for Price

Yes

Transferred

4.1943 Mbit

16K,8K,32K,64K

256KX16

70 ns

FLASH

TOP

YES

1000000 Write/Erase Cycles

1,2,1,7

256000

262.144 k

PARALLEL

YES

5 µA

35 µA

CMOS

AUTOMOTIVE

YES

NOR TYPE

R-PDSO-G48

Not Qualified

125 °C

-40 °C

PLASTIC/EPOXY

TSSOP

TSSOP48,.8,20

RECTANGULAR

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

YES

GULL WING

500 µm

DUAL

ADVANCED MICRO DEVICES INC

unknown

EAR99

8542.32.00.51

1 2 3 4 5 Next

Compare

S29AL004D55BANR20

Spansion

Check for Price

Obsolete

4.1943 Mbit

16K,8K,32K,64K

256KX16

3.3 V

55 ns

FLASH

ALSO CONFIGURABLE AS 512K X 8; BOTTOM BOOT BLOCK

BOTTOM

YES

1000000 Write/Erase Cycles

1,2,1,7

256000

262.144 k

ASYNCHRONOUS

PARALLEL

3 V

YES

5 µA

35 µA

3.6 V

3 V

CMOS

AUTOMOTIVE

YES

NOR TYPE

R-PBGA-B48

Not Qualified

125 °C

-40 °C

260

PLASTIC/EPOXY

VFBGA

BGA48,6X8,32

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

YES

TIN LEAD

BALL

800 µm

BOTTOM

1 mm

8.15 mm

6.15 mm

SPANSION INC

BGA

VFBGA, BGA48,6X8,32

not_compliant

EAR99

8542.32.00.51

S29AL004D90TAF023

Spansion

Check for Price

Obsolete

4.1943 Mbit

256KX16

3 V

90 ns

FLASH

ALSO CONFIGURABLE AS 512K X 8; BOTTOM BOOT BLOCK

BOTTOM

256000

262.144 k

ASYNCHRONOUS

PARALLEL

3 V

3.6 V

2.7 V

CMOS

INDUSTRIAL

NOR TYPE

R-PDSO-G48

Not Qualified

85 °C

-40 °C

NOT SPECIFIED

PLASTIC/EPOXY

TSSOP

RECTANGULAR

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

YES

GULL WING

500 µm

DUAL

1.2 mm

18.4 mm

12 mm

SPANSION INC

TSOP1

TSSOP,

unknown

EAR99

8542.32.00.51

S29AL004D70BAI013

Cypress Semiconductor

Check for Price

Obsolete

4.1943 Mbit

256KX16

3 V

70 ns

FLASH

ALSO CONFIGURABLE AS 512K X 8; TOP BOOT BLOCK

TOP

256000

262.144 k

ASYNCHRONOUS

PARALLEL

3 V

3.6 V

2.7 V

CMOS

INDUSTRIAL

NOR TYPE

R-PBGA-B48

85 °C

-40 °C

260

PLASTIC/EPOXY

VFBGA

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

YES

TIN LEAD

BALL

800 µm

BOTTOM

1 mm

8.15 mm

6.15 mm

CYPRESS SEMICONDUCTOR CORP

FBGA-48

compliant

EAR99

8542.32.00.51

S29AL004D90BFN022

Cypress Semiconductor

Check for Price

Yes

Obsolete

4.1943 Mbit

256KX16

3 V

90 ns

FLASH

ALSO CONFIGURABLE AS 512K X 8; BOTTOM BOOT BLOCK

BOTTOM

256000

262.144 k

ASYNCHRONOUS

PARALLEL

3 V

3.6 V

2.7 V

CMOS

AUTOMOTIVE

NOR TYPE

R-PBGA-B48

125 °C

-40 °C

260

PLASTIC/EPOXY

VFBGA

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

YES

TIN SILVER COPPER

BALL

800 µm

BOTTOM

1 mm

8.15 mm

6.15 mm

CYPRESS SEMICONDUCTOR CORP

FBGA-48

compliant

EAR99

8542.32.00.51

S29AL004D55BFI010

Cypress Semiconductor

Check for Price

Yes

Obsolete

4.1943 Mbit

256KX16

3 V

55 ns

FLASH

ALSO CONFIGURABLE AS 512K X 8; TOP BOOT BLOCK

TOP

256000

262.144 k

ASYNCHRONOUS

PARALLEL

3 V

3.6 V

2.7 V

CMOS

INDUSTRIAL

NOR TYPE

R-PBGA-B48

85 °C

-40 °C

260

PLASTIC/EPOXY

VFBGA

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

YES

TIN SILVER COPPER

BALL

800 µm

BOTTOM

1 mm

8.15 mm

6.15 mm

CYPRESS SEMICONDUCTOR CORP

FBGA-48

compliant

EAR99

8542.32.00.51

S29AL004D55MANR13

Spansion

Check for Price

Obsolete

4.1943 Mbit

16K,8K,32K,64K

256KX16

3.3 V

55 ns

FLASH

ALSO CONFIGURABLE AS 512K X 8; TOP BOOT BLOCK

TOP

YES

1000000 Write/Erase Cycles

1,2,1,7

256000

262.144 k

ASYNCHRONOUS

PARALLEL

3 V

YES

5 µA

35 µA

3.6 V

3 V

CMOS

AUTOMOTIVE

YES

NOR TYPE

R-PDSO-G44

Not Qualified

125 °C

-40 °C

260

PLASTIC/EPOXY

SOP

SOP44,.63

RECTANGULAR

SMALL OUTLINE

YES

TIN LEAD

GULL WING

1.27 mm

DUAL

2.8 mm

28.2 mm

13.3 mm

SPANSION INC

QFP

MO-108AA, SOP-44

compliant

EAR99

8542.32.00.51

S29AL004D70BFN022

AMD

Check for Price

Yes

Transferred

4.1943 Mbit

16K,8K,32K,64K

256KX16

70 ns

FLASH

BOTTOM

YES

1000000 Write/Erase Cycles

1,2,1,7

256000

262.144 k

PARALLEL

YES

5 µA

35 µA

CMOS

AUTOMOTIVE

YES

NOR TYPE

R-PBGA-B48

Not Qualified

125 °C

-40 °C

PLASTIC/EPOXY

FBGA

BGA48,6X8,32

RECTANGULAR

GRID ARRAY, FINE PITCH

YES

BALL

800 µm

BOTTOM

ADVANCED MICRO DEVICES INC

unknown

EAR99

8542.32.00.51

S29AL004D70BFI022

Spansion

Check for Price

Yes

Obsolete

4.1943 Mbit

16K,8K,32K,64K

256KX16

3 V

70 ns

FLASH

ALSO CONFIGURABLE AS 512K X 8; BOTTOM BOOT BLOCK

BOTTOM

YES

1000000 Write/Erase Cycles

1,2,1,7

256000

262.144 k

ASYNCHRONOUS

PARALLEL

3 V

YES

5 µA

35 µA

3.6 V

2.7 V

CMOS

INDUSTRIAL

YES

NOR TYPE

R-PBGA-B48

Not Qualified

85 °C

-40 °C

260

PLASTIC/EPOXY

VFBGA

BGA48,6X8,32

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

YES

Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

BALL

800 µm

BOTTOM

1 mm

8.15 mm

6.15 mm

SPANSION INC

BGA

8.15 X 6.15 MM, LEAD FREE, FBGA-48

compliant

EAR99

8542.32.00.51

S29AL004D70MAI013

Spansion

Check for Price

Obsolete

4.1943 Mbit

16K,8K,32K,64K

256KX16

3 V

70 ns

FLASH

ALSO CONFIGURABLE AS 512K X 8; TOP BOOT BLOCK

TOP

YES

1000000 Write/Erase Cycles

1,2,1,7

256000

262.144 k

ASYNCHRONOUS

PARALLEL

3 V

YES

5 µA

35 µA

3.6 V

2.7 V

CMOS

INDUSTRIAL

YES

NOR TYPE

R-PDSO-G44

Not Qualified

85 °C

-40 °C

260

PLASTIC/EPOXY

SOP

SOP44,.63

RECTANGULAR

SMALL OUTLINE

YES

TIN LEAD

GULL WING

1.27 mm

DUAL

2.8 mm

28.2 mm

13.3 mm

SPANSION INC

QFP

MO-108AA, SOP-44

compliant

EAR99

8542.32.00.51

S29AL004D70TFN010

AMD

Check for Price

Yes

Transferred

4.1943 Mbit

16K,8K,32K,64K

256KX16

70 ns

FLASH

TOP

YES

1000000 Write/Erase Cycles

1,2,1,7

256000

262.144 k

PARALLEL

YES

5 µA

35 µA

CMOS

AUTOMOTIVE

YES

NOR TYPE

R-PDSO-G48

Not Qualified

125 °C

-40 °C

PLASTIC/EPOXY

TSSOP

TSSOP48,.8,20

RECTANGULAR

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

YES

GULL WING

500 µm

DUAL

ADVANCED MICRO DEVICES INC

unknown

EAR99

8542.32.00.51

1 2 3 4 5 Next