Findchips: Parametric Search Results for s71ns128jc0

Parametric results for: s71ns128jc0 under Other Memory ICs

Select parts from the table below to compare.

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Select Parts		Part Number

		S71NS128JC0BFWVN0 AMD
		S71NS128JC0BFWVP0 Spansion
		S71NS128JC0BFWVN0 Spansion
		S71NS128JC0BFWVN3 AMD
		S71NS128JC0BFWVP0 AMD
		S71NS128JC0BFWVN2 Spansion
		S71NS128JC0BFWVP2 AMD
		S71NS128JC0BFWVN2 AMD
		S71NS128JC0BFWVP2 Spansion
		S71NS128JC0BFWVN3 Spansion

			Most Relevant					Technical													Compliance			Operating Conditions		Physical											Dimensions			Other
Composite Price	Rohs Code	Part Life Cycle Code	Memory Density	Memory Width	Organization	Supply Voltage-Nom (Vsup)	Access Time-Max	Memory IC Type	Additional Feature	Mixed Memory Type	Number of Functions	Number of Words Code	Number of Words	Operating Mode	Standby Current-Max	Supply Current-Max	Supply Voltage-Max (Vsup)	Supply Voltage-Min (Vsup)	Technology	Temperature Grade	JESD-30 Code	Qualification Status	JESD-609 Code	Operating Temperature-Max	Operating Temperature-Min	Number of Terminals	Package Body Material	Package Code	Package Equivalence Code	Package Shape	Package Style	Surface Mount	Terminal Finish	Terminal Form	Terminal Pitch	Terminal Position	Seated Height-Max	Length	Width	Ihs Manufacturer	Package Description	Reach Compliance Code	ECCN Code	HTS Code	Part Package Code	Pin Count

Check for Price

Yes

Active

1.8 V

87.5 ns

MEMORY CIRCUIT

FLASH+PSRAM

120 µA

35 µA

CMOS

OTHER

R-PBGA-B60

Not Qualified

85 °C

-20 °C

PLASTIC/EPOXY

FBGA

BGA60,14X18,20

RECTANGULAR

GRID ARRAY, FINE PITCH

YES

BALL

500 µm

BOTTOM

ADVANCED MICRO DEVICES INC

FBGA, BGA60,14X18,20

compliant

EAR99

8542.32.00.71

Check for Price

Yes

Obsolete

134.2177 Mbit

8MX16

1.8 V

MEMORY CIRCUIT

CELLULARRAM IS ORGANIZED AS 4M X 16

8000000

8.3886 M

ASYNCHRONOUS

1.95 V

1.7 V

CMOS

OTHER

R-PBGA-B60

Not Qualified

85 °C

-25 °C

PLASTIC/EPOXY

TFBGA

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

TIN SILVER COPPER

BALL

500 µm

BOTTOM

1.2 mm

10.95 mm

9.95 mm

SPANSION INC

TFBGA,

compliant

EAR99

8542.32.00.71

BGA

Check for Price

Yes

Obsolete

134.2177 Mbit

8MX16

1.8 V

MEMORY CIRCUIT

CELLULARRAM IS ORGANIZED AS 4M X 16

8000000

8.3886 M

ASYNCHRONOUS

1.95 V

1.7 V

CMOS

OTHER

R-PBGA-B60

Not Qualified

85 °C

-25 °C

PLASTIC/EPOXY

TFBGA

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

TIN SILVER COPPER

BALL

500 µm

BOTTOM

1.2 mm

10.95 mm

9.95 mm

SPANSION INC

TFBGA,

compliant

EAR99

8542.32.00.71

BGA

Check for Price

Yes

Active

1.8 V

87.5 ns

MEMORY CIRCUIT

FLASH+PSRAM

120 µA

35 µA

CMOS

OTHER

R-PBGA-B60

Not Qualified

85 °C

-20 °C

PLASTIC/EPOXY

FBGA

BGA60,14X18,20

RECTANGULAR

GRID ARRAY, FINE PITCH

YES

BALL

500 µm

BOTTOM

ADVANCED MICRO DEVICES INC

FBGA, BGA60,14X18,20

compliant

EAR99

8542.32.00.71

Check for Price

Yes

Active

1.8 V

87.5 ns

MEMORY CIRCUIT

FLASH+PSRAM

120 µA

35 µA

CMOS

OTHER

R-PBGA-B60

Not Qualified

85 °C

-20 °C

PLASTIC/EPOXY

FBGA

BGA60,14X18,20

RECTANGULAR

GRID ARRAY, FINE PITCH

YES

BALL

500 µm

BOTTOM

ADVANCED MICRO DEVICES INC

FBGA, BGA60,14X18,20

compliant

EAR99

8542.32.00.71

Check for Price

Yes

Obsolete

134.2177 Mbit

8MX16

1.8 V

MEMORY CIRCUIT

CELLULARRAM IS ORGANIZED AS 4M X 16

8000000

8.3886 M

ASYNCHRONOUS

1.95 V

1.7 V

CMOS

OTHER

R-PBGA-B60

Not Qualified

85 °C

-25 °C

PLASTIC/EPOXY

TFBGA

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

TIN SILVER COPPER

BALL

500 µm

BOTTOM

1.2 mm

10.95 mm

9.95 mm

SPANSION INC

TFBGA,

compliant

EAR99

8542.32.00.71

BGA

Check for Price

Yes

Active

1.8 V

87.5 ns

MEMORY CIRCUIT

FLASH+PSRAM

120 µA

35 µA

CMOS

OTHER

R-PBGA-B60

Not Qualified

85 °C

-20 °C

PLASTIC/EPOXY

FBGA

BGA60,14X18,20

RECTANGULAR

GRID ARRAY, FINE PITCH

YES

BALL

500 µm

BOTTOM

ADVANCED MICRO DEVICES INC

FBGA, BGA60,14X18,20

compliant

EAR99

8542.32.00.71

Check for Price

Yes

Active

1.8 V

87.5 ns

MEMORY CIRCUIT

FLASH+PSRAM

120 µA

35 µA

CMOS

OTHER

R-PBGA-B60

Not Qualified

85 °C

-20 °C

PLASTIC/EPOXY

FBGA

BGA60,14X18,20

RECTANGULAR

GRID ARRAY, FINE PITCH

YES

BALL

500 µm

BOTTOM

ADVANCED MICRO DEVICES INC

FBGA, BGA60,14X18,20

compliant

EAR99

8542.32.00.71

Check for Price

Yes

Obsolete

134.2177 Mbit

8MX16

1.8 V

MEMORY CIRCUIT

CELLULARRAM IS ORGANIZED AS 4M X 16

8000000

8.3886 M

ASYNCHRONOUS

1.95 V

1.7 V

CMOS

OTHER

R-PBGA-B60

Not Qualified

85 °C

-25 °C

PLASTIC/EPOXY

TFBGA

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

TIN SILVER COPPER

BALL

500 µm

BOTTOM

1.2 mm

10.95 mm

9.95 mm

SPANSION INC

TFBGA,

compliant

EAR99

8542.32.00.71

BGA

Check for Price

Yes

Obsolete

134.2177 Mbit

8MX16

1.8 V

MEMORY CIRCUIT

CELLULARRAM IS ORGANIZED AS 4M X 16

8000000

8.3886 M

ASYNCHRONOUS

1.95 V

1.7 V

CMOS

OTHER

R-PBGA-B60

Not Qualified

85 °C

-25 °C

PLASTIC/EPOXY

TFBGA

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

TIN SILVER COPPER

BALL

500 µm

BOTTOM

1.2 mm

10.95 mm

9.95 mm

SPANSION INC

TFBGA,

compliant

EAR99

8542.32.00.71

BGA

1 2 Next

Compare

S71NS128JC0BFWVN0

AMD

Check for Price

Yes

Active

1.8 V

87.5 ns

MEMORY CIRCUIT

FLASH+PSRAM

120 µA

35 µA

CMOS

OTHER

R-PBGA-B60

Not Qualified

85 °C

-20 °C

PLASTIC/EPOXY

FBGA

BGA60,14X18,20

RECTANGULAR

GRID ARRAY, FINE PITCH

YES

BALL

500 µm

BOTTOM

ADVANCED MICRO DEVICES INC

FBGA, BGA60,14X18,20

compliant

EAR99

8542.32.00.71

S71NS128JC0BFWVP0

Spansion

Check for Price

Yes

Obsolete

134.2177 Mbit

8MX16

1.8 V

MEMORY CIRCUIT

CELLULARRAM IS ORGANIZED AS 4M X 16

8000000

8.3886 M

ASYNCHRONOUS

1.95 V

1.7 V

CMOS

OTHER

R-PBGA-B60

Not Qualified

85 °C

-25 °C

PLASTIC/EPOXY

TFBGA

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

TIN SILVER COPPER

BALL

500 µm

BOTTOM

1.2 mm

10.95 mm

9.95 mm

SPANSION INC

TFBGA,

compliant

EAR99

8542.32.00.71

BGA

S71NS128JC0BFWVN0

Spansion

Check for Price

Yes

Obsolete

134.2177 Mbit

8MX16

1.8 V

MEMORY CIRCUIT

CELLULARRAM IS ORGANIZED AS 4M X 16

8000000

8.3886 M

ASYNCHRONOUS

1.95 V

1.7 V

CMOS

OTHER

R-PBGA-B60

Not Qualified

85 °C

-25 °C

PLASTIC/EPOXY

TFBGA

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

TIN SILVER COPPER

BALL

500 µm

BOTTOM

1.2 mm

10.95 mm

9.95 mm

SPANSION INC

TFBGA,

compliant

EAR99

8542.32.00.71

BGA

S71NS128JC0BFWVN3

AMD

Check for Price

Yes

Active

1.8 V

87.5 ns

MEMORY CIRCUIT

FLASH+PSRAM

120 µA

35 µA

CMOS

OTHER

R-PBGA-B60

Not Qualified

85 °C

-20 °C

PLASTIC/EPOXY

FBGA

BGA60,14X18,20

RECTANGULAR

GRID ARRAY, FINE PITCH

YES

BALL

500 µm

BOTTOM

ADVANCED MICRO DEVICES INC

FBGA, BGA60,14X18,20

compliant

EAR99

8542.32.00.71

S71NS128JC0BFWVP0

AMD

Check for Price

Yes

Active

1.8 V

87.5 ns

MEMORY CIRCUIT

FLASH+PSRAM

120 µA

35 µA

CMOS

OTHER

R-PBGA-B60

Not Qualified

85 °C

-20 °C

PLASTIC/EPOXY

FBGA

BGA60,14X18,20

RECTANGULAR

GRID ARRAY, FINE PITCH

YES

BALL

500 µm

BOTTOM

ADVANCED MICRO DEVICES INC

FBGA, BGA60,14X18,20

compliant

EAR99

8542.32.00.71

S71NS128JC0BFWVN2

Spansion

Check for Price

Yes

Obsolete

134.2177 Mbit

8MX16

1.8 V

MEMORY CIRCUIT

CELLULARRAM IS ORGANIZED AS 4M X 16

8000000

8.3886 M

ASYNCHRONOUS

1.95 V

1.7 V

CMOS

OTHER

R-PBGA-B60

Not Qualified

85 °C

-25 °C

PLASTIC/EPOXY

TFBGA

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

TIN SILVER COPPER

BALL

500 µm

BOTTOM

1.2 mm

10.95 mm

9.95 mm

SPANSION INC

TFBGA,

compliant

EAR99

8542.32.00.71

BGA

S71NS128JC0BFWVP2

AMD

Check for Price

Yes

Active

1.8 V

87.5 ns

MEMORY CIRCUIT

FLASH+PSRAM

120 µA

35 µA

CMOS

OTHER

R-PBGA-B60

Not Qualified

85 °C

-20 °C

PLASTIC/EPOXY

FBGA

BGA60,14X18,20

RECTANGULAR

GRID ARRAY, FINE PITCH

YES

BALL

500 µm

BOTTOM

ADVANCED MICRO DEVICES INC

FBGA, BGA60,14X18,20

compliant

EAR99

8542.32.00.71

S71NS128JC0BFWVN2

AMD

Check for Price

Yes

Active

1.8 V

87.5 ns

MEMORY CIRCUIT

FLASH+PSRAM

120 µA

35 µA

CMOS

OTHER

R-PBGA-B60

Not Qualified

85 °C

-20 °C

PLASTIC/EPOXY

FBGA

BGA60,14X18,20

RECTANGULAR

GRID ARRAY, FINE PITCH

YES

BALL

500 µm

BOTTOM

ADVANCED MICRO DEVICES INC

FBGA, BGA60,14X18,20

compliant

EAR99

8542.32.00.71

S71NS128JC0BFWVP2

Spansion

Check for Price

Yes

Obsolete

134.2177 Mbit

8MX16

1.8 V

MEMORY CIRCUIT

CELLULARRAM IS ORGANIZED AS 4M X 16

8000000

8.3886 M

ASYNCHRONOUS

1.95 V

1.7 V

CMOS

OTHER

R-PBGA-B60

Not Qualified

85 °C

-25 °C

PLASTIC/EPOXY

TFBGA

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

TIN SILVER COPPER

BALL

500 µm

BOTTOM

1.2 mm

10.95 mm

9.95 mm

SPANSION INC

TFBGA,

compliant

EAR99

8542.32.00.71

BGA

S71NS128JC0BFWVN3

Spansion

Check for Price

Yes

Obsolete

134.2177 Mbit

8MX16

1.8 V

MEMORY CIRCUIT

CELLULARRAM IS ORGANIZED AS 4M X 16

8000000

8.3886 M

ASYNCHRONOUS

1.95 V

1.7 V

CMOS

OTHER

R-PBGA-B60

Not Qualified

85 °C

-25 °C

PLASTIC/EPOXY

TFBGA

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

TIN SILVER COPPER

BALL

500 µm

BOTTOM

1.2 mm

10.95 mm

9.95 mm

SPANSION INC

TFBGA,

compliant

EAR99

8542.32.00.71

BGA

1 2 Next