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SST39WF1601-70-4I-MAQE
Microchip Technology Inc
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$2.9300 | Yes | Active | 16.7772 Mbit | 16 | 2K | 1MX16 | 1.8 V | 70 ns | FLASH | BOTTOM BOOT-BLOCK | BOTTOM | YES | YES | YES | 100 | 100000 Write/Erase Cycles | 1 | 1 | 512 | 1000000 | 1.0486 M | ASYNCHRONOUS | 3-STATE | PARALLEL | 1.8 V | 40 µA | 25 µA | 1.95 V | 1.65 V | CMOS | INDUSTRIAL | YES | NOR TYPE | R-PBGA-B48 | Not Qualified | e1 | 3 | 85 °C | -40 °C | 260 | 40 | 48 | PLASTIC/EPOXY | VFBGA | BGA48,6X11,20 | RECTANGULAR | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | YES | Tin/Silver/Copper (Sn/Ag/Cu) | BALL | 500 µm | BOTTOM | 730 µm | 6 mm | 4 mm | MICROCHIP TECHNOLOGY INC | DSBGA | 4 X 6 MM, ROHS COMPLIANT, MO-207CB-4, WFBGA-48 | 48 | compliant | 3A991.B.1.A | 8542.32.00.51 | Microchip | |||
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SST39WF1602-70-4I-B3KE
Microchip Technology Inc
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$2.9300 | Yes | Yes | Active | 16.7772 Mbit | 16 | 2K | 1MX16 | 1.8 V | 70 ns | FLASH | TOP BOOT-BLOCK | TOP | YES | YES | YES | 100 | 100000 Write/Erase Cycles | 1 | 1 | 512 | 1000000 | 1.0486 M | ASYNCHRONOUS | 3-STATE | PARALLEL | 1.8 V | 40 µA | 25 µA | 1.95 V | 1.65 V | CMOS | INDUSTRIAL | YES | NOR TYPE | R-PBGA-B48 | Not Qualified | e1 | 3 | 85 °C | -40 °C | 260 | 40 | 48 | PLASTIC/EPOXY | TFBGA | BGA48,6X8,32 | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | YES | Tin/Silver/Copper (Sn/Ag/Cu) | BALL | 800 µm | BOTTOM | 1.2 mm | 8 mm | 6 mm | MICROCHIP TECHNOLOGY INC | BGA | 6 X 8 MM, ROHS COMPLIANT, MO-210AB-1, TFBGA-48 | 48 | compliant | EAR99 | 8542.32.00.51 | |||
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SST39WF1601-70-4I-B3KE
Microchip Technology Inc
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$2.9300 | Yes | Yes | Active | 16.7772 Mbit | 16 | 2K | 1MX16 | 1.8 V | 70 ns | FLASH | BOTTOM BOOT-BLOCK | BOTTOM | YES | YES | YES | 100 | 100000 Write/Erase Cycles | 1 | 1 | 512 | 1000000 | 1.0486 M | ASYNCHRONOUS | 3-STATE | PARALLEL | 1.8 V | 40 µA | 25 µA | 1.95 V | 1.65 V | CMOS | INDUSTRIAL | YES | NOR TYPE | R-PBGA-B48 | Not Qualified | e1 | 3 | 85 °C | -40 °C | 260 | 40 | 48 | PLASTIC/EPOXY | TFBGA | BGA48,6X8,32 | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | YES | Tin/Silver/Copper (Sn/Ag/Cu) | BALL | 800 µm | BOTTOM | 1.2 mm | 8 mm | 6 mm | MICROCHIP TECHNOLOGY INC | BGA | 6 X 8 MM, ROHS COMPLIANT, MO-210AB-1, TFBGA-48 | 48 | compliant | 3A991.B.1.A | 8542.32.00.51 | Microchip | ||
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SST39WF1602-70-4C-B3KE-T
Microchip Technology Inc
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$2.9300 | Yes | Active | 16.7772 Mbit | 16 | 2K | 1MX16 | 1.8 V | 70 ns | FLASH | TOP BOOT-BLOCK | TOP | YES | YES | YES | 100 | 100000 Write/Erase Cycles | 1 | 1 | 512 | 1000000 | 1.0486 M | ASYNCHRONOUS | 3-STATE | PARALLEL | 1.8 V | 40 µA | 25 µA | 1.95 V | 1.65 V | CMOS | COMMERCIAL | YES | NOR TYPE | R-PBGA-B48 | Not Qualified | 70 °C | 48 | PLASTIC/EPOXY | FBGA | BGA48,6X8,32 | RECTANGULAR | GRID ARRAY, FINE PITCH | YES | BALL | 800 µm | BOTTOM | 1.2 mm | 8 mm | 6 mm | MICROCHIP TECHNOLOGY INC | compliant | 3A991.B.1.A | 8542.32.00.51 | |||||||||||||
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SST39WF1602-70-4C-B3KE
Microchip Technology Inc
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$2.9300 | Yes | Yes | Active | 16.7772 Mbit | 16 | 2K | 1MX16 | 1.8 V | 70 ns | FLASH | TOP BOOT-BLOCK | TOP | YES | YES | YES | 100 | 100000 Write/Erase Cycles | 1 | 1 | 512 | 1000000 | 1.0486 M | ASYNCHRONOUS | 3-STATE | PARALLEL | 1.8 V | 40 µA | 25 µA | 1.95 V | 1.65 V | CMOS | COMMERCIAL | YES | NOR TYPE | R-PBGA-B48 | Not Qualified | e1 | 3 | 70 °C | 260 | 40 | 48 | PLASTIC/EPOXY | TFBGA | BGA48,6X8,32 | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | YES | Tin/Silver/Copper (Sn/Ag/Cu) | BALL | 800 µm | BOTTOM | 1.2 mm | 8 mm | 6 mm | MICROCHIP TECHNOLOGY INC | BGA | 6 X 8 MM, ROHS COMPLIANT, MO-210AB-1, TFBGA-48 | 48 | compliant | EAR99 | 8542.32.00.51 | Microchip | |||
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SST39WF1602-70-4I-B3KE-T
Microchip Technology Inc
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$2.9300 | Yes | Active | 16.7772 Mbit | 16 | 2K | 1MX16 | 1.8 V | 70 ns | FLASH | TOP BOOT-BLOCK | TOP | YES | YES | YES | 100 | 100000 Write/Erase Cycles | 1 | 1 | 512 | 1000000 | 1.0486 M | ASYNCHRONOUS | 3-STATE | PARALLEL | 1.8 V | 40 µA | 25 µA | 1.95 V | 1.65 V | CMOS | INDUSTRIAL | YES | NOR TYPE | R-PBGA-B48 | Not Qualified | 85 °C | -40 °C | 48 | PLASTIC/EPOXY | FBGA | BGA48,6X8,32 | RECTANGULAR | GRID ARRAY, FINE PITCH | YES | BALL | 800 µm | BOTTOM | 1.2 mm | 8 mm | 6 mm | MICROCHIP TECHNOLOGY INC | compliant | EAR99 | 8542.32.00.51 | Microchip | |||||||||||
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SST39WF1601-70-4I-MAQE-T
Microchip Technology Inc
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$2.9300 | Yes | Active | 16.7772 Mbit | 16 | 2K | 1MX16 | 1.8 V | 70 ns | FLASH | BOTTOM BOOT-BLOCK | BOTTOM | YES | YES | YES | 100 | 100000 Write/Erase Cycles | 1 | 1 | 512 | 1000000 | 1.0486 M | ASYNCHRONOUS | 3-STATE | PARALLEL | 1.8 V | 40 µA | 25 µA | 1.95 V | 1.65 V | CMOS | INDUSTRIAL | YES | NOR TYPE | R-PBGA-B48 | Not Qualified | 85 °C | -40 °C | 48 | PLASTIC/EPOXY | FBGA | BGA48,6X11,20 | RECTANGULAR | GRID ARRAY, FINE PITCH | YES | BALL | 500 µm | BOTTOM | 730 µm | 6 mm | 4 mm | MICROCHIP TECHNOLOGY INC | compliant | 3A991.B.1.A | 8542.32.00.51 | ||||||||||||
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SST39WF1601-70-4C-B3KE
Microchip Technology Inc
|
$2.9300 | Yes | Yes | Active | 16.7772 Mbit | 16 | 2K | 1MX16 | 1.8 V | 70 ns | FLASH | BOTTOM BOOT-BLOCK | BOTTOM | YES | YES | YES | 100 | 100000 Write/Erase Cycles | 1 | 1 | 512 | 1000000 | 1.0486 M | ASYNCHRONOUS | 3-STATE | PARALLEL | 1.8 V | 40 µA | 25 µA | 1.95 V | 1.65 V | CMOS | COMMERCIAL | YES | NOR TYPE | R-PBGA-B48 | Not Qualified | e1 | 3 | 70 °C | 260 | 40 | 48 | PLASTIC/EPOXY | TFBGA | BGA48,6X8,32 | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | YES | Tin/Silver/Copper (Sn/Ag/Cu) | BALL | 800 µm | BOTTOM | 1.2 mm | 8 mm | 6 mm | MICROCHIP TECHNOLOGY INC | BGA | 6 X 8 MM, ROHS COMPLIANT, MO-210AB-1, TFBGA-48 | 48 | compliant | 3A991.B.1.A | 8542.32.00.51 | Microchip | |||
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SST39WF1601-70-4C-MAQE-T
Microchip Technology Inc
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$2.9300 | Yes | Active | 16.7772 Mbit | 16 | 2K | 1MX16 | 1.8 V | 70 ns | FLASH | BOTTOM BOOT-BLOCK | BOTTOM | YES | YES | YES | 100 | 100000 Write/Erase Cycles | 1 | 1 | 512 | 1000000 | 1.0486 M | ASYNCHRONOUS | 3-STATE | PARALLEL | 1.8 V | 40 µA | 25 µA | 1.95 V | 1.65 V | CMOS | COMMERCIAL | YES | NOR TYPE | R-PBGA-B48 | Not Qualified | 70 °C | 48 | PLASTIC/EPOXY | FBGA | BGA48,6X11,20 | RECTANGULAR | GRID ARRAY, FINE PITCH | YES | BALL | 500 µm | BOTTOM | 730 µm | 6 mm | 4 mm | MICROCHIP TECHNOLOGY INC | compliant | 3A991.B.1.A | 8542.32.00.51 | |||||||||||||
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SST39WF1601-70-4C-MAQE
Microchip Technology Inc
|
$2.9300 | Yes | Active | 16.7772 Mbit | 16 | 2K | 1MX16 | 1.8 V | 70 ns | FLASH | BOTTOM BOOT-BLOCK | BOTTOM | YES | YES | YES | 100 | 100000 Write/Erase Cycles | 1 | 1 | 512 | 1000000 | 1.0486 M | ASYNCHRONOUS | 3-STATE | PARALLEL | 1.8 V | 40 µA | 25 µA | 1.95 V | 1.65 V | CMOS | COMMERCIAL | YES | NOR TYPE | R-PBGA-B48 | Not Qualified | e1 | 3 | 70 °C | 260 | 40 | 48 | PLASTIC/EPOXY | VFBGA | BGA48,6X11,20 | RECTANGULAR | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | YES | Tin/Silver/Copper (Sn/Ag/Cu) | BALL | 500 µm | BOTTOM | 730 µm | 6 mm | 4 mm | MICROCHIP TECHNOLOGY INC | DSBGA | 4 X 6 MM, ROHS COMPLIANT, MO-207CB-4, WFBGA-48 | 48 | compliant | EAR99 | 8542.32.00.51 | Microchip |