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Manufacturer Part Number: tms320c670
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package
TMS320C6701GJC150
 Texas Instruments 		$91.2940 Yes No Active 32 16384 32 22 149.25 MHz 2 YES 1.8 V DIGITAL SIGNAL PROCESSOR, OTHER CMOS ALSO REQUIRES 3.3V SUPPLY NO YES FLOATING POINT YES MULTIPLE YES 4 4 1.89 V 1.71 V OTHER S-PBGA-B352 Not Qualified e0 4 90 °C 220 20 352 PLASTIC/EPOXY HBGA BGA352,26X26,50 SQUARE GRID ARRAY, HEAT SINK/SLUG Tin/Lead (Sn/Pb) BALL 1.27 mm BOTTOM 3.5 mm 35 mm 35 mm BGA HBGA, BGA352,26X26,50 352 Not Compliant 3A991.A.2 8542.31.00.35 1999-02-01
package
TMS320C6701GJCA120
 Texas Instruments 		$102.6551 No Obsolete 32 16384 32 22 120.48 MHz 2 YES 1.8 V DIGITAL SIGNAL PROCESSOR, OTHER CMOS ALSO REQUIRES 3.3V SUPPLY NO YES FLOATING POINT YES MULTIPLE YES 4 4 1.89 V 1.71 V INDUSTRIAL S-PBGA-B352 Not Qualified e0 4 105 °C -40 °C 220 20 352 PLASTIC/EPOXY HBGA BGA352,26X26,50 SQUARE GRID ARRAY, HEAT SINK/SLUG TIN LEAD BALL 1.27 mm BOTTOM 3.5 mm 35 mm 35 mm BGA HBGA, BGA352,26X26,50 352 Not Compliant 3A991.A.2 8542.31.00.01 1999-02-01
package
TMSC6701GJC16719V
 Texas Instruments 		$135.3935 Yes No Active 32 16384 32 22 166.67 MHz 2 YES 1.9 V DIGITAL SIGNAL PROCESSOR, OTHER CMOS ALSO REQUIRES 3.3V SUPPLY NO YES FLOATING POINT YES MULTIPLE YES 4 4 1.99 V 1.81 V OTHER S-PBGA-B352 Not Qualified e0 4 90 °C 220 20 352 PLASTIC/EPOXY HBGA BGA352,26X26,50 SQUARE GRID ARRAY, HEAT SINK/SLUG Tin/Lead (Sn/Pb) BALL 1.27 mm BOTTOM 3.5 mm 35 mm 35 mm BGA HBGA, BGA352,26X26,50 352 Not Compliant 3A991.A.2 8542.31.00.35 1999-02-01
package
TMS320C6701GJC-167
 Texas Instruments 		Check for Price No No Obsolete 32 22 166.67 MHz YES 1.9 V DIGITAL SIGNAL PROCESSOR, OTHER CMOS ALSO REQUIRES 3.3V SUPPLY NO YES FLOATING POINT MULTIPLE YES 1.99 V 1.81 V OTHER S-PBGA-B352 Not Qualified e0 90 °C NOT SPECIFIED NOT SPECIFIED 352 PLASTIC/EPOXY HBGA SQUARE GRID ARRAY, HEAT SINK/SLUG TIN LEAD BALL 1.27 mm BOTTOM 3.5 mm 35 mm 35 mm BGA HBGA, 352 Unknown
package
TMS320C6701GJCA167
 Texas Instruments 		Check for Price Obsolete 32 32 32 167 MHz YES 3.3 V DIGITAL SIGNAL PROCESSOR, OTHER CMOS NO YES FLOATING POINT MULTIPLE YES 3.46 V 3.14 V S-PBGA-B352 Not Qualified 150 °C -55 °C 352 PLASTIC/EPOXY HBGA SQUARE GRID ARRAY, HEAT SINK/SLUG BALL 1.27 mm BOTTOM 3.5 mm 35 mm 35 mm BGA HBGA, 352 Unknown 3A991.a.2 8542.31.00.35
package
TMX320C6701GJC
 Texas Instruments 		Check for Price No No Obsolete 32 16384 32 22 167 MHz YES 3.3 V DIGITAL SIGNAL PROCESSOR, OTHER CMOS NO YES FLOATING POINT MULTIPLE YES 3.46 V 3.14 V S-PBGA-B352 Not Qualified NOT SPECIFIED NOT SPECIFIED 352 PLASTIC/EPOXY HBGA BGA352,26X26,50 SQUARE GRID ARRAY, HEAT SINK/SLUG BALL 1.27 mm BOTTOM 3.5 mm 35 mm 35 mm BGA HBGA, BGA352,26X26,50 352 Not Compliant 3A991.a.2 8542.31.00.35
package
TMS320C6701GJC-150
 Texas Instruments 		Check for Price No No Active 32 22 149.25 MHz YES 1.8 V DIGITAL SIGNAL PROCESSOR, OTHER CMOS ALSO REQUIRES 3.3V SUPPLY NO YES FLOATING POINT MULTIPLE YES 1.89 V 1.71 V OTHER S-PBGA-B352 Not Qualified e0 4 90 °C 220 NOT SPECIFIED 352 PLASTIC/EPOXY HBGA SQUARE GRID ARRAY, HEAT SINK/SLUG TIN LEAD BALL 1.27 mm BOTTOM 3.5 mm 35 mm 35 mm BGA HBGA, 352 Compliant
package
TMS320C6701GJC120
 Texas Instruments 		Check for Price Obsolete 32 32 32 120 MHz YES 3.3 V DIGITAL SIGNAL PROCESSOR, OTHER CMOS NO YES FLOATING POINT MULTIPLE YES 3.46 V 3.14 V S-PBGA-B352 Not Qualified 105 °C -40 °C 352 PLASTIC/EPOXY HBGA SQUARE GRID ARRAY, HEAT SINK/SLUG BALL 1.27 mm BOTTOM 3.5 mm 35 mm 35 mm BGA HBGA, 352 Unknown 3A991.a.2 8542.31.00.35
package
TMS320C6701GJC167
 Texas Instruments 		Check for Price No No Obsolete 32 16384 32 22 166.67 MHz YES 1.9 V DIGITAL SIGNAL PROCESSOR, OTHER CMOS ALSO REQUIRES 3.3V SUPPLY NO YES FLOATING POINT MULTIPLE YES 1.99 V 1.81 V S-PBGA-B352 Not Qualified NOT SPECIFIED NOT SPECIFIED 352 PLASTIC/EPOXY HBGA BGA352,26X26,50 SQUARE GRID ARRAY, HEAT SINK/SLUG BALL 1.27 mm BOTTOM 3.5 mm 35 mm 35 mm BGA HBGA, BGA352,26X26,50 352 Not Compliant 3A991.a.2 8542.31.00.35
package
TMS320C6701GJCA150
 Texas Instruments 		Check for Price Obsolete 32 32 32 150 MHz YES 3.3 V DIGITAL SIGNAL PROCESSOR, OTHER CMOS NO YES FLOATING POINT MULTIPLE YES 3.46 V 3.14 V S-PBGA-B352 Not Qualified 150 °C -55 °C 352 PLASTIC/EPOXY HBGA SQUARE GRID ARRAY, HEAT SINK/SLUG BALL 1.27 mm BOTTOM 3.5 mm 35 mm 35 mm BGA HBGA, 352 Unknown 3A991.a.2 8542.31.00.35