Findchips: Parametric Search Results for w26a02


Select Parts		Part Number

		W26A02B-70LI Winbond Electronics Corp
		W26A02H-70LE Winbond Electronics Corp
		W26A02B-70LE Winbond Electronics Corp
		W26A02H-70LI Winbond Electronics Corp

		Most Relevant					Technical														Compliance			Operating Conditions		Physical											Dimensions			Other
Composite Price	Part Life Cycle Code	Memory Density	Memory Width	Organization	Supply Voltage-Nom (Vsup)	Access Time-Max	Memory IC Type	I/O Type	Number of Functions	Number of Words Code	Number of Words	Operating Mode	Output Characteristics	Parallel/Serial	Standby Voltage-Min	Supply Current-Max	Supply Voltage-Max (Vsup)	Supply Voltage-Min (Vsup)	Technology	Temperature Grade	JESD-30 Code	Qualification Status	JESD-609 Code	Operating Temperature-Max	Operating Temperature-Min	Number of Terminals	Package Body Material	Package Code	Package Equivalence Code	Package Shape	Package Style	Surface Mount	Terminal Finish	Terminal Form	Terminal Pitch	Terminal Position	Seated Height-Max	Length	Width	Ihs Manufacturer	Part Package Code	Package Description	Pin Count	Reach Compliance Code	ECCN Code	HTS Code

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Obsolete

2.0972 Mbit

128KX16

1.8 V

70 ns

STANDARD SRAM

COMMON

128000

131.072 k

ASYNCHRONOUS

3-STATE

PARALLEL

1 V

25 µA

1.95 V

1.65 V

CMOS

INDUSTRIAL

R-PBGA-B48

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

TFBGA

BGA48,6X8,30

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

TIN SILVER COPPER

BALL

750 µm

BOTTOM

1.1 mm

8 mm

6 mm

WINBOND ELECTRONICS CORP

BGA

TFBGA, BGA48,6X8,30

unknown

3A991.B.2.A

8542.32.00.41

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Obsolete

2.0972 Mbit

128KX16

1.8 V

70 ns

STANDARD SRAM

COMMON

128000

131.072 k

ASYNCHRONOUS

3-STATE

PARALLEL

1 V

25 µA

1.95 V

1.65 V

CMOS

OTHER

R-PDSO-G44

Not Qualified

85 °C

-20 °C

PLASTIC/EPOXY

TSOP2

TSOP44,.46,32

RECTANGULAR

SMALL OUTLINE, THIN PROFILE

YES

MATTE TIN

GULL WING

800 µm

DUAL

1.2 mm

18.41 mm

10.16 mm

WINBOND ELECTRONICS CORP

TSOP2

TSOP2, TSOP44,.46,32

unknown

3A991.B.2.A

8542.32.00.41

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Obsolete

2.0972 Mbit

128KX16

1.8 V

70 ns

STANDARD SRAM

COMMON

128000

131.072 k

ASYNCHRONOUS

3-STATE

PARALLEL

1 V

25 µA

1.95 V

1.65 V

CMOS

OTHER

R-PBGA-B48

Not Qualified

85 °C

-20 °C

PLASTIC/EPOXY

TFBGA

BGA48,6X8,30

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

TIN SILVER COPPER

BALL

750 µm

BOTTOM

1.1 mm

8 mm

6 mm

WINBOND ELECTRONICS CORP

BGA

TFBGA, BGA48,6X8,30

unknown

3A991.B.2.A

8542.32.00.41

Check for Price

Obsolete

2.0972 Mbit

128KX16

1.8 V

70 ns

STANDARD SRAM

COMMON

128000

131.072 k

ASYNCHRONOUS

3-STATE

PARALLEL

1 V

25 µA

1.95 V

1.65 V

CMOS

INDUSTRIAL

R-PDSO-G44

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

TSOP2

TSOP44,.46,32

RECTANGULAR

SMALL OUTLINE, THIN PROFILE

YES

MATTE TIN

GULL WING

800 µm

DUAL

1.2 mm

18.41 mm

10.16 mm

WINBOND ELECTRONICS CORP

TSOP2

TSOP2, TSOP44,.46,32

unknown

3A991.B.2.A

8542.32.00.41

Compare

W26A02B-70LI

Winbond Electronics Corp

Check for Price

Obsolete

2.0972 Mbit

128KX16

1.8 V

70 ns

STANDARD SRAM

COMMON

128000

131.072 k

ASYNCHRONOUS

3-STATE

PARALLEL

1 V

25 µA

1.95 V

1.65 V

CMOS

INDUSTRIAL

R-PBGA-B48

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

TFBGA

BGA48,6X8,30

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

TIN SILVER COPPER

BALL

750 µm

BOTTOM

1.1 mm

8 mm

6 mm

WINBOND ELECTRONICS CORP

BGA

TFBGA, BGA48,6X8,30

unknown

3A991.B.2.A

8542.32.00.41

W26A02H-70LE

Winbond Electronics Corp

Check for Price

Obsolete

2.0972 Mbit

128KX16

1.8 V

70 ns

STANDARD SRAM

COMMON

128000

131.072 k

ASYNCHRONOUS

3-STATE

PARALLEL

1 V

25 µA

1.95 V

1.65 V

CMOS

OTHER

R-PDSO-G44

Not Qualified

85 °C

-20 °C

PLASTIC/EPOXY

TSOP2

TSOP44,.46,32

RECTANGULAR

SMALL OUTLINE, THIN PROFILE

YES

MATTE TIN

GULL WING

800 µm

DUAL

1.2 mm

18.41 mm

10.16 mm

WINBOND ELECTRONICS CORP

TSOP2

TSOP2, TSOP44,.46,32

unknown

3A991.B.2.A

8542.32.00.41

W26A02B-70LE

Winbond Electronics Corp

Check for Price

Obsolete

2.0972 Mbit

128KX16

1.8 V

70 ns

STANDARD SRAM

COMMON

128000

131.072 k

ASYNCHRONOUS

3-STATE

PARALLEL

1 V

25 µA

1.95 V

1.65 V

CMOS

OTHER

R-PBGA-B48

Not Qualified

85 °C

-20 °C

PLASTIC/EPOXY

TFBGA

BGA48,6X8,30

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

TIN SILVER COPPER

BALL

750 µm

BOTTOM

1.1 mm

8 mm

6 mm

WINBOND ELECTRONICS CORP

BGA

TFBGA, BGA48,6X8,30

unknown

3A991.B.2.A

8542.32.00.41

W26A02H-70LI

Winbond Electronics Corp

Check for Price

Obsolete

2.0972 Mbit

128KX16

1.8 V

70 ns

STANDARD SRAM

COMMON

128000

131.072 k

ASYNCHRONOUS

3-STATE

PARALLEL

1 V

25 µA

1.95 V

1.65 V

CMOS

INDUSTRIAL

R-PDSO-G44

Not Qualified

85 °C

-40 °C

PLASTIC/EPOXY

TSOP2

TSOP44,.46,32

RECTANGULAR

SMALL OUTLINE, THIN PROFILE

YES

MATTE TIN

GULL WING

800 µm

DUAL

1.2 mm

18.41 mm

10.16 mm

WINBOND ELECTRONICS CORP

TSOP2

TSOP2, TSOP44,.46,32

unknown

3A991.B.2.A

8542.32.00.41

Parametric results for: w26a02 under SRAMs