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Manufacturer Part Number: w26a04
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W26A04B-70LE
 Winbond Electronics Corp 		Check for Price Obsolete 4.1943 Mbit 16 256KX16 1.8 V 70 ns STANDARD SRAM COMMON 1 256000 262.144 k ASYNCHRONOUS 3-STATE PARALLEL 1 V 25 µA 1.95 V 1.65 V CMOS OTHER R-PBGA-B48 Not Qualified e1 85 °C -20 °C 48 PLASTIC/EPOXY TFBGA BGA48,6X8,30 RECTANGULAR GRID ARRAY, THIN PROFILE, FINE PITCH YES TIN SILVER COPPER BALL 750 µm BOTTOM 1.1 mm 8 mm 6 mm WINBOND ELECTRONICS CORP BGA TFBGA, BGA48,6X8,30 48 unknown 3A991.B.2.A 8542.32.00.41
W26A04H-70LI
 Winbond Electronics Corp 		Check for Price Obsolete 4.1943 Mbit 16 256KX16 1.8 V 70 ns STANDARD SRAM COMMON 1 256000 262.144 k ASYNCHRONOUS 3-STATE PARALLEL 1 V 25 µA 1.95 V 1.65 V CMOS INDUSTRIAL R-PDSO-G44 Not Qualified e3 85 °C -40 °C 44 PLASTIC/EPOXY TSOP2 TSOP44,.46,32 RECTANGULAR SMALL OUTLINE, THIN PROFILE YES MATTE TIN GULL WING 800 µm DUAL 1.2 mm 18.41 mm 10.16 mm WINBOND ELECTRONICS CORP TSOP2 TSOP2, TSOP44,.46,32 44 unknown 3A991.B.2.A 8542.32.00.41
W26A04H-70LE
 Winbond Electronics Corp 		Check for Price Obsolete 4.1943 Mbit 16 256KX16 1.8 V 70 ns STANDARD SRAM COMMON 1 256000 262.144 k ASYNCHRONOUS 3-STATE PARALLEL 1 V 25 µA 1.95 V 1.65 V CMOS OTHER R-PDSO-G44 Not Qualified e3 85 °C -20 °C 44 PLASTIC/EPOXY TSOP2 TSOP44,.46,32 RECTANGULAR SMALL OUTLINE, THIN PROFILE YES MATTE TIN GULL WING 800 µm DUAL 1.2 mm 18.41 mm 10.16 mm WINBOND ELECTRONICS CORP TSOP2 TSOP2-44 44 unknown 3A991.B.2.A 8542.32.00.41
W26A041B70LE
 Winbond Electronics Corp 		Check for Price Obsolete 4.1943 Mbit 16 256KX16 1.8 V 70 ns STANDARD SRAM COMMON 1 256000 262.144 k ASYNCHRONOUS 3-STATE PARALLEL 1.5 V 25 µA 1.95 V 1.65 V CMOS OTHER R-PBGA-B48 Not Qualified e1 85 °C -20 °C 48 PLASTIC/EPOXY TFBGA BGA48,6X8,30 RECTANGULAR GRID ARRAY, THIN PROFILE, FINE PITCH YES TIN SILVER COPPER BALL 750 µm BOTTOM 1.1 mm 8 mm 6 mm WINBOND ELECTRONICS CORP BGA TFBGA, BGA48,6X8,30 48 unknown 3A991.B.2.A 8542.32.00.41
W26A041H70LI
 Winbond Electronics Corp 		Check for Price Obsolete 4.1943 Mbit 16 256KX16 1.8 V 70 ns STANDARD SRAM COMMON 1 256000 262.144 k ASYNCHRONOUS 3-STATE PARALLEL 1.5 V 25 µA 1.95 V 1.65 V CMOS INDUSTRIAL R-PDSO-G44 Not Qualified e3 85 °C -40 °C 44 PLASTIC/EPOXY TSOP2 TSOP44,.46,32 RECTANGULAR SMALL OUTLINE, THIN PROFILE YES MATTE TIN GULL WING 800 µm DUAL 1.2 mm 18.41 mm 10.16 mm WINBOND ELECTRONICS CORP TSOP2 TSOP2, TSOP44,.46,32 44 unknown 3A991.B.2.A 8542.32.00.41
W26A041B70LI
 Winbond Electronics Corp 		Check for Price Obsolete 4.1943 Mbit 16 256KX16 1.8 V 70 ns STANDARD SRAM COMMON 1 256000 262.144 k ASYNCHRONOUS 3-STATE PARALLEL 1.5 V 25 µA 1.95 V 1.65 V CMOS INDUSTRIAL R-PBGA-B48 Not Qualified e1 85 °C -40 °C 48 PLASTIC/EPOXY TFBGA BGA48,6X8,30 RECTANGULAR GRID ARRAY, THIN PROFILE, FINE PITCH YES TIN SILVER COPPER BALL 750 µm BOTTOM 1.1 mm 8 mm 6 mm WINBOND ELECTRONICS CORP BGA TFBGA, BGA48,6X8,30 48 unknown 3A991.B.2.A 8542.32.00.41
W26A041H70LE
 Winbond Electronics Corp 		Check for Price Obsolete 4.1943 Mbit 16 256KX16 1.8 V 70 ns STANDARD SRAM COMMON 1 256000 262.144 k ASYNCHRONOUS 3-STATE PARALLEL 1.5 V 25 µA 1.95 V 1.65 V CMOS OTHER R-PDSO-G44 Not Qualified e3 85 °C -20 °C 44 PLASTIC/EPOXY TSOP2 TSOP44,.46,32 RECTANGULAR SMALL OUTLINE, THIN PROFILE YES MATTE TIN GULL WING 800 µm DUAL 1.2 mm 18.41 mm 10.16 mm WINBOND ELECTRONICS CORP TSOP2 TSOP2, TSOP44,.46,32 44 unknown 3A991.B.2.A 8542.32.00.41
W26A04B-70LI
 Winbond Electronics Corp 		Check for Price Obsolete 4.1943 Mbit 16 256KX16 1.8 V 70 ns STANDARD SRAM COMMON 1 256000 262.144 k ASYNCHRONOUS 3-STATE PARALLEL 1 V 25 µA 1.95 V 1.65 V CMOS INDUSTRIAL R-PBGA-B48 Not Qualified e1 85 °C -40 °C 48 PLASTIC/EPOXY TFBGA BGA48,6X8,30 RECTANGULAR GRID ARRAY, THIN PROFILE, FINE PITCH YES TIN SILVER COPPER BALL 750 µm BOTTOM 1.1 mm 8 mm 6 mm WINBOND ELECTRONICS CORP BGA TFBGA, BGA48,6X8,30 48 unknown 3A991.B.2.A 8542.32.00.41