Findchips: Parametric Search Results for w632gu6kb-12


Select Parts		Part Number

		W632GU6KB-12 Winbond Electronics Corp
		W632GU6KB12I Winbond Electronics Corp
		W632GU6KB12A Winbond Electronics Corp
		W632GU6KB12J Winbond Electronics Corp
		W632GU6KB12K Winbond Electronics Corp

			Most Relevant								Technical																		Compliance			Operating Conditions				Physical											Dimensions			Other
Composite Price	Rohs Code	Part Life Cycle Code	Memory Density	Memory Width	Organization	Supply Voltage-Nom (Vsup)	Access Time-Max	Clock Frequency-Max (fCLK)	Refresh Cycles	Access Mode	Memory IC Type	Additional Feature	I/O Type	Interleaved Burst Length	Number of Functions	Number of Ports	Number of Words Code	Number of Words	Operating Mode	Output Characteristics	Self Refresh	Sequential Burst Length	Standby Current-Max	Supply Current-Max	Supply Voltage-Max (Vsup)	Supply Voltage-Min (Vsup)	Technology	Temperature Grade	JESD-30 Code	Qualification Status	JESD-609 Code	Operating Temperature-Max	Operating Temperature-Min	Peak Reflow Temperature (Cel)	Time@Peak Reflow Temperature-Max (s)	Number of Terminals	Package Body Material	Package Code	Package Equivalence Code	Package Shape	Package Style	Surface Mount	Terminal Finish	Terminal Form	Terminal Pitch	Terminal Position	Seated Height-Max	Length	Width	Ihs Manufacturer	Part Package Code	Package Description	Pin Count	Reach Compliance Code	ECCN Code	HTS Code	Samacsys Manufacturer	Date Of Intro

$4.3947

Yes

Obsolete

2.1475 Gbit

128MX16

1.35 V

225 ps

800 MHz

8192

MULTI BANK PAGE BURST

DDR3L DRAM

AUTO/SELF REFRESH

COMMON

128000000

134.2177 M

SYNCHRONOUS

3-STATE

YES

19 mA

380 µA

1.45 V

1.283 V

CMOS

OTHER

R-PBGA-B96

Not Qualified

85 °C

NOT SPECIFIED

PLASTIC/EPOXY

TFBGA

BGA96,9X16,32

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

BALL

800 µm

BOTTOM

1.2 mm

13 mm

9 mm

WINBOND ELECTRONICS CORP

BGA

TFBGA, BGA96,9X16,32

compliant

EAR99

8542.32.00.36

Winbond

$5.4941

Yes

Active

2.1475 Gbit

128MX16

1.35 V

225 ps

800 MHz

8192

MULTI BANK PAGE BURST

DDR3L DRAM

AUTO/SELF REFRESH

COMMON

128000000

134.2177 M

SYNCHRONOUS

3-STATE

YES

19 mA

380 µA

1.45 V

1.283 V

CMOS

INDUSTRIAL

R-PBGA-B96

Not Qualified

85 °C

-40 °C

NOT SPECIFIED

PLASTIC/EPOXY

TFBGA

BGA96,9X16,32

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

BALL

800 µm

BOTTOM

1.2 mm

13 mm

9 mm

WINBOND ELECTRONICS CORP

BGA

TFBGA, BGA96,9X16,32

compliant

EAR99

8542.32.00.36

Winbond

Check for Price

Yes

Active

2.1475 Gbit

128MX16

1.35 V

225 ps

800 MHz

8192

MULTI BANK PAGE BURST

DDR3L DRAM

AUTO/SELF REFRESH

COMMON

128000000

134.2177 M

SYNCHRONOUS

3-STATE

YES

19 mA

380 µA

1.45 V

1.283 V

CMOS

INDUSTRIAL

R-PBGA-B96

Not Qualified

95 °C

-40 °C

PLASTIC/EPOXY

TFBGA

BGA96,9X16,32

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

TIN SILVER COPPER

BALL

800 µm

BOTTOM

1.2 mm

13 mm

9 mm

WINBOND ELECTRONICS CORP

BGA

9 X 13 MM, 0.80 MM PITCH, ROHS COMPLIANT, WBGA-96

compliant

EAR99

8542.32.00.36

Check for Price

Yes

Active

2.1475 Gbit

128MX16

1.35 V

MULTI BANK PAGE BURST

DDR3L DRAM

AUTO/SELF REFRESH

128000000

134.2177 M

SYNCHRONOUS

YES

1.45 V

1.283 V

CMOS

INDUSTRIAL

R-PBGA-B96

85 °C

-40 °C

NOT SPECIFIED

PLASTIC/EPOXY

TFBGA

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

BALL

800 µm

BOTTOM

1.2 mm

13 mm

9 mm

WINBOND ELECTRONICS CORP

WBGA-96

compliant

EAR99

8542.32.00.36

2017-01-11

Check for Price

Yes

Active

2.1475 Gbit

128MX16

1.35 V

225 ps

800 MHz

8192

MULTI BANK PAGE BURST

DDR3L DRAM

AUTO/SELF REFRESH

COMMON

128000000

134.2177 M

SYNCHRONOUS

3-STATE

YES

19 mA

380 µA

1.45 V

1.283 V

CMOS

INDUSTRIAL

R-PBGA-B96

Not Qualified

105 °C

-40 °C

NOT SPECIFIED

PLASTIC/EPOXY

TFBGA

BGA96,9X16,32

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

BALL

800 µm

BOTTOM

1.2 mm

13 mm

9 mm

WINBOND ELECTRONICS CORP

BGA

9 X 13 MM, 0.80 MM PITCH, ROHS COMPLIANT, WBGA-96

compliant

EAR99

8542.32.00.36

Compare

W632GU6KB-12

Winbond Electronics Corp

$4.3947

Yes

Obsolete

2.1475 Gbit

128MX16

1.35 V

225 ps

800 MHz

8192

MULTI BANK PAGE BURST

DDR3L DRAM

AUTO/SELF REFRESH

COMMON

128000000

134.2177 M

SYNCHRONOUS

3-STATE

YES

19 mA

380 µA

1.45 V

1.283 V

CMOS

OTHER

R-PBGA-B96

Not Qualified

85 °C

NOT SPECIFIED

PLASTIC/EPOXY

TFBGA

BGA96,9X16,32

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

BALL

800 µm

BOTTOM

1.2 mm

13 mm

9 mm

WINBOND ELECTRONICS CORP

BGA

TFBGA, BGA96,9X16,32

compliant

EAR99

8542.32.00.36

Winbond

W632GU6KB12I

Winbond Electronics Corp

$5.4941

Yes

Active

2.1475 Gbit

128MX16

1.35 V

225 ps

800 MHz

8192

MULTI BANK PAGE BURST

DDR3L DRAM

AUTO/SELF REFRESH

COMMON

128000000

134.2177 M

SYNCHRONOUS

3-STATE

YES

19 mA

380 µA

1.45 V

1.283 V

CMOS

INDUSTRIAL

R-PBGA-B96

Not Qualified

85 °C

-40 °C

NOT SPECIFIED

PLASTIC/EPOXY

TFBGA

BGA96,9X16,32

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

BALL

800 µm

BOTTOM

1.2 mm

13 mm

9 mm

WINBOND ELECTRONICS CORP

BGA

TFBGA, BGA96,9X16,32

compliant

EAR99

8542.32.00.36

Winbond

W632GU6KB12A

Winbond Electronics Corp

Check for Price

Yes

Active

2.1475 Gbit

128MX16

1.35 V

225 ps

800 MHz

8192

MULTI BANK PAGE BURST

DDR3L DRAM

AUTO/SELF REFRESH

COMMON

128000000

134.2177 M

SYNCHRONOUS

3-STATE

YES

19 mA

380 µA

1.45 V

1.283 V

CMOS

INDUSTRIAL

R-PBGA-B96

Not Qualified

95 °C

-40 °C

PLASTIC/EPOXY

TFBGA

BGA96,9X16,32

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

TIN SILVER COPPER

BALL

800 µm

BOTTOM

1.2 mm

13 mm

9 mm

WINBOND ELECTRONICS CORP

BGA

9 X 13 MM, 0.80 MM PITCH, ROHS COMPLIANT, WBGA-96

compliant

EAR99

8542.32.00.36

W632GU6KB12J

Winbond Electronics Corp

Check for Price

Yes

Active

2.1475 Gbit

128MX16

1.35 V

MULTI BANK PAGE BURST

DDR3L DRAM

AUTO/SELF REFRESH

128000000

134.2177 M

SYNCHRONOUS

YES

1.45 V

1.283 V

CMOS

INDUSTRIAL

R-PBGA-B96

85 °C

-40 °C

NOT SPECIFIED

PLASTIC/EPOXY

TFBGA

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

BALL

800 µm

BOTTOM

1.2 mm

13 mm

9 mm

WINBOND ELECTRONICS CORP

WBGA-96

compliant

EAR99

8542.32.00.36

2017-01-11

W632GU6KB12K

Winbond Electronics Corp

Check for Price

Yes

Active

2.1475 Gbit

128MX16

1.35 V

225 ps

800 MHz

8192

MULTI BANK PAGE BURST

DDR3L DRAM

AUTO/SELF REFRESH

COMMON

128000000

134.2177 M

SYNCHRONOUS

3-STATE

YES

19 mA

380 µA

1.45 V

1.283 V

CMOS

INDUSTRIAL

R-PBGA-B96

Not Qualified

105 °C

-40 °C

NOT SPECIFIED

PLASTIC/EPOXY

TFBGA

BGA96,9X16,32

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

BALL

800 µm

BOTTOM

1.2 mm

13 mm

9 mm

WINBOND ELECTRONICS CORP

BGA

9 X 13 MM, 0.80 MM PITCH, ROHS COMPLIANT, WBGA-96

compliant

EAR99

8542.32.00.36

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