Parametric results for: w979h6kb under DRAMs

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Manufacturer Part Number: w979h6kb
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W979H6KBVX2E
Winbond Electronics Corp
$5.5095 Yes Not Recommended 536.8709 Mbit 16 32MX16 1.2 V FOUR BANK PAGE BURST LPDDR2 DRAM AUTO/SELF REFRESH; IT ALSO REQUIRES 1.8V NOM 1 1 32000000 33.5544 M SYNCHRONOUS YES 1.3 V 1.14 V CMOS R-PBGA-B134 NOT SPECIFIED NOT SPECIFIED 134 PLASTIC/EPOXY VFBGA RECTANGULAR GRID ARRAY, VERY THIN PROFILE, FINE PITCH YES BALL 650 µm BOTTOM 1 mm 11.5 mm 10 mm WINBOND ELECTRONICS CORP VFBGA, compliant EAR99 8542.32.00.28
W979H6KBQX2I
Winbond Electronics Corp
$6.8857 Yes Active 536.8709 Mbit 16 32MX16 1.2 V FOUR BANK PAGE BURST DDR DRAM AUTO/SELF REFRESH; IT ALSO REQUIRES 1.8V NOM 1 1 32000000 33.5544 M SYNCHRONOUS YES 1.3 V 1.14 V CMOS INDUSTRIAL S-PBGA-B168 85 °C -40 °C NOT SPECIFIED NOT SPECIFIED 168 PLASTIC/EPOXY VFBGA SQUARE GRID ARRAY, VERY THIN PROFILE, FINE PITCH YES BALL 500 µm BOTTOM 800 µm 12 mm 12 mm WINBOND ELECTRONICS CORP WFBGA-168 compliant EAR99 8542.32.00.28
W979H6KBQX2E
Winbond Electronics Corp
$6.8857 Yes Active 536.8709 Mbit 16 32MX16 1.2 V FOUR BANK PAGE BURST LPDDR2 DRAM AUTO/SELF REFRESH; IT ALSO REQUIRES 1.8V NOM 1 1 32000000 33.5544 M SYNCHRONOUS YES 1.3 V 1.14 V CMOS S-PBGA-B168 NOT SPECIFIED NOT SPECIFIED 168 PLASTIC/EPOXY VFBGA SQUARE GRID ARRAY, VERY THIN PROFILE, FINE PITCH YES BALL 500 µm BOTTOM 800 µm 12 mm 12 mm WINBOND ELECTRONICS CORP VFBGA, compliant EAR99 8542.32.00.28
W979H6KBVX2I
Winbond Electronics Corp
$6.9100 Yes Not Recommended 536.8709 Mbit 16 32MX16 1.2 V FOUR BANK PAGE BURST LPDDR2 DRAM AUTO/SELF REFRESH; IT ALSO REQUIRES 1.8V NOM 1 1 32000000 33.5544 M SYNCHRONOUS YES 1.3 V 1.14 V CMOS INDUSTRIAL R-PBGA-B134 85 °C -40 °C NOT SPECIFIED NOT SPECIFIED 134 PLASTIC/EPOXY VFBGA RECTANGULAR GRID ARRAY, VERY THIN PROFILE, FINE PITCH YES BALL 650 µm BOTTOM 1 mm 11.5 mm 10 mm WINBOND ELECTRONICS CORP VFBGA-134 compliant EAR99 8542.32.00.28 Winbond
W979H6KBQX1I
Winbond Electronics Corp
Check for Price Yes Active 536.8709 Mbit 16 32MX16 1.2 V FOUR BANK PAGE BURST LPDDR2 DRAM AUTO/SELF REFRESH; IT ALSO REQUIRES 1.8V NOM 1 1 32000000 33.5544 M SYNCHRONOUS YES 1.3 V 1.14 V CMOS INDUSTRIAL S-PBGA-B168 85 °C -40 °C NOT SPECIFIED NOT SPECIFIED 168 PLASTIC/EPOXY VFBGA SQUARE GRID ARRAY, VERY THIN PROFILE, FINE PITCH YES BALL 500 µm BOTTOM 800 µm 12 mm 12 mm WINBOND ELECTRONICS CORP VFBGA, compliant EAR99 8542.32.00.28 Winbond
W979H6KBVX1I
Winbond Electronics Corp
Check for Price Yes Not Recommended 536.8709 Mbit 16 32MX16 1.2 V FOUR BANK PAGE BURST LPDDR2 DRAM AUTO/SELF REFRESH; IT ALSO REQUIRES 1.8V NOM 1 1 32000000 33.5544 M SYNCHRONOUS YES 1.3 V 1.14 V CMOS INDUSTRIAL R-PBGA-B134 85 °C -40 °C NOT SPECIFIED NOT SPECIFIED 134 PLASTIC/EPOXY VFBGA RECTANGULAR GRID ARRAY, VERY THIN PROFILE, FINE PITCH YES BALL 650 µm BOTTOM 1 mm 11.5 mm 10 mm WINBOND ELECTRONICS CORP VFBGA, compliant EAR99 8542.32.00.28
W979H6KBQX1E
Winbond Electronics Corp
Check for Price Yes Active 536.8709 Mbit 16 32MX16 1.2 V FOUR BANK PAGE BURST LPDDR2 DRAM AUTO/SELF REFRESH; IT ALSO REQUIRES 1.8V NOM 1 1 32000000 33.5544 M SYNCHRONOUS YES 1.3 V 1.14 V CMOS S-PBGA-B168 NOT SPECIFIED NOT SPECIFIED 168 PLASTIC/EPOXY VFBGA SQUARE GRID ARRAY, VERY THIN PROFILE, FINE PITCH YES BALL 500 µm BOTTOM 800 µm 12 mm 12 mm WINBOND ELECTRONICS CORP VFBGA, compliant EAR99 8542.32.00.28
W979H6KBVX1E
Winbond Electronics Corp
Check for Price Yes Not Recommended 536.8709 Mbit 16 32MX16 1.2 V FOUR BANK PAGE BURST LPDDR2 DRAM AUTO/SELF REFRESH; IT ALSO REQUIRES 1.8V NOM 1 1 32000000 33.5544 M SYNCHRONOUS YES 1.3 V 1.14 V CMOS R-PBGA-B134 NOT SPECIFIED NOT SPECIFIED 134 PLASTIC/EPOXY VFBGA RECTANGULAR GRID ARRAY, VERY THIN PROFILE, FINE PITCH YES BALL 650 µm BOTTOM 1 mm 11.5 mm 10 mm WINBOND ELECTRONICS CORP VFBGA, compliant EAR99 8542.32.00.28