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X28C010NMB-15
Rochester Electronics LLC
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Check for Price | No | No | Active | 1.0486 Mbit | 8 | 128KX8 | 5 V | 150 ns | EEPROM | 1 | 128000 | 131.072 k | ASYNCHRONOUS | PARALLEL | 5 V | 5.5 V | 4.5 V | CMOS | MILITARY | 10 ms | R-CQCC-N32 | COMMERCIAL | e0 | NOT APPLICABLE | 125 °C | -55 °C | NOT SPECIFIED | MIL-STD-883 | NOT SPECIFIED | 32 | CERAMIC, METAL-SEALED COFIRED | QCCN | RECTANGULAR | CHIP CARRIER | YES | TIN LEAD | NO LEAD | 1.27 mm | QUAD | 3.05 mm | 13.97 mm | 11.43 mm | ROCHESTER ELECTRONICS LLC | QFJ | CERAMIC, LCC-32 | 32 | unknown | |||||||||||||||
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X28C010NMB-15
Xicor Inc
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Check for Price | No | Transferred | 1.0486 Mbit | 8 | 128KX8 | 5 V | 150 ns | EEPROM | NO | YES | 1 | 128000 | 131.072 k | ASYNCHRONOUS | 3-STATE | 256 words | PARALLEL | 5 V | 500 µA | 50 µA | 5.5 V | 4.5 V | CMOS | MILITARY | YES | 10 ms | R-CQCC-N32 | Not Qualified | e0 | 125 °C | -55 °C | 38535Q/M;38534H;883B | 32 | CERAMIC, METAL-SEALED COFIRED | QCCN | LCC32,.45X.7 | RECTANGULAR | CHIP CARRIER | YES | Tin/Lead (Sn/Pb) | NO LEAD | 1.27 mm | QUAD | 3.048 mm | 17.78 mm | 11.43 mm | XICOR INC | CERAMIC, EXTENDED, LCC-32 | unknown | |||||||||||||
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X28C010NMB-15T1
Intersil Corporation
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Check for Price | No | No | Obsolete | 1.0486 Mbit | 8 | 128KX8 | 5 V | 150 ns | EEPROM | 1 | 128000 | 131.072 k | ASYNCHRONOUS | PARALLEL | 5 V | 5.5 V | 4.5 V | CMOS | MILITARY | 10 ms | R-CQCC-N32 | Not Qualified | 125 °C | -55 °C | NOT SPECIFIED | NOT SPECIFIED | 32 | CERAMIC, METAL-SEALED COFIRED | QCCN | RECTANGULAR | CHIP CARRIER | YES | NO LEAD | 1.27 mm | QUAD | 3.048 mm | 17.78 mm | 11.43 mm | INTERSIL CORP | QFJ | QCCN, | 32 | compliant | 3A001.A.2.C | 8542.32.00.51 | |||||||||||||||||
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X28C010NMB-15T1
Xicor Inc
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Check for Price | Transferred | 1.0486 Mbit | 8 | 128KX8 | 5 V | 150 ns | EEPROM | 1 | 128000 | 131.072 k | ASYNCHRONOUS | 3-STATE | PARALLEL | 5 V | 5.5 V | 4.5 V | CMOS | MILITARY | 10 ms | R-CQCC-N32 | Not Qualified | 125 °C | -55 °C | 32 | CERAMIC, METAL-SEALED COFIRED | QCCN | RECTANGULAR | CHIP CARRIER | YES | NO LEAD | 1.27 mm | QUAD | 3.048 mm | 17.78 mm | 11.43 mm | XICOR INC | CERAMIC, EXTENDED, LCC-32 | unknown | ||||||||||||||||||||||||
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X28C010NMB-15
Renesas Electronics Corporation
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Check for Price | Obsolete | 1.0486 Mbit | 8 | 128KX8 | 5 V | 150 ns | EEPROM | YES | 100 | 100000 Write/Erase Cycles | 1 | 128000 | 131.072 k | ASYNCHRONOUS | 3-STATE | 256 words | PARALLEL | 5 V | NO | 500 µA | 50 µA | 5.5 V | 4.5 V | CMOS | YES | 10 ms | R-CQCC-N32 | 125 °C | -55 °C | MIL-STD-883 | 32 | CERAMIC, METAL-SEALED COFIRED | QCCN | LCC32,.45X.7 | RECTANGULAR | CHIP CARRIER | YES | NO LEAD | 1.27 mm | QUAD | 3.048 mm | 17.78 mm | 11.43 mm | RENESAS ELECTRONICS CORP | , | compliant | 3A001.A.2.C | 8542.32.00.51 | ||||||||||||||
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X28C010NMB-15C7309
Intersil Corporation
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Check for Price | No | Obsolete | 1.0486 Mbit | 8 | 128KX8 | 5 V | 150 ns | EEPROM | NO | YES | 1 | 128000 | 131.072 k | ASYNCHRONOUS | 256 words | PARALLEL | 5 V | 500 µA | 50 µA | 5.5 V | 4.5 V | CMOS | MILITARY | YES | 10 ms | R-CQCC-N32 | Not Qualified | e0 | 125 °C | -55 °C | MIL-STD-883 | 32 | CERAMIC, METAL-SEALED COFIRED | QCCN | LCC32,.45X.7 | RECTANGULAR | CHIP CARRIER | YES | TIN LEAD | NO LEAD | 1.27 mm | QUAD | 3.05 mm | 13.97 mm | 11.43 mm | INTERSIL CORP | QFJ | CERAMIC, LCC-32 | 32 | not_compliant | 3A001.A.2.C | 8542.32.00.51 | ||||||||||
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X28C010NMB-15
Intersil Corporation
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Check for Price | No | Transferred | 1.0486 Mbit | 8 | 128KX8 | 5 V | 150 ns | EEPROM | NO | YES | 1 | 128000 | 131.072 k | ASYNCHRONOUS | 3-STATE | 256 words | PARALLEL | 5 V | 500 µA | 50 µA | 5.5 V | 4.5 V | CMOS | MILITARY | YES | 10 ms | R-CQCC-N32 | Not Qualified | e0 | 125 °C | -55 °C | 38535Q/M;38534H;883B | 32 | CERAMIC, METAL-SEALED COFIRED | QCCN | LCC32,.45X.7 | RECTANGULAR | CHIP CARRIER | YES | Tin/Lead (Sn/Pb) | NO LEAD | 1.27 mm | QUAD | 3.048 mm | 17.78 mm | 11.43 mm | INTERSIL CORP | QFJ | LCC-32 | 32 | not_compliant | 3A001.A.2.C | 8542.32.00.51 |