Part # | Manufacturer | Description | Stock | Price | Buy | |
---|---|---|---|---|---|---|
374724B60024G
DISTI #
41R3499
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Boyd Corporation | Heat Sink, Thermal Resistance:15.3°C/W, Packages Cooled:Bga, External Width - Metric:35Mm, External Height - Metric:17.78Mm, External Length - Metric:35.6Mm, External Diameter - Metric:-, Heat Sink Material:Aluminum, Product Range:- Rohs Compliant: Yes |Boyd 374724B60024G RoHS: Compliant Min Qty: 840 Package Multiple: 1 Date Code: 0 Container: Bulk 374724B60024G Part Details | 0 |
|
$3.7100 | Buy Now 374724B60024G Part Details |
Part # | Manufacturer | Description | Stock | Price | Buy | |
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374724B60024G
DISTI #
HS326-ND
|
BOYD Laconia | HEATSINK BGA W/O SOLDER ANCHORS Min Qty: 1 Lead time: 14 Weeks Container: Bulk 374724B60024G Part Details |
865 In Stock |
|
$4.6425 / $5.7200 | Buy Now 374724B60024G Part Details |
Part # | Manufacturer | Description | Stock | Price | Buy | |
---|---|---|---|---|---|---|
374724B60024G
DISTI #
532-374724B60024
|
BOYD Laconia | Heat Sinks Heat Sink with BGA Solder Anchor, 35x35x18mm, Black, 2 Anchors, IC Pkg=35 x 35 RoHS: Compliant 374724B60024G Part Details | 1049 |
|
$3.7100 / $5.4400 | Buy Now 374724B60024G Part Details |
Part # | Manufacturer | Description | Stock | Price | Buy | |
---|---|---|---|---|---|---|
374724B60024G
DISTI #
75020158
|
Boyd Corporation | Extruded Heatsink, 374724B60024G | Boyd 374724B60024G RoHS: Compliant Min Qty: 840 Package Multiple: 1 Lead time: 6 Weeks, 0 Days Container: Bulk 374724B60024G Part Details | 0 |
|
$4.5820 | RFQ 374724B60024G Part Details |
Part # | Manufacturer | Description | Stock | Price | Buy | |
---|---|---|---|---|---|---|
BOYD Laconia | Heat Sink Passive BGA/FPGA Pin Array Adhesive Aluminum 15.3°C/W Black Anodized RoHS: Compliant 374724B60024G Part Details |
1850 In Stock |
|
$3.5100 / $5.6400 | Buy Now 374724B60024G Part Details |
Part # | Manufacturer | Description | Stock | Price | Buy | |
---|---|---|---|---|---|---|
BOYD Laconia | 374724B60024G Part Details | 137 | RFQ 374724B60024G Part Details | |||
BOYD Laconia | 374724B60024G Part Details | 70 | RFQ 374724B60024G Part Details |
Part # | Manufacturer | Description | Stock | Price | Buy | |
---|---|---|---|---|---|---|
374724B60024G
DISTI #
374724B60024G
|
Boyd Corporation | Heatsink: extruded, grilled, BGA, black, L: 35mm, W: 35mm, H: 18mm Min Qty: 168 374724B60024G Part Details | 0 |
|
$4.0900 | RFQ 374724B60024G Part Details |
Part # | Manufacturer | Description | Stock | Price | Buy | |
---|---|---|---|---|---|---|
BOYD Laconia | Heat Sink Passive BGA/FPGA Pin Array Adhesive Aluminum 15.3°C/W Black Anodized RoHS: Compliant 374724B60024G Part Details |
1850 In Stock |
|
$3.5100 / $5.6400 | Buy Now 374724B60024G Part Details |
Part # | Manufacturer | Description | Stock | Price | Buy | |
---|---|---|---|---|---|---|
374724B60024G
DISTI #
306220
|
Boyd Corporation | Heat Sink Passive BGA Pin Array Solder Anchor Black Anodized (Alt: 306220) RoHS: Compliant Min Qty: 840 Package Multiple: 168 Lead time: 18 Weeks, 0 Days 374724B60024G Part Details | Abacus - 2016 | Buy Now 374724B60024G Part Details |